Search

Dilinh P. Nguyen

Examiner (ID: 17194, Phone: (571)272-1712 , Office: P/2893 )

Most Active Art Unit
2893
Art Unit(s)
2894, 2818, 2893, 2814
Total Applications
984
Issued Applications
760
Pending Applications
22
Abandoned Applications
204

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19063078 [patent_doc_number] => 11942327 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-26 [patent_title] => Singulation of silicon carbide semiconductor wafers [patent_app_type] => utility [patent_app_number] => 17/659388 [patent_app_country] => US [patent_app_date] => 2022-04-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 5235 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17659388 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/659388
Singulation of silicon carbide semiconductor wafers Apr 14, 2022 Issued
Array ( [id] => 17738043 [patent_doc_number] => 20220223505 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-07-14 [patent_title] => SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE [patent_app_type] => utility [patent_app_number] => 17/708955 [patent_app_country] => US [patent_app_date] => 2022-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15494 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -3 [patent_words_short_claim] => 273 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17708955 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/708955
Semiconductor device and measurement device Mar 29, 2022 Issued
Array ( [id] => 17917567 [patent_doc_number] => 20220319963 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-06 [patent_title] => SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MANUFACTURING [patent_app_type] => utility [patent_app_number] => 17/700259 [patent_app_country] => US [patent_app_date] => 2022-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13861 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17700259 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/700259
SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MANUFACTURING Mar 20, 2022 Pending
Array ( [id] => 18256483 [patent_doc_number] => 20230083522 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/692643 [patent_app_country] => US [patent_app_date] => 2022-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11219 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17692643 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/692643
Semiconductor device having plural stacked first chips sealed in a sealing portion and a second chip disposed in a recess provided in the sealing portion Mar 10, 2022 Issued
Array ( [id] => 19679417 [patent_doc_number] => 12191290 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-07 [patent_title] => Semiconductor package with recessed molding region disposed below housing and above semiconductor chip [patent_app_type] => utility [patent_app_number] => 17/671742 [patent_app_country] => US [patent_app_date] => 2022-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5616 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17671742 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/671742
Semiconductor package with recessed molding region disposed below housing and above semiconductor chip Feb 14, 2022 Issued
Array ( [id] => 18112943 [patent_doc_number] => 20230005823 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-05 [patent_title] => SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/591527 [patent_app_country] => US [patent_app_date] => 2022-02-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4736 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17591527 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/591527
Semiconductor device having lead connecting a semiconductor chip to a frame and projection extending from frame and a method of manufacturing semiconductor device Feb 1, 2022 Issued
Array ( [id] => 19356910 [patent_doc_number] => 12057367 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-06 [patent_title] => Semiconductor device and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/586264 [patent_app_country] => US [patent_app_date] => 2022-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 14244 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17586264 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/586264
Semiconductor device and method for manufacturing the same Jan 26, 2022 Issued
Array ( [id] => 17599631 [patent_doc_number] => 20220149205 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-12 [patent_title] => SEMICONDUCTOR DEVICE, DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR DEVICE, AND AN ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/585645 [patent_app_country] => US [patent_app_date] => 2022-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 54258 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -1 [patent_words_short_claim] => 356 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17585645 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/585645
Semiconductor device, display device including the semiconductor device, and an electronic device including the semiconductor device Jan 26, 2022 Issued
Array ( [id] => 19277304 [patent_doc_number] => 12027436 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-02 [patent_title] => Package with clip having through hole accommodating component-related structure [patent_app_type] => utility [patent_app_number] => 17/575038 [patent_app_country] => US [patent_app_date] => 2022-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 7254 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17575038 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/575038
Package with clip having through hole accommodating component-related structure Jan 12, 2022 Issued
Array ( [id] => 17795614 [patent_doc_number] => 20220254706 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-11 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/568327 [patent_app_country] => US [patent_app_date] => 2022-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4307 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17568327 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/568327
SEMICONDUCTOR DEVICE Jan 3, 2022 Abandoned
Array ( [id] => 18488435 [patent_doc_number] => 20230215783 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-06 [patent_title] => SEMICONDUCTOR PACKAGE HAVING MOLD LOCKING FEATURE [patent_app_type] => utility [patent_app_number] => 17/566294 [patent_app_country] => US [patent_app_date] => 2021-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3058 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17566294 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/566294
Semiconductor package having mold locking feature Dec 29, 2021 Issued
Array ( [id] => 19370506 [patent_doc_number] => 12062600 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-13 [patent_title] => Lead frame and semiconductor device [patent_app_type] => utility [patent_app_number] => 17/644640 [patent_app_country] => US [patent_app_date] => 2021-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 40 [patent_no_of_words] => 6130 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17644640 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/644640
Lead frame and semiconductor device Dec 15, 2021 Issued
Array ( [id] => 17523127 [patent_doc_number] => 20220108976 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-07 [patent_title] => PACKAGE STACKING USING CHIP TO WAFER BONDING [patent_app_type] => utility [patent_app_number] => 17/553679 [patent_app_country] => US [patent_app_date] => 2021-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5334 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 265 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17553679 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/553679
Package stacking using chip to wafer bonding Dec 15, 2021 Issued
Array ( [id] => 19079430 [patent_doc_number] => 11948806 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-02 [patent_title] => Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device [patent_app_type] => utility [patent_app_number] => 17/549280 [patent_app_country] => US [patent_app_date] => 2021-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 14 [patent_no_of_words] => 4375 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 244 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17549280 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/549280
Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device Dec 12, 2021 Issued
Array ( [id] => 17509063 [patent_doc_number] => 20220102166 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-31 [patent_title] => LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL [patent_app_type] => utility [patent_app_number] => 17/546960 [patent_app_country] => US [patent_app_date] => 2021-12-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3573 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17546960 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/546960
Leadframe package with pre-applied filler material Dec 8, 2021 Issued
Array ( [id] => 19356921 [patent_doc_number] => 12057378 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-06 [patent_title] => Semiconductor devices and methods of manufacturing semiconductor devices [patent_app_type] => utility [patent_app_number] => 17/544872 [patent_app_country] => US [patent_app_date] => 2021-12-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 42 [patent_no_of_words] => 7895 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 263 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17544872 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/544872
Semiconductor devices and methods of manufacturing semiconductor devices Dec 6, 2021 Issued
Array ( [id] => 17645282 [patent_doc_number] => 20220173021 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-02 [patent_title] => SEMICONDUCTOR DEVICE, CORRESPONDING MANUFACTURING METHODS AND COMPONENT [patent_app_type] => utility [patent_app_number] => 17/539653 [patent_app_country] => US [patent_app_date] => 2021-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3984 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -26 [patent_words_short_claim] => 32 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17539653 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/539653
SEMICONDUCTOR DEVICE, CORRESPONDING MANUFACTURING METHODS AND COMPONENT Nov 30, 2021 Abandoned
Array ( [id] => 18394770 [patent_doc_number] => 20230162991 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-25 [patent_title] => METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES, PACKAGED SEMICONDUCTOR DEVICES, AND PACKAGE MOLDS FOR FORMING PACKAGED SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 17/532027 [patent_app_country] => US [patent_app_date] => 2021-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4007 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17532027 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/532027
Packaged semiconductor devices, and package molds for forming packaged semiconductor devices Nov 21, 2021 Issued
Array ( [id] => 19552871 [patent_doc_number] => 12136583 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-11-05 [patent_title] => Method of forming a chip package, method of forming a semiconductor arrangement, chip package, and semiconductor arrangement [patent_app_type] => utility [patent_app_number] => 17/519805 [patent_app_country] => US [patent_app_date] => 2021-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 35 [patent_no_of_words] => 5957 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17519805 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/519805
Method of forming a chip package, method of forming a semiconductor arrangement, chip package, and semiconductor arrangement Nov 4, 2021 Issued
Array ( [id] => 18704732 [patent_doc_number] => 11791249 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-10-17 [patent_title] => Thermally enhanced isolated power converter package [patent_app_type] => utility [patent_app_number] => 17/515150 [patent_app_country] => US [patent_app_date] => 2021-10-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 3253 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 216 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17515150 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/515150
Thermally enhanced isolated power converter package Oct 28, 2021 Issued
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