Search

Didarul A. Mazumder

Examiner (ID: 14083, Phone: (571)272-8823 , Office: P/2819 )

Most Active Art Unit
2819
Art Unit(s)
2819, 2818, 2812
Total Applications
972
Issued Applications
802
Pending Applications
121
Abandoned Applications
101

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19285862 [patent_doc_number] => 20240222339 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-04 [patent_title] => Integrated Circuit Package With Improved Heat Dissipation Efficiency and Methods of Forming the Same [patent_app_type] => utility [patent_app_number] => 18/152665 [patent_app_country] => US [patent_app_date] => 2023-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9170 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152665 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/152665
Integrated Circuit Package With Improved Heat Dissipation Efficiency and Methods of Forming the Same Jan 9, 2023 Pending
Array ( [id] => 19007963 [patent_doc_number] => 20240072034 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => 3DIC Package and Method Forming the Same [patent_app_type] => utility [patent_app_number] => 18/151609 [patent_app_country] => US [patent_app_date] => 2023-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8346 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151609 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/151609
3DIC Package and Method Forming the Same Jan 8, 2023 Pending
Array ( [id] => 19007963 [patent_doc_number] => 20240072034 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => 3DIC Package and Method Forming the Same [patent_app_type] => utility [patent_app_number] => 18/151609 [patent_app_country] => US [patent_app_date] => 2023-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8346 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151609 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/151609
3DIC Package and Method Forming the Same Jan 8, 2023 Pending
Array ( [id] => 18363882 [patent_doc_number] => 20230145473 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STACK SIGNAL ROUTING [patent_app_type] => utility [patent_app_number] => 18/094320 [patent_app_country] => US [patent_app_date] => 2023-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6582 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18094320 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/094320
Semiconductor assemblies with redistribution structures for die stack signal routing Jan 5, 2023 Issued
Array ( [id] => 18379778 [patent_doc_number] => 20230154867 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => CHIP STRUCTURE AND SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/150866 [patent_app_country] => US [patent_app_date] => 2023-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6922 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18150866 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/150866
Chip structure and semiconductor structure comprising auxiliary bonding region above guard ring structure Jan 5, 2023 Issued
Array ( [id] => 18361790 [patent_doc_number] => 20230143381 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/150541 [patent_app_country] => US [patent_app_date] => 2023-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4487 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18150541 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/150541
Electronic device comprising a transferred portion of plurality of chips and method for manufacturing the same Jan 4, 2023 Issued
Array ( [id] => 18347938 [patent_doc_number] => 20230136049 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-04 [patent_title] => SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/092922 [patent_app_country] => US [patent_app_date] => 2023-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6017 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => 0 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18092922 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/092922
Semiconductor device package including multiple substrates with different functions Jan 2, 2023 Issued
Array ( [id] => 19023173 [patent_doc_number] => 20240079344 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-07 [patent_title] => PACKAGING ASSEMBLY FOR SEMICONDUCTOR DEVICE AND METHOD OF MAKING [patent_app_type] => utility [patent_app_number] => 18/092852 [patent_app_country] => US [patent_app_date] => 2023-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4306 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18092852 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/092852
PACKAGING ASSEMBLY FOR SEMICONDUCTOR DEVICE AND METHOD OF MAKING Jan 2, 2023 Abandoned
Array ( [id] => 20390812 [patent_doc_number] => 12490562 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-02 [patent_title] => Display panel comprising multiple pixel structures including repaired pixel structure [patent_app_type] => utility [patent_app_number] => 18/088774 [patent_app_country] => US [patent_app_date] => 2022-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 40 [patent_no_of_words] => 3093 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18088774 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/088774
Display panel comprising multiple pixel structures including repaired pixel structure Dec 26, 2022 Issued
Array ( [id] => 18325745 [patent_doc_number] => 20230123873 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => INTER-LEVEL CONNECTION FOR MULTI-LAYER STRUCTURES [patent_app_type] => utility [patent_app_number] => 18/084292 [patent_app_country] => US [patent_app_date] => 2022-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4490 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18084292 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/084292
Inter-level connection for multi-layer structures Dec 18, 2022 Issued
Array ( [id] => 18456278 [patent_doc_number] => 20230197560 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => THERMOELECTRIC COOLING IN MICROELECTRONICS [patent_app_type] => utility [patent_app_number] => 18/067668 [patent_app_country] => US [patent_app_date] => 2022-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7647 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18067668 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/067668
THERMOELECTRIC COOLING IN MICROELECTRONICS Dec 15, 2022 Pending
Array ( [id] => 18540881 [patent_doc_number] => 20230245992 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME [patent_app_type] => utility [patent_app_number] => 18/081248 [patent_app_country] => US [patent_app_date] => 2022-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3479 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18081248 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/081248
INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME Dec 13, 2022 Pending
Array ( [id] => 18840221 [patent_doc_number] => 11848302 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-19 [patent_title] => Chip package structure with ring-like structure [patent_app_type] => utility [patent_app_number] => 18/065156 [patent_app_country] => US [patent_app_date] => 2022-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 7969 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18065156 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/065156
Chip package structure with ring-like structure Dec 12, 2022 Issued
Array ( [id] => 19046689 [patent_doc_number] => 11935809 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements [patent_app_type] => utility [patent_app_number] => 18/064607 [patent_app_country] => US [patent_app_date] => 2022-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 21 [patent_no_of_words] => 5506 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18064607 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/064607
Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements Dec 11, 2022 Issued
Array ( [id] => 19751749 [patent_doc_number] => 20250040314 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-30 [patent_title] => Light-Emitting Device and Manufacturing Method Thereof, Taillight and Vehicle [patent_app_type] => utility [patent_app_number] => 18/278229 [patent_app_country] => US [patent_app_date] => 2022-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8704 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18278229 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/278229
Light-Emitting Device and Manufacturing Method Thereof, Taillight and Vehicle Nov 28, 2022 Pending
Array ( [id] => 20132311 [patent_doc_number] => 12374629 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-29 [patent_title] => Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assembly [patent_app_type] => utility [patent_app_number] => 17/988844 [patent_app_country] => US [patent_app_date] => 2022-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 0 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 296 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17988844 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/988844
Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assembly Nov 16, 2022 Issued
Array ( [id] => 19191471 [patent_doc_number] => 20240170384 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-23 [patent_title] => DOUBLE SIDE MOLDED LAND GRID ARRAY PACKAGE PLATFORM USING A SUBSTRATE WITH COPPER POSTS [patent_app_type] => utility [patent_app_number] => 17/989559 [patent_app_country] => US [patent_app_date] => 2022-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4664 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17989559 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/989559
DOUBLE SIDE MOLDED LAND GRID ARRAY PACKAGE PLATFORM USING A SUBSTRATE WITH COPPER POSTS Nov 16, 2022 Pending
Array ( [id] => 19183781 [patent_doc_number] => 11990381 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-05-21 [patent_title] => Integrated circuit packages having support rings [patent_app_type] => utility [patent_app_number] => 17/986498 [patent_app_country] => US [patent_app_date] => 2022-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 8799 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17986498 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/986498
Integrated circuit packages having support rings Nov 13, 2022 Issued
Array ( [id] => 18242659 [patent_doc_number] => 20230074970 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-09 [patent_title] => SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING [patent_app_type] => utility [patent_app_number] => 18/053869 [patent_app_country] => US [patent_app_date] => 2022-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14413 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18053869 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/053869
Sacrificial redistribution layer in microelectronic assemblies having direct bonding Nov 8, 2022 Issued
Array ( [id] => 18195607 [patent_doc_number] => 20230049126 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-02-16 [patent_title] => CHIP PACKAGE [patent_app_type] => utility [patent_app_number] => 17/980507 [patent_app_country] => US [patent_app_date] => 2022-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4624 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17980507 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/980507
Chip package including substrate having through hole and redistribution line Nov 2, 2022 Issued
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