De'maris R Brown
Examiner (ID: 4353)
Most Active Art Unit | 2437 |
Art Unit(s) | CSDE, 2437 |
Total Applications | 45 |
Issued Applications | 29 |
Pending Applications | 0 |
Abandoned Applications | 16 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 6202499
[patent_doc_number] => 20110065285
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-03-17
[patent_title] => 'DIELECTRIC LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/949739
[patent_app_country] => US
[patent_app_date] => 2010-11-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 2881
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0065/20110065285.pdf
[firstpage_image] =>[orig_patent_app_number] => 12949739
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/949739 | Dielectric layer structure and manufacturing method thereof | Nov 17, 2010 | Issued |
Array
(
[id] => 9010014
[patent_doc_number] => 08525316
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-09-03
[patent_title] => 'Eutectic flow containment in a semiconductor fabrication process'
[patent_app_type] => utility
[patent_app_number] => 12/914859
[patent_app_country] => US
[patent_app_date] => 2010-10-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 16
[patent_no_of_words] => 4112
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12914859
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/914859 | Eutectic flow containment in a semiconductor fabrication process | Oct 27, 2010 | Issued |
Array
(
[id] => 8159400
[patent_doc_number] => 20120100685
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-04-26
[patent_title] => 'LOCALIZED IMPLANT INTO ACTIVE REGION FOR ENHANCED STRESS'
[patent_app_type] => utility
[patent_app_number] => 12/908306
[patent_app_country] => US
[patent_app_date] => 2010-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2053
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0100/20120100685.pdf
[firstpage_image] =>[orig_patent_app_number] => 12908306
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/908306 | Localized implant into active region for enhanced stress | Oct 19, 2010 | Issued |
Array
(
[id] => 8139789
[patent_doc_number] => 20120094450
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-04-19
[patent_title] => 'MANUFACTURING METHOD OF MULTI-LEVEL CELL NOR FLASH MEMORY'
[patent_app_type] => utility
[patent_app_number] => 12/907077
[patent_app_country] => US
[patent_app_date] => 2010-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2084
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0094/20120094450.pdf
[firstpage_image] =>[orig_patent_app_number] => 12907077
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/907077 | MANUFACTURING METHOD OF MULTI-LEVEL CELL NOR FLASH MEMORY | Oct 18, 2010 | Abandoned |
Array
(
[id] => 8435460
[patent_doc_number] => 08283229
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-10-09
[patent_title] => 'Methods of fabricating vertical channel transistors'
[patent_app_type] => utility
[patent_app_number] => 12/906630
[patent_app_country] => US
[patent_app_date] => 2010-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 68
[patent_figures_cnt] => 110
[patent_no_of_words] => 13215
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 113
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12906630
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/906630 | Methods of fabricating vertical channel transistors | Oct 17, 2010 | Issued |
Array
(
[id] => 8875685
[patent_doc_number] => 08470650
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-06-25
[patent_title] => 'Semiconductor device and manufacturing method for the same'
[patent_app_type] => utility
[patent_app_number] => 12/906553
[patent_app_country] => US
[patent_app_date] => 2010-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 30
[patent_figures_cnt] => 71
[patent_no_of_words] => 37471
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12906553
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/906553 | Semiconductor device and manufacturing method for the same | Oct 17, 2010 | Issued |
Array
(
[id] => 8139827
[patent_doc_number] => 20120094465
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-04-19
[patent_title] => 'INTEGRATED PLANAR AND MULTIPLE GATE FETS'
[patent_app_type] => utility
[patent_app_number] => 12/905575
[patent_app_country] => US
[patent_app_date] => 2010-10-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2060
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0094/20120094465.pdf
[firstpage_image] =>[orig_patent_app_number] => 12905575
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/905575 | Integrated planar and multiple gate FETs | Oct 14, 2010 | Issued |
Array
(
[id] => 7784301
[patent_doc_number] => 20120045857
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-02-23
[patent_title] => 'METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/905258
[patent_app_country] => US
[patent_app_date] => 2010-10-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 4159
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0045/20120045857.pdf
[firstpage_image] =>[orig_patent_app_number] => 12905258
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/905258 | Method for manufacturing light emitting device | Oct 14, 2010 | Issued |
Array
(
[id] => 10858230
[patent_doc_number] => 08884434
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-11-11
[patent_title] => 'Method and system for improving reliability of a semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/890721
[patent_app_country] => US
[patent_app_date] => 2010-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3972
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12890721
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890721 | Method and system for improving reliability of a semiconductor device | Sep 26, 2010 | Issued |
Array
(
[id] => 8690454
[patent_doc_number] => 08389983
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-03-05
[patent_title] => 'Organic light emitting apparatus and method of manufacturing organic light emitting apparatus'
[patent_app_type] => utility
[patent_app_number] => 12/890104
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 7
[patent_no_of_words] => 5278
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 167
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12890104
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890104 | Organic light emitting apparatus and method of manufacturing organic light emitting apparatus | Sep 23, 2010 | Issued |
Array
(
[id] => 6208362
[patent_doc_number] => 20110133285
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-06-09
[patent_title] => 'SRAM Structure with FinFETs Having Multiple Fins'
[patent_app_type] => utility
[patent_app_number] => 12/890132
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3414
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0133/20110133285.pdf
[firstpage_image] =>[orig_patent_app_number] => 12890132
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890132 | SRAM structure with FinFETs having multiple fins | Sep 23, 2010 | Issued |
Array
(
[id] => 6027017
[patent_doc_number] => 20110079878
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-04-07
[patent_title] => 'FERROELECTRIC CAPACITOR ENCAPSULATED WITH A HYDROGEN BARRIER'
[patent_app_type] => utility
[patent_app_number] => 12/890219
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 2505
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0079/20110079878.pdf
[firstpage_image] =>[orig_patent_app_number] => 12890219
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890219 | FERROELECTRIC CAPACITOR ENCAPSULATED WITH A HYDROGEN BARRIER | Sep 23, 2010 | Abandoned |
Array
(
[id] => 8049639
[patent_doc_number] => 20120074562
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-29
[patent_title] => 'Three-Dimensional Integrated Circuit Structure with Low-K Materials'
[patent_app_type] => utility
[patent_app_number] => 12/890094
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 2046
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0074/20120074562.pdf
[firstpage_image] =>[orig_patent_app_number] => 12890094
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890094 | Three-Dimensional Integrated Circuit Structure with Low-K Materials | Sep 23, 2010 | Abandoned |
Array
(
[id] => 8049641
[patent_doc_number] => 20120074559
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-29
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE USING THROUGH SUBSTRATE VIAS TO GROUND LID'
[patent_app_type] => utility
[patent_app_number] => 12/889586
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2495
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0074/20120074559.pdf
[firstpage_image] =>[orig_patent_app_number] => 12889586
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/889586 | INTEGRATED CIRCUIT PACKAGE USING THROUGH SUBSTRATE VIAS TO GROUND LID | Sep 23, 2010 | Abandoned |
Array
(
[id] => 9324046
[patent_doc_number] => 08659072
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-02-25
[patent_title] => 'Series FinFET implementation schemes'
[patent_app_type] => utility
[patent_app_number] => 12/890084
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 14
[patent_no_of_words] => 2172
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 127
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12890084
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890084 | Series FinFET implementation schemes | Sep 23, 2010 | Issued |
Array
(
[id] => 8049707
[patent_doc_number] => 20120074581
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-29
[patent_title] => 'DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER SUBSTRATES INCLUDING EMBEDDED-DICE, AND PROCESSES OF FORMING SAME'
[patent_app_type] => utility
[patent_app_number] => 12/890082
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 10885
[patent_no_of_claims] => 42
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0074/20120074581.pdf
[firstpage_image] =>[orig_patent_app_number] => 12890082
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890082 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | Sep 23, 2010 | Issued |
Array
(
[id] => 6026757
[patent_doc_number] => 20110079783
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-04-07
[patent_title] => 'ARRAY SUBSTRATE FOR ORGANIC ELECTROLUMINESCENT DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/890112
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 9331
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0079/20110079783.pdf
[firstpage_image] =>[orig_patent_app_number] => 12890112
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890112 | Array substrate for organic electroluminescent device | Sep 23, 2010 | Issued |
Array
(
[id] => 8049713
[patent_doc_number] => 20120074588
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-29
[patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD OF MANUFACTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/890338
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 5209
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0074/20120074588.pdf
[firstpage_image] =>[orig_patent_app_number] => 12890338
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890338 | Integrated circuit packaging system with warpage control and method of manufacture thereof | Sep 23, 2010 | Issued |
Array
(
[id] => 6075378
[patent_doc_number] => 20110140268
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-06-16
[patent_title] => 'HIGH-DENSITY INTER-PACKAGE CONNECTIONS FOR ULTRA-THIN PACKAGE-ON-PACKAGE STRUCTURES, AND PROCESSES OF FORMING SAME'
[patent_app_type] => utility
[patent_app_number] => 12/890345
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 6290
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0140/20110140268.pdf
[firstpage_image] =>[orig_patent_app_number] => 12890345
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890345 | High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same | Sep 23, 2010 | Issued |
Array
(
[id] => 8049653
[patent_doc_number] => 20120074560
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-03-29
[patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD OF MANUFACTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/890161
[patent_app_country] => US
[patent_app_date] => 2010-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 5389
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0074/20120074560.pdf
[firstpage_image] =>[orig_patent_app_number] => 12890161
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/890161 | Integrated circuit packaging system with warpage control and method of manufacture thereof | Sep 23, 2010 | Issued |