
Deven M. Collins
Examiner (ID: 7081)
| Most Active Art Unit | 2823 |
| Art Unit(s) | 2822, 2823, 2812 |
| Total Applications | 382 |
| Issued Applications | 374 |
| Pending Applications | 5 |
| Abandoned Applications | 3 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4004546
[patent_doc_number] => 05960308
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-28
[patent_title] => 'Process for making a chip sized semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 9/040370
[patent_app_country] => US
[patent_app_date] => 1998-03-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 34
[patent_no_of_words] => 6510
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 172
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/960/05960308.pdf
[firstpage_image] =>[orig_patent_app_number] => 040370
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/040370 | Process for making a chip sized semiconductor device | Mar 17, 1998 | Issued |
Array
(
[id] => 3956869
[patent_doc_number] => 05930599
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-27
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 9/040304
[patent_app_country] => US
[patent_app_date] => 1998-03-18
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[pdf_file] => patents/05/930/05930599.pdf
[firstpage_image] =>[orig_patent_app_number] => 040304
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/040304 | Semiconductor device and method of manufacturing the same | Mar 17, 1998 | Issued |
Array
(
[id] => 4189158
[patent_doc_number] => 06150679
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[patent_kind] => NA
[patent_issue_date] => 2000-11-21
[patent_title] => 'FIFO architecture with built-in intelligence for use in a graphics memory system for reducing paging overhead'
[patent_app_type] => 1
[patent_app_number] => 9/042384
[patent_app_country] => US
[patent_app_date] => 1998-03-13
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[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 9681
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[pdf_file] => patents/06/150/06150679.pdf
[firstpage_image] =>[orig_patent_app_number] => 042384
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/042384 | FIFO architecture with built-in intelligence for use in a graphics memory system for reducing paging overhead | Mar 12, 1998 | Issued |
Array
(
[id] => 3956700
[patent_doc_number] => 05930588
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-27
[patent_title] => 'Method for testing an integrated circuit device'
[patent_app_type] => 1
[patent_app_number] => 9/041372
[patent_app_country] => US
[patent_app_date] => 1998-03-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 4388
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[pdf_file] => patents/05/930/05930588.pdf
[firstpage_image] =>[orig_patent_app_number] => 041372
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/041372 | Method for testing an integrated circuit device | Mar 10, 1998 | Issued |
Array
(
[id] => 4097593
[patent_doc_number] => 06048752
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-11
[patent_title] => 'Density improvement for planar hybrid wafer scale integration'
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[patent_app_number] => 9/037180
[patent_app_country] => US
[patent_app_date] => 1998-03-09
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/037180 | Density improvement for planar hybrid wafer scale integration | Mar 8, 1998 | Issued |
Array
(
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[patent_doc_number] => 05963794
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[patent_kind] => NA
[patent_issue_date] => 1999-10-05
[patent_title] => 'Angularly offset stacked die multichip device and method of manufacture'
[patent_app_type] => 1
[patent_app_number] => 9/030574
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[patent_app_date] => 1998-02-24
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[firstpage_image] =>[orig_patent_app_number] => 030574
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/030574 | Angularly offset stacked die multichip device and method of manufacture | Feb 23, 1998 | Issued |
Array
(
[id] => 3968643
[patent_doc_number] => 05904507
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Programmable anti-fuses using laser writing'
[patent_app_type] => 1
[patent_app_number] => 9/028190
[patent_app_country] => US
[patent_app_date] => 1998-02-23
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[pdf_file] => patents/05/904/05904507.pdf
[firstpage_image] =>[orig_patent_app_number] => 028190
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/028190 | Programmable anti-fuses using laser writing | Feb 22, 1998 | Issued |
Array
(
[id] => 4030805
[patent_doc_number] => 05963796
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[patent_kind] => NA
[patent_issue_date] => 1999-10-05
[patent_title] => 'Fabrication method for semiconductor package substrate and semiconductor package'
[patent_app_type] => 1
[patent_app_number] => 9/027185
[patent_app_country] => US
[patent_app_date] => 1998-02-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 2651
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[pdf_file] => patents/05/963/05963796.pdf
[firstpage_image] =>[orig_patent_app_number] => 027185
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/027185 | Fabrication method for semiconductor package substrate and semiconductor package | Feb 19, 1998 | Issued |
Array
(
[id] => 3968607
[patent_doc_number] => 05904504
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Die attach method and integrated circuit device'
[patent_app_type] => 1
[patent_app_number] => 9/025911
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[firstpage_image] =>[orig_patent_app_number] => 025911
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/025911 | Die attach method and integrated circuit device | Feb 18, 1998 | Issued |
Array
(
[id] => 4218675
[patent_doc_number] => 06040205
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-21
[patent_title] => 'Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid'
[patent_app_type] => 1
[patent_app_number] => 9/020197
[patent_app_country] => US
[patent_app_date] => 1998-02-06
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[patent_drawing_sheets_cnt] => 21
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/020197 | Apparatus and method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid | Feb 5, 1998 | Issued |
Array
(
[id] => 3969419
[patent_doc_number] => 05904555
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Method for packaging a semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 016985
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/016985 | Method for packaging a semiconductor device | Feb 1, 1998 | Issued |
Array
(
[id] => 4130781
[patent_doc_number] => 06121067
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[patent_title] => 'Method for additive de-marking of packaged integrated circuits and resulting packages'
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Array
(
[id] => 3896092
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/014084 | Method of evaluating a semiconductor wafer | Jan 26, 1998 | Issued |
Array
(
[id] => 4107096
[patent_doc_number] => 06057173
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[patent_issue_date] => 2000-05-02
[patent_title] => 'Ablative bond pad formation'
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[firstpage_image] =>[orig_patent_app_number] => 014078
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Array
(
[id] => 3994409
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[patent_title] => 'Method of manufacturing a bonding substrate'
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Array
(
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[patent_title] => 'Process for forming coatings on semiconductor devices'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/013247 | Process for forming coatings on semiconductor devices | Jan 25, 1998 | Issued |
Array
(
[id] => 4086541
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[patent_title] => 'Circuit member for semiconductor device, semiconductor device using the same, and method for manufacturing them'
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Array
(
[id] => 4151662
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[patent_issue_date] => 2000-09-26
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/012660 | Micromachined gas-filled chambers and method of microfabrication | Jan 22, 1998 | Issued |
| 09/005775 | CONNECTION LEADS FOR AN ELECTRONIC COMPONENT | Jan 11, 1998 | Issued |
Array
(
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