Dennis Y. Myint

Array ( [id] => 5346251 [patent_doc_number] => 20090001612 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-01 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION' [patent_app_type] => utility [patent_app_number] => 11/768640 [patent_app_country] => US [patent_app_date] => 2007-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 8593 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20090001612.pdf [firstpage_image] =>[orig_patent_app_number] => 11768640 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4574864 [patent_doc_number] => 07859039 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-28 [patent_title] => 'X-shaped semiconductor capacitor structure' [patent_app_type] => utility [patent_app_number] => 11/760785 [patent_app_country] => US [patent_app_date] => 2007-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4206 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/859/07859039.pdf [firstpage_image] =>[orig_patent_app_number] => 11760785 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5063159 [patent_doc_number] => 20070224799 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-27 [patent_title] => 'System for making a semiconductor device using bump material including liquid' [patent_app_type] => utility [patent_app_number] => 11/807100 [patent_app_country] => US [patent_app_date] => 2007-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4016 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0224/20070224799.pdf [firstpage_image] =>[orig_patent_app_number] => 11807100 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4789552 [patent_doc_number] => 20080290525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-11-27 [patent_title] => 'SILICON-ON-INSULATOR STRUCTURES FOR THROUGH VIA IN SILICON CARRIERS' [patent_app_type] => utility [patent_app_number] => 11/751105 [patent_app_country] => US [patent_app_date] => 2007-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4482 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0290/20080290525.pdf [firstpage_image] =>[orig_patent_app_number] => 11751105 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4743427 [patent_doc_number] => 20080088028 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'Substrate and manufacturing method of package structure' [patent_app_type] => utility [patent_app_number] => 11/790030 [patent_app_country] => US [patent_app_date] => 2007-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 3671 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0088/20080088028.pdf [firstpage_image] =>[orig_patent_app_number] => 11790030 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5210573 [patent_doc_number] => 20070249157 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-25 [patent_title] => 'Semiconductor device and method for manufacturing same' [patent_app_type] => utility [patent_app_number] => 11/785820 [patent_app_country] => US [patent_app_date] => 2007-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 4284 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0249/20070249157.pdf [firstpage_image] =>[orig_patent_app_number] => 11785820 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13529 [patent_doc_number] => 07807563 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-10-05 [patent_title] => 'Method for manufacturing a layer arrangement and layer arrangement' [patent_app_type] => utility [patent_app_number] => 11/786770 [patent_app_country] => US [patent_app_date] => 2007-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 18 [patent_no_of_words] => 7949 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/807/07807563.pdf [firstpage_image] =>[orig_patent_app_number] => 11786770 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5123618 [patent_doc_number] => 20070235888 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-11 [patent_title] => 'FILM TYPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/697540 [patent_app_country] => US [patent_app_date] => 2007-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2833 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0235/20070235888.pdf [firstpage_image] =>[orig_patent_app_number] => 11697540 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4648794 [patent_doc_number] => 20080036049 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-14 [patent_title] => 'STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/696750 [patent_app_country] => US [patent_app_date] => 2007-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2000 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20080036049.pdf [firstpage_image] =>[orig_patent_app_number] => 11696750 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5124620 [patent_doc_number] => 20070236891 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-11 [patent_title] => 'Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/730360 [patent_app_country] => US [patent_app_date] => 2007-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 9627 [patent_no_of_claims] => 38 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0236/20070236891.pdf [firstpage_image] =>[orig_patent_app_number] => 11730360 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4462444 [patent_doc_number] => 07880300 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-01 [patent_title] => 'Semiconductor chip comprising a metal coating structure and associated production method' [patent_app_type] => utility [patent_app_number] => 11/692530 [patent_app_country] => US [patent_app_date] => 2007-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 4915 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/880/07880300.pdf [firstpage_image] =>[orig_patent_app_number] => 11692530 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4462419 [patent_doc_number] => 07880288 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-01 [patent_title] => 'Semiconductor module with semiconductor chips and method for producing it' [patent_app_type] => utility [patent_app_number] => 11/692020 [patent_app_country] => US [patent_app_date] => 2007-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 5396 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 263 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/880/07880288.pdf [firstpage_image] =>[orig_patent_app_number] => 11692020 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4719025 [patent_doc_number] => 20080241547 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-02 [patent_title] => 'METHODS OF LASER SURFACE MODIFICATION OF CERAMIC PACKAGES FOR UNDERFILL SPREAD CONTROL AND STRUCTURES FORMED THEREBY' [patent_app_type] => utility [patent_app_number] => 11/691390 [patent_app_country] => US [patent_app_date] => 2007-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1466 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0241/20080241547.pdf [firstpage_image] =>[orig_patent_app_number] => 11691390 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4737265 [patent_doc_number] => 20080230917 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-25 [patent_title] => ' METHOD OF FABRICATING TWO-STEP SELF-ALIGNED CONTACT' [patent_app_type] => utility [patent_app_number] => 11/686740 [patent_app_country] => US [patent_app_date] => 2007-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4751 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0230/20080230917.pdf [firstpage_image] =>[orig_patent_app_number] => 11686740 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4695591 [patent_doc_number] => 20080217775 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-11 [patent_title] => 'Method of forming contact plugs for eliminating tungsten seam issue' [patent_app_type] => utility [patent_app_number] => 11/714770 [patent_app_country] => US [patent_app_date] => 2007-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2128 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0217/20080217775.pdf [firstpage_image] =>[orig_patent_app_number] => 11714770 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5196771 [patent_doc_number] => 20070296089 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-27 [patent_title] => 'Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby' [patent_app_type] => utility [patent_app_number] => 11/714010 [patent_app_country] => US [patent_app_date] => 2007-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2817 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0296/20070296089.pdf [firstpage_image] =>[orig_patent_app_number] => 11714010 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8435982 [patent_doc_number] => 08283753 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-09 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/712910 [patent_app_country] => US [patent_app_date] => 2007-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 24 [patent_no_of_words] => 10102 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11712910 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5008180 [patent_doc_number] => 20070278657 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-06 [patent_title] => 'Chip stack, method of fabrication thereof, and semiconductor package having the same' [patent_app_type] => utility [patent_app_number] => 11/710490 [patent_app_country] => US [patent_app_date] => 2007-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 7690 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0278/20070278657.pdf [firstpage_image] =>[orig_patent_app_number] => 11710490 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5256818 [patent_doc_number] => 20070210450 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-13 [patent_title] => 'Method of forming a bump and a connector structure having the bump' [patent_app_type] => utility [patent_app_number] => 11/708496 [patent_app_country] => US [patent_app_date] => 2007-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6070 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0210/20070210450.pdf [firstpage_image] =>[orig_patent_app_number] => 11708496 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 152773 [patent_doc_number] => 07679167 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-03-16 [patent_title] => 'Electronic assembly for image sensor device and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 11/707110 [patent_app_country] => US [patent_app_date] => 2007-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2489 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/679/07679167.pdf [firstpage_image] =>[orig_patent_app_number] => 11707110 [rel_patent_id] =>[rel_patent_doc_number] =>)