
David Vu
Examiner (ID: 16348)
| Most Active Art Unit | 2818 |
| Art Unit(s) | 2818 |
| Total Applications | 1996 |
| Issued Applications | 1682 |
| Pending Applications | 76 |
| Abandoned Applications | 267 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
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[patent_title] => 'Semiconductor device, method of manufacturing the same, and method of evaluating semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/003100
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/956865 | Method of Fabricating Flash Memory Device | Dec 13, 2007 | Abandoned |
Array
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[patent_title] => 'Semiconductor device and method of fabricating the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/002096 | Semiconductor device and method of fabricating the same | Dec 13, 2007 | Issued |
Array
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[id] => 4890713
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[patent_issue_date] => 2008-05-01
[patent_title] => 'Semiconductor device and semiconductor device manufacturing method'
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[patent_app_number] => 12/000236
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/000236 | Semiconductor device and semiconductor device manufacturing method | Dec 10, 2007 | Issued |
Array
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[patent_title] => 'UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM COPPER ALLOY'
[patent_app_type] => utility
[patent_app_number] => 11/946231
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[patent_app_date] => 2007-11-28
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/946231 | UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM COPPER ALLOY | Nov 27, 2007 | Abandoned |
Array
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[patent_title] => 'Manufacturing method for ferroelectric memory device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/998176 | Manufacturing method for ferroelectric memory device | Nov 27, 2007 | Issued |
Array
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[id] => 4879846
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[patent_issue_date] => 2008-06-26
[patent_title] => 'METHOD FOR FABRICATING FLASH MEMORY DEVICE'
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[patent_app_number] => 11/945100
[patent_app_country] => US
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Array
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[patent_issue_date] => 2008-10-30
[patent_title] => 'SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICAL CONNECTION AND METHOD OF FORMING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/943820
[patent_app_country] => US
[patent_app_date] => 2007-11-21
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Array
(
[id] => 5278711
[patent_doc_number] => 20090130843
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[patent_issue_date] => 2009-05-21
[patent_title] => 'METHOD OF FORMING LOW-RESISTIVITY RECESSED FEATURES IN COPPER METALLIZATION'
[patent_app_type] => utility
[patent_app_number] => 11/864960
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[pdf_file] => publications/A1/0130/20090130843.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/864960 | Method of forming low-resistivity recessed features in copper metallization | Nov 19, 2007 | Issued |
Array
(
[id] => 4719517
[patent_doc_number] => 20080242040
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[patent_issue_date] => 2008-10-02
[patent_title] => 'METHOD OF FORMING A SEMICONDUCTOR STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 11/942400
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/942400 | Method of forming a semiconductor structure | Nov 18, 2007 | Issued |
Array
(
[id] => 4829320
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Array
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Array
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Array
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[id] => 5262264
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/934040 | High-mobility trench MOSFETs | Oct 31, 2007 | Issued |
Array
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Array
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Array
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Array
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