Dennis Y. Myint

Array ( [id] => 4997631 [patent_doc_number] => 20070040265 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-02-22 [patent_title] => 'Substrate support having brazed plates and resistance heater' [patent_app_type] => utility [patent_app_number] => 11/506460 [patent_app_country] => US [patent_app_date] => 2006-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5495 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0040/20070040265.pdf [firstpage_image] =>[orig_patent_app_number] => 11506460 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5145819 [patent_doc_number] => 20070045873 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-01 [patent_title] => 'Semiconductor memory card and method for manufacturing semiconductor memory card' [patent_app_type] => utility [patent_app_number] => 11/502560 [patent_app_country] => US [patent_app_date] => 2006-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2679 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0045/20070045873.pdf [firstpage_image] =>[orig_patent_app_number] => 11502560 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5152154 [patent_doc_number] => 20070035036 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-02-15 [patent_title] => 'Semiconductor device, laminated semiconductor device, and wiring substrate' [patent_app_type] => utility [patent_app_number] => 11/501010 [patent_app_country] => US [patent_app_date] => 2006-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 11494 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0035/20070035036.pdf [firstpage_image] =>[orig_patent_app_number] => 11501010 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4997032 [patent_doc_number] => 20070039666 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-02-22 [patent_title] => 'Copper base for electronic component, electronic component, and process for producing copper base for electronic component' [patent_app_type] => utility [patent_app_number] => 11/497370 [patent_app_country] => US [patent_app_date] => 2006-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 7964 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0039/20070039666.pdf [firstpage_image] =>[orig_patent_app_number] => 11497370 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7599481 [patent_doc_number] => 07582967 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-09-01 [patent_title] => 'Semiconductor device, electronic module, and method of manufacturing electronic module' [patent_app_type] => utility [patent_app_number] => 11/493610 [patent_app_country] => US [patent_app_date] => 2006-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 6313 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/582/07582967.pdf [firstpage_image] =>[orig_patent_app_number] => 11493610 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5049108 [patent_doc_number] => 20070029652 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-02-08 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/493560 [patent_app_country] => US [patent_app_date] => 2006-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4778 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20070029652.pdf [firstpage_image] =>[orig_patent_app_number] => 11493560 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4624795 [patent_doc_number] => 08004096 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-08-23 [patent_title] => 'Semiconductor device and a manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/488640 [patent_app_country] => US [patent_app_date] => 2006-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3357 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/004/08004096.pdf [firstpage_image] =>[orig_patent_app_number] => 11488640 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4587107 [patent_doc_number] => 07851920 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-14 [patent_title] => 'Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating thin film transistor substrate' [patent_app_type] => utility [patent_app_number] => 11/486720 [patent_app_country] => US [patent_app_date] => 2006-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 39 [patent_no_of_words] => 11091 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/851/07851920.pdf [firstpage_image] =>[orig_patent_app_number] => 11486720 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5073091 [patent_doc_number] => 20070013066 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-01-18 [patent_title] => 'Semiconductor package and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 11/486020 [patent_app_country] => US [patent_app_date] => 2006-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3562 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0013/20070013066.pdf [firstpage_image] =>[orig_patent_app_number] => 11486020 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4800518 [patent_doc_number] => 20080012105 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-17 [patent_title] => 'Chip adapter' [patent_app_type] => utility [patent_app_number] => 11/483530 [patent_app_country] => US [patent_app_date] => 2006-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1406 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20080012105.pdf [firstpage_image] =>[orig_patent_app_number] => 11483530 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8029291 [patent_doc_number] => 08143728 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-03-27 [patent_title] => 'Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus' [patent_app_type] => utility [patent_app_number] => 11/484520 [patent_app_country] => US [patent_app_date] => 2006-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 25 [patent_no_of_words] => 7397 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 321 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/143/08143728.pdf [firstpage_image] =>[orig_patent_app_number] => 11484520 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5054456 [patent_doc_number] => 20070057377 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-15 [patent_title] => 'Semiconductor memory device comprising pseudo ground pad and related method' [patent_app_type] => utility [patent_app_number] => 11/478600 [patent_app_country] => US [patent_app_date] => 2006-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5561 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0057/20070057377.pdf [firstpage_image] =>[orig_patent_app_number] => 11478600 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4930522 [patent_doc_number] => 20080001297 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-03 [patent_title] => 'Laser patterning and conductive interconnect/materials forming techniques for fine line and space features' [patent_app_type] => utility [patent_app_number] => 11/479690 [patent_app_country] => US [patent_app_date] => 2006-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4833 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20080001297.pdf [firstpage_image] =>[orig_patent_app_number] => 11479690 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5139093 [patent_doc_number] => 20070001309 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-01-04 [patent_title] => 'Semiconductor device having multiple-layered interconnect' [patent_app_type] => utility [patent_app_number] => 11/476050 [patent_app_country] => US [patent_app_date] => 2006-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 4354 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20070001309.pdf [firstpage_image] =>[orig_patent_app_number] => 11476050 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5031733 [patent_doc_number] => 20070096272 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-03 [patent_title] => 'Light emitting diode package' [patent_app_type] => utility [patent_app_number] => 11/433150 [patent_app_country] => US [patent_app_date] => 2006-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2140 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0096/20070096272.pdf [firstpage_image] =>[orig_patent_app_number] => 11433150 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5736096 [patent_doc_number] => 20060006486 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-12 [patent_title] => 'Image sensor package and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/150825 [patent_app_country] => US [patent_app_date] => 2005-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 7395 [patent_no_of_claims] => 52 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20060006486.pdf [firstpage_image] =>[orig_patent_app_number] => 11150825 [rel_patent_id] =>[rel_patent_doc_number] =>)