Search

Deven M. Collins

Examiner (ID: 7081)

Most Active Art Unit
2823
Art Unit(s)
2822, 2823, 2812
Total Applications
382
Issued Applications
374
Pending Applications
5
Abandoned Applications
3

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4293615 [patent_doc_number] => 06184063 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-06 [patent_title] => 'Method and apparatus for breaking and separating a wafer into die using a multi-radii dome' [patent_app_type] => 1 [patent_app_number] => 8/975378 [patent_app_country] => US [patent_app_date] => 1997-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 4249 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/184/06184063.pdf [firstpage_image] =>[orig_patent_app_number] => 975378 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/975378
Method and apparatus for breaking and separating a wafer into die using a multi-radii dome Nov 19, 1997 Issued
Array ( [id] => 4141459 [patent_doc_number] => 06030858 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-02-29 [patent_title] => 'Stacked bottom lead package in semiconductor devices and fabricating method thereof' [patent_app_type] => 1 [patent_app_number] => 8/974684 [patent_app_country] => US [patent_app_date] => 1997-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 4060 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/030/06030858.pdf [firstpage_image] =>[orig_patent_app_number] => 974684 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/974684
Stacked bottom lead package in semiconductor devices and fabricating method thereof Nov 18, 1997 Issued
Array ( [id] => 3967245 [patent_doc_number] => 05956606 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-21 [patent_title] => 'Method for bumping and packaging semiconductor die' [patent_app_type] => 1 [patent_app_number] => 8/962008 [patent_app_country] => US [patent_app_date] => 1997-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 2731 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 31 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/956/05956606.pdf [firstpage_image] =>[orig_patent_app_number] => 962008 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/962008
Method for bumping and packaging semiconductor die Oct 30, 1997 Issued
Array ( [id] => 4214857 [patent_doc_number] => 06087194 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-11 [patent_title] => 'Composite unit of optical semiconductor device and supporting substrate and method for mounting optical semiconductor device on supporting substrate' [patent_app_type] => 1 [patent_app_number] => 8/959855 [patent_app_country] => US [patent_app_date] => 1997-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 65 [patent_no_of_words] => 18092 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/087/06087194.pdf [firstpage_image] =>[orig_patent_app_number] => 959855 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/959855
Composite unit of optical semiconductor device and supporting substrate and method for mounting optical semiconductor device on supporting substrate Oct 28, 1997 Issued
Array ( [id] => 4056987 [patent_doc_number] => 05895231 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-20 [patent_title] => 'External terminal fabrication method for semiconductor device package' [patent_app_type] => 1 [patent_app_number] => 8/960210 [patent_app_country] => US [patent_app_date] => 1997-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 2486 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/895/05895231.pdf [firstpage_image] =>[orig_patent_app_number] => 960210 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/960210
External terminal fabrication method for semiconductor device package Oct 28, 1997 Issued
Array ( [id] => 4221810 [patent_doc_number] => 06010914 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-01-04 [patent_title] => 'Method for manufacturing a semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/958666 [patent_app_country] => US [patent_app_date] => 1997-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 20 [patent_no_of_words] => 4062 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/010/06010914.pdf [firstpage_image] =>[orig_patent_app_number] => 958666 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/958666
Method for manufacturing a semiconductor device Oct 27, 1997 Issued
Array ( [id] => 3976648 [patent_doc_number] => 05937321 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-10 [patent_title] => 'Method for manufacturing ceramic multilayer circuit' [patent_app_type] => 1 [patent_app_number] => 8/956666 [patent_app_country] => US [patent_app_date] => 1997-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1050 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/937/05937321.pdf [firstpage_image] =>[orig_patent_app_number] => 956666 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/956666
Method for manufacturing ceramic multilayer circuit Oct 22, 1997 Issued
Array ( [id] => 3957917 [patent_doc_number] => 05930666 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-27 [patent_title] => 'Method and apparatus for packaging high temperature solid state electronic devices' [patent_app_type] => 1 [patent_app_number] => 8/948110 [patent_app_country] => US [patent_app_date] => 1997-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3219 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/930/05930666.pdf [firstpage_image] =>[orig_patent_app_number] => 948110 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/948110
Method and apparatus for packaging high temperature solid state electronic devices Oct 8, 1997 Issued
Array ( [id] => 3975949 [patent_doc_number] => 05937276 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-10 [patent_title] => 'Bonding lead structure with enhanced encapsulation' [patent_app_type] => 1 [patent_app_number] => 8/947180 [patent_app_country] => US [patent_app_date] => 1997-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 7309 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 257 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/937/05937276.pdf [firstpage_image] =>[orig_patent_app_number] => 947180 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/947180
Bonding lead structure with enhanced encapsulation Oct 7, 1997 Issued
Array ( [id] => 4023629 [patent_doc_number] => 05882954 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-16 [patent_title] => 'Method for adhering a metallization to a substrate' [patent_app_type] => 1 [patent_app_number] => 8/944506 [patent_app_country] => US [patent_app_date] => 1997-10-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 1923 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/882/05882954.pdf [firstpage_image] =>[orig_patent_app_number] => 944506 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/944506
Method for adhering a metallization to a substrate Oct 5, 1997 Issued
Array ( [id] => 4006476 [patent_doc_number] => 05888850 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-30 [patent_title] => 'Method for providing a protective coating and electronic package utilizing same' [patent_app_type] => 1 [patent_app_number] => 8/939302 [patent_app_country] => US [patent_app_date] => 1997-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 4854 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/888/05888850.pdf [firstpage_image] =>[orig_patent_app_number] => 939302 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/939302
Method for providing a protective coating and electronic package utilizing same Sep 28, 1997 Issued
Array ( [id] => 3936788 [patent_doc_number] => 05915170 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-22 [patent_title] => 'Multiple part compliant interface for packaging of a semiconductor chip and method therefor' [patent_app_type] => 1 [patent_app_number] => 8/931680 [patent_app_country] => US [patent_app_date] => 1997-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 15 [patent_no_of_words] => 7480 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/915/05915170.pdf [firstpage_image] =>[orig_patent_app_number] => 931680 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/931680
Multiple part compliant interface for packaging of a semiconductor chip and method therefor Sep 15, 1997 Issued
Array ( [id] => 4172148 [patent_doc_number] => 06083773 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-07-04 [patent_title] => 'Methods of forming flip chip bumps and related flip chip bump constructions' [patent_app_type] => 1 [patent_app_number] => 8/931814 [patent_app_country] => US [patent_app_date] => 1997-09-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 2033 [patent_no_of_claims] => 47 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/083/06083773.pdf [firstpage_image] =>[orig_patent_app_number] => 931814 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/931814
Methods of forming flip chip bumps and related flip chip bump constructions Sep 15, 1997 Issued
Array ( [id] => 3952509 [patent_doc_number] => 05940678 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-17 [patent_title] => 'Method of forming precisely cross-sectioned electron-transparent samples' [patent_app_type] => 1 [patent_app_number] => 8/927322 [patent_app_country] => US [patent_app_date] => 1997-09-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 17 [patent_no_of_words] => 1691 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/940/05940678.pdf [firstpage_image] =>[orig_patent_app_number] => 927322 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/927322
Method of forming precisely cross-sectioned electron-transparent samples Sep 10, 1997 Issued
Array ( [id] => 3968579 [patent_doc_number] => 05904502 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-05-18 [patent_title] => 'Multiple 3-dimensional semiconductor device processing method and apparatus' [patent_app_type] => 1 [patent_app_number] => 8/923162 [patent_app_country] => US [patent_app_date] => 1997-09-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 6388 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/904/05904502.pdf [firstpage_image] =>[orig_patent_app_number] => 923162 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/923162
Multiple 3-dimensional semiconductor device processing method and apparatus Sep 3, 1997 Issued
Array ( [id] => 4050118 [patent_doc_number] => 05943551 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-08-24 [patent_title] => 'Apparatus and method for detecting defects on silicon dies on a silicon wafer' [patent_app_type] => 1 [patent_app_number] => 8/923578 [patent_app_country] => US [patent_app_date] => 1997-09-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 6429 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/943/05943551.pdf [firstpage_image] =>[orig_patent_app_number] => 923578 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/923578
Apparatus and method for detecting defects on silicon dies on a silicon wafer Sep 3, 1997 Issued
Array ( [id] => 3968371 [patent_doc_number] => 05904488 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-05-18 [patent_title] => 'Semiconductor integrated circuit device' [patent_app_type] => 1 [patent_app_number] => 8/919044 [patent_app_country] => US [patent_app_date] => 1997-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 3661 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/904/05904488.pdf [firstpage_image] =>[orig_patent_app_number] => 919044 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/919044
Semiconductor integrated circuit device Aug 26, 1997 Issued
Array ( [id] => 4233500 [patent_doc_number] => 06074894 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-13 [patent_title] => 'Mounting method of semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/919036 [patent_app_country] => US [patent_app_date] => 1997-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2312 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/074/06074894.pdf [firstpage_image] =>[orig_patent_app_number] => 919036 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/919036
Mounting method of semiconductor device Aug 26, 1997 Issued
Array ( [id] => 3994503 [patent_doc_number] => 05918144 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-29 [patent_title] => 'Method of manufacturing a semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/918442 [patent_app_country] => US [patent_app_date] => 1997-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 19 [patent_no_of_words] => 6575 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/918/05918144.pdf [firstpage_image] =>[orig_patent_app_number] => 918442 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/918442
Method of manufacturing a semiconductor device Aug 25, 1997 Issued
Array ( [id] => 3943270 [patent_doc_number] => 05976914 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-11-02 [patent_title] => 'Method of making plastic package for a surface mounted integrated circuit' [patent_app_type] => 1 [patent_app_number] => 8/918404 [patent_app_country] => US [patent_app_date] => 1997-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2322 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/976/05976914.pdf [firstpage_image] =>[orig_patent_app_number] => 918404 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/918404
Method of making plastic package for a surface mounted integrated circuit Aug 25, 1997 Issued
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