Search

Deven M. Collins

Examiner (ID: 7081)

Most Active Art Unit
2823
Art Unit(s)
2822, 2823, 2812
Total Applications
382
Issued Applications
374
Pending Applications
5
Abandoned Applications
3

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4289144 [patent_doc_number] => 06235551 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-22 [patent_title] => 'Semiconductor device including edge bond pads and methods' [patent_app_type] => 1 [patent_app_number] => 9/001404 [patent_app_country] => US [patent_app_date] => 1997-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 12 [patent_no_of_words] => 3174 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/235/06235551.pdf [firstpage_image] =>[orig_patent_app_number] => 001404 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/001404
Semiconductor device including edge bond pads and methods Dec 30, 1997 Issued
Array ( [id] => 4129797 [patent_doc_number] => 06033937 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-03-07 [patent_title] => 'S.sub.i O.sub.2 wire bond insulation in semiconductor assemblies' [patent_app_type] => 1 [patent_app_number] => 8/996836 [patent_app_country] => US [patent_app_date] => 1997-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 13 [patent_no_of_words] => 2381 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/033/06033937.pdf [firstpage_image] =>[orig_patent_app_number] => 996836 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/996836
S.sub.i O.sub.2 wire bond insulation in semiconductor assemblies Dec 22, 1997 Issued
Array ( [id] => 4113753 [patent_doc_number] => 06046075 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-04 [patent_title] => 'Oxide wire bond insulation in semiconductor assemblies' [patent_app_type] => 1 [patent_app_number] => 8/997295 [patent_app_country] => US [patent_app_date] => 1997-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 2331 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/046/06046075.pdf [firstpage_image] =>[orig_patent_app_number] => 997295 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/997295
Oxide wire bond insulation in semiconductor assemblies Dec 22, 1997 Issued
Array ( [id] => 4214982 [patent_doc_number] => 06087203 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-11 [patent_title] => 'Method for adhering and sealing a silicon chip in an integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 8/994240 [patent_app_country] => US [patent_app_date] => 1997-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 4669 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/087/06087203.pdf [firstpage_image] =>[orig_patent_app_number] => 994240 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/994240
Method for adhering and sealing a silicon chip in an integrated circuit package Dec 18, 1997 Issued
Array ( [id] => 4058058 [patent_doc_number] => 05909634 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-01 [patent_title] => 'Method and apparatus for forming solder on a substrate' [patent_app_type] => 1 [patent_app_number] => 8/993636 [patent_app_country] => US [patent_app_date] => 1997-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 19 [patent_no_of_words] => 4338 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/909/05909634.pdf [firstpage_image] =>[orig_patent_app_number] => 993636 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/993636
Method and apparatus for forming solder on a substrate Dec 17, 1997 Issued
Array ( [id] => 4101980 [patent_doc_number] => 06100166 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-08-08 [patent_title] => 'Process for producing semiconductor article' [patent_app_type] => 1 [patent_app_number] => 8/993034 [patent_app_country] => US [patent_app_date] => 1997-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 69 [patent_no_of_words] => 28454 [patent_no_of_claims] => 78 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/100/06100166.pdf [firstpage_image] =>[orig_patent_app_number] => 993034 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/993034
Process for producing semiconductor article Dec 17, 1997 Issued
Array ( [id] => 3885819 [patent_doc_number] => 05893726 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-13 [patent_title] => 'Semiconductor package with pre-fabricated cover and method of fabrication' [patent_app_type] => 1 [patent_app_number] => 8/990866 [patent_app_country] => US [patent_app_date] => 1997-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 13 [patent_no_of_words] => 3703 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/893/05893726.pdf [firstpage_image] =>[orig_patent_app_number] => 990866 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/990866
Semiconductor package with pre-fabricated cover and method of fabrication Dec 14, 1997 Issued
Array ( [id] => 3952559 [patent_doc_number] => 05940681 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-17 [patent_title] => 'Method and apparatus for automatically checking position data of J-leads' [patent_app_type] => 1 [patent_app_number] => 8/989274 [patent_app_country] => US [patent_app_date] => 1997-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 3572 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/940/05940681.pdf [firstpage_image] =>[orig_patent_app_number] => 989274 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/989274
Method and apparatus for automatically checking position data of J-leads Dec 11, 1997 Issued
Array ( [id] => 4009101 [patent_doc_number] => 05920765 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-06 [patent_title] => 'IC wafer-probe testable flip-chip architecture' [patent_app_type] => 1 [patent_app_number] => 8/991218 [patent_app_country] => US [patent_app_date] => 1997-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3579 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/920/05920765.pdf [firstpage_image] =>[orig_patent_app_number] => 991218 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/991218
IC wafer-probe testable flip-chip architecture Dec 11, 1997 Issued
Array ( [id] => 1490080 [patent_doc_number] => 06417029 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-09 [patent_title] => 'Compliant package with conductive elastomeric posts' [patent_app_type] => B1 [patent_app_number] => 08/989306 [patent_app_country] => US [patent_app_date] => 1997-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 13 [patent_no_of_words] => 3778 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/417/06417029.pdf [firstpage_image] =>[orig_patent_app_number] => 08989306 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/989306
Compliant package with conductive elastomeric posts Dec 11, 1997 Issued
Array ( [id] => 3941301 [patent_doc_number] => 05989941 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-23 [patent_title] => 'Encapsulated integrated circuit packaging' [patent_app_type] => 1 [patent_app_number] => 8/989754 [patent_app_country] => US [patent_app_date] => 1997-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1418 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/989/05989941.pdf [firstpage_image] =>[orig_patent_app_number] => 989754 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/989754
Encapsulated integrated circuit packaging Dec 11, 1997 Issued
Array ( [id] => 4009161 [patent_doc_number] => 05920769 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-06 [patent_title] => 'Method and apparatus for processing a planar structure' [patent_app_type] => 1 [patent_app_number] => 8/990072 [patent_app_country] => US [patent_app_date] => 1997-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 2246 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/920/05920769.pdf [firstpage_image] =>[orig_patent_app_number] => 990072 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/990072
Method and apparatus for processing a planar structure Dec 11, 1997 Issued
Array ( [id] => 4080575 [patent_doc_number] => 06054337 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-25 [patent_title] => 'Method of making a compliant multichip package' [patent_app_type] => 1 [patent_app_number] => 8/989710 [patent_app_country] => US [patent_app_date] => 1997-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 6988 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/054/06054337.pdf [firstpage_image] =>[orig_patent_app_number] => 989710 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/989710
Method of making a compliant multichip package Dec 11, 1997 Issued
Array ( [id] => 3942450 [patent_doc_number] => 05946590 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-31 [patent_title] => 'Method for making bumps' [patent_app_type] => 1 [patent_app_number] => 8/987240 [patent_app_country] => US [patent_app_date] => 1997-12-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 32 [patent_no_of_words] => 3219 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/946/05946590.pdf [firstpage_image] =>[orig_patent_app_number] => 987240 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/987240
Method for making bumps Dec 8, 1997 Issued
Array ( [id] => 3957905 [patent_doc_number] => 05930665 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-27 [patent_title] => 'Wide frequency band transition between via RF transmission lines and planar transmission lines' [patent_app_type] => 1 [patent_app_number] => 8/985750 [patent_app_country] => US [patent_app_date] => 1997-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 29 [patent_no_of_words] => 4936 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/930/05930665.pdf [firstpage_image] =>[orig_patent_app_number] => 985750 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/985750
Wide frequency band transition between via RF transmission lines and planar transmission lines Dec 4, 1997 Issued
Array ( [id] => 4058046 [patent_doc_number] => 05909633 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-01 [patent_title] => 'Method of manufacturing an electronic component' [patent_app_type] => 1 [patent_app_number] => 8/979694 [patent_app_country] => US [patent_app_date] => 1997-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 3959 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/909/05909633.pdf [firstpage_image] =>[orig_patent_app_number] => 979694 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/979694
Method of manufacturing an electronic component Nov 25, 1997 Issued
Array ( [id] => 4070107 [patent_doc_number] => 05933752 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-03 [patent_title] => 'Method and apparatus for forming solder bumps for a semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/979784 [patent_app_country] => US [patent_app_date] => 1997-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 23 [patent_no_of_words] => 7402 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/933/05933752.pdf [firstpage_image] =>[orig_patent_app_number] => 979784 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/979784
Method and apparatus for forming solder bumps for a semiconductor device Nov 25, 1997 Issued
Array ( [id] => 4056899 [patent_doc_number] => 05895226 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-20 [patent_title] => 'Method of manufacturing semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/979782 [patent_app_country] => US [patent_app_date] => 1997-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 2413 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/895/05895226.pdf [firstpage_image] =>[orig_patent_app_number] => 979782 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/979782
Method of manufacturing semiconductor device Nov 25, 1997 Issued
Array ( [id] => 4221892 [patent_doc_number] => 06010920 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-01-04 [patent_title] => 'Method and an arrangement for mounting a component on a carrier' [patent_app_type] => 1 [patent_app_number] => 8/977235 [patent_app_country] => US [patent_app_date] => 1997-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 11 [patent_no_of_words] => 1484 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/010/06010920.pdf [firstpage_image] =>[orig_patent_app_number] => 977235 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/977235
Method and an arrangement for mounting a component on a carrier Nov 23, 1997 Issued
Array ( [id] => 4113768 [patent_doc_number] => 06046076 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-04-04 [patent_title] => 'Vacuum dispense method for dispensing an encapsulant and machine therefor' [patent_app_type] => 1 [patent_app_number] => 8/975590 [patent_app_country] => US [patent_app_date] => 1997-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 8070 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/046/06046076.pdf [firstpage_image] =>[orig_patent_app_number] => 975590 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/975590
Vacuum dispense method for dispensing an encapsulant and machine therefor Nov 19, 1997 Issued
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