Search

Didarul A. Mazumder

Examiner (ID: 7776, Phone: (571)272-8823 , Office: P/2819 )

Most Active Art Unit
2819
Art Unit(s)
2818, 2819, 2812
Total Applications
1039
Issued Applications
847
Pending Applications
115
Abandoned Applications
103

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19132918 [patent_doc_number] => 20240138271 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-25 [patent_title] => SUPERCONDUCTING QUANTUM INTERFEROMETRIC DEVICE AND MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 18/194539 [patent_app_country] => US [patent_app_date] => 2023-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15069 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18194539 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/194539
Superconducting quantum interferometric device and manufacturing method Mar 30, 2023 Issued
Array ( [id] => 20104762 [patent_doc_number] => 20250234698 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-07-17 [patent_title] => DISPLAY ELEMENT AND DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 18/578377 [patent_app_country] => US [patent_app_date] => 2023-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3879 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18578377 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/578377
DISPLAY ELEMENT AND DISPLAY DEVICE Mar 28, 2023 Pending
Array ( [id] => 18712899 [patent_doc_number] => 20230335532 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-19 [patent_title] => METHODS OF DETERMINING A HEIGHT, AND A HEIGHT PROFILE, OF A WIRE LOOP ON A WIRE BONDING MACHINE [patent_app_type] => utility [patent_app_number] => 18/125152 [patent_app_country] => US [patent_app_date] => 2023-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4296 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18125152 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/125152
Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine Mar 22, 2023 Issued
Array ( [id] => 20346062 [patent_doc_number] => 12469797 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-11 [patent_title] => Electronic component module comprising plurality of components and substrate including insulating layer, ground layer and ground bump [patent_app_type] => utility [patent_app_number] => 18/184734 [patent_app_country] => US [patent_app_date] => 2023-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 26 [patent_no_of_words] => 1095 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18184734 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/184734
Electronic component module comprising plurality of components and substrate including insulating layer, ground layer and ground bump Mar 15, 2023 Issued
Array ( [id] => 20098116 [patent_doc_number] => 20250228052 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-07-10 [patent_title] => LIGHT-EMITTING BASEPLATE AND PREPARATION METHOD THEREOF, AND LIGHT-EMITTING DEVICE [patent_app_type] => utility [patent_app_number] => 18/701818 [patent_app_country] => US [patent_app_date] => 2023-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6814 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18701818 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/701818
LIGHT-EMITTING BASEPLATE AND PREPARATION METHOD THEREOF, AND LIGHT-EMITTING DEVICE Mar 14, 2023 Pending
Array ( [id] => 19452789 [patent_doc_number] => 20240312919 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-19 [patent_title] => INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS [patent_app_type] => utility [patent_app_number] => 18/120910 [patent_app_country] => US [patent_app_date] => 2023-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6879 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18120910 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/120910
INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS Mar 12, 2023 Pending
Array ( [id] => 19046734 [patent_doc_number] => 11935854 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads [patent_app_type] => utility [patent_app_number] => 18/119266 [patent_app_country] => US [patent_app_date] => 2023-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 4306 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18119266 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/119266
Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding pads Mar 7, 2023 Issued
Array ( [id] => 18475721 [patent_doc_number] => 20230210009 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => INTEGRATED CIRCUIT COMPONENTS INCORPORATING ENERGY HARVESTING COMPONENTS/DEVICES, AND METHODS FOR FABRICATION, MANUFACTURE AND PRODUCTION OF INTEGRATED CIRCUIT COMPONENTS INCORPORATING ENERGY HARVESTING COMPONENTS/DEVICES [patent_app_type] => utility [patent_app_number] => 18/117814 [patent_app_country] => US [patent_app_date] => 2023-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12025 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 214 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18117814 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/117814
INTEGRATED CIRCUIT COMPONENTS INCORPORATING ENERGY HARVESTING COMPONENTS/DEVICES, AND METHODS FOR FABRICATION, MANUFACTURE AND PRODUCTION OF INTEGRATED CIRCUIT COMPONENTS INCORPORATING ENERGY HARVESTING COMPONENTS/DEVICES Mar 5, 2023 Abandoned
Array ( [id] => 19168594 [patent_doc_number] => 11984509 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-14 [patent_title] => Thin-film transistor, display device including the same, and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/117416 [patent_app_country] => US [patent_app_date] => 2023-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 24 [patent_no_of_words] => 14230 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18117416 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/117416
Thin-film transistor, display device including the same, and method of manufacturing the same Mar 3, 2023 Issued
Array ( [id] => 19046753 [patent_doc_number] => 11935873 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips [patent_app_type] => utility [patent_app_number] => 18/176058 [patent_app_country] => US [patent_app_date] => 2023-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 18 [patent_no_of_words] => 9798 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18176058 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/176058
Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips Feb 27, 2023 Issued
Array ( [id] => 19414819 [patent_doc_number] => 12080656 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-03 [patent_title] => Electromagnetic shielding structure for a semiconductor device and a method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/173840 [patent_app_country] => US [patent_app_date] => 2023-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 40 [patent_figures_cnt] => 40 [patent_no_of_words] => 13245 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18173840 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/173840
Electromagnetic shielding structure for a semiconductor device and a method for manufacturing the same Feb 23, 2023 Issued
Array ( [id] => 18456351 [patent_doc_number] => 20230197633 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING OF SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/173080 [patent_app_country] => US [patent_app_date] => 2023-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7807 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18173080 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/173080
Semiconductor package, semiconductor device and shielding housing of semiconductor package Feb 22, 2023 Issued
Array ( [id] => 18473221 [patent_doc_number] => 20230207509 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS [patent_app_type] => utility [patent_app_number] => 18/171028 [patent_app_country] => US [patent_app_date] => 2023-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4782 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18171028 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/171028
Multi-layer semiconductor package with stacked passive components Feb 16, 2023 Issued
Array ( [id] => 19610932 [patent_doc_number] => 12159813 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-03 [patent_title] => Embedded bridge die with through-silicon vias [patent_app_type] => utility [patent_app_number] => 18/111329 [patent_app_country] => US [patent_app_date] => 2023-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 45 [patent_no_of_words] => 13144 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18111329 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/111329
Embedded bridge die with through-silicon vias Feb 16, 2023 Issued
Array ( [id] => 19364308 [patent_doc_number] => 20240266342 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-08 [patent_title] => COLUMN DIVIDED MULTI-HEIGHT ARCHITECTURE [patent_app_type] => utility [patent_app_number] => 18/165259 [patent_app_country] => US [patent_app_date] => 2023-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11817 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18165259 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/165259
COLUMN DIVIDED MULTI-HEIGHT ARCHITECTURE Feb 5, 2023 Pending
Array ( [id] => 19023191 [patent_doc_number] => 20240079362 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-07 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/104789 [patent_app_country] => US [patent_app_date] => 2023-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9128 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18104789 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/104789
SEMICONDUCTOR DEVICE Feb 1, 2023 Pending
Array ( [id] => 18408958 [patent_doc_number] => 20230170311 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-01 [patent_title] => Laser-Based Redistribution and Multi-Stacked Packages [patent_app_type] => utility [patent_app_number] => 18/161693 [patent_app_country] => US [patent_app_date] => 2023-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5302 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 36 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18161693 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/161693
Laser-based redistribution and multi-stacked packages Jan 29, 2023 Issued
Array ( [id] => 18540875 [patent_doc_number] => 20230245986 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/103196 [patent_app_country] => US [patent_app_date] => 2023-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4827 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18103196 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/103196
Multiple conductive posts Jan 29, 2023 Issued
Array ( [id] => 19093974 [patent_doc_number] => 11955439 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-09 [patent_title] => Semiconductor package with redistribution structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 18/155672 [patent_app_country] => US [patent_app_date] => 2023-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 36 [patent_no_of_words] => 14706 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18155672 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/155672
Semiconductor package with redistribution structure and manufacturing method thereof Jan 16, 2023 Issued
Array ( [id] => 20612851 [patent_doc_number] => 12588471 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-24 [patent_title] => Micro-device substrate structures with posts and indentations [patent_app_type] => utility [patent_app_number] => 18/098066 [patent_app_country] => US [patent_app_date] => 2023-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 31 [patent_no_of_words] => 6711 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18098066 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/098066
Micro-device substrate structures with posts and indentations Jan 16, 2023 Issued
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