
Deven M. Collins
Examiner (ID: 7081)
| Most Active Art Unit | 2823 |
| Art Unit(s) | 2822, 2823, 2812 |
| Total Applications | 382 |
| Issued Applications | 374 |
| Pending Applications | 5 |
| Abandoned Applications | 3 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4293615
[patent_doc_number] => 06184063
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-06
[patent_title] => 'Method and apparatus for breaking and separating a wafer into die using a multi-radii dome'
[patent_app_type] => 1
[patent_app_number] => 8/975378
[patent_app_country] => US
[patent_app_date] => 1997-11-20
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/184/06184063.pdf
[firstpage_image] =>[orig_patent_app_number] => 975378
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/975378 | Method and apparatus for breaking and separating a wafer into die using a multi-radii dome | Nov 19, 1997 | Issued |
Array
(
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[patent_doc_number] => 06030858
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-29
[patent_title] => 'Stacked bottom lead package in semiconductor devices and fabricating method thereof'
[patent_app_type] => 1
[patent_app_number] => 8/974684
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[patent_app_date] => 1997-11-19
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Array
(
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[patent_kind] => NA
[patent_issue_date] => 1999-09-21
[patent_title] => 'Method for bumping and packaging semiconductor die'
[patent_app_type] => 1
[patent_app_number] => 8/962008
[patent_app_country] => US
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Array
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[patent_issue_date] => 2000-07-11
[patent_title] => 'Composite unit of optical semiconductor device and supporting substrate and method for mounting optical semiconductor device on supporting substrate'
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Array
(
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[patent_issue_date] => 1999-04-20
[patent_title] => 'External terminal fabrication method for semiconductor device package'
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Array
(
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[patent_title] => 'Method for manufacturing a semiconductor device'
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Array
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[patent_title] => 'Method for manufacturing ceramic multilayer circuit'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/956666 | Method for manufacturing ceramic multilayer circuit | Oct 22, 1997 | Issued |
Array
(
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[patent_title] => 'Method and apparatus for packaging high temperature solid state electronic devices'
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Array
(
[id] => 3975949
[patent_doc_number] => 05937276
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[patent_kind] => NA
[patent_issue_date] => 1999-08-10
[patent_title] => 'Bonding lead structure with enhanced encapsulation'
[patent_app_type] => 1
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Array
(
[id] => 4023629
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[patent_issue_date] => 1999-03-16
[patent_title] => 'Method for adhering a metallization to a substrate'
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Array
(
[id] => 4006476
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[patent_issue_date] => 1999-03-30
[patent_title] => 'Method for providing a protective coating and electronic package utilizing same'
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Array
(
[id] => 3936788
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[patent_title] => 'Multiple part compliant interface for packaging of a semiconductor chip and method therefor'
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Array
(
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[patent_title] => 'Methods of forming flip chip bumps and related flip chip bump constructions'
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Array
(
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Array
(
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Array
(
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/918404 | Method of making plastic package for a surface mounted integrated circuit | Aug 25, 1997 | Issued |