Search

Dinh Nguyen

Examiner (ID: 9375, Phone: (571)270-3196 , Office: P/2645 )

Most Active Art Unit
2645
Art Unit(s)
2617, 2645, 2647
Total Applications
734
Issued Applications
541
Pending Applications
13
Abandoned Applications
196

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4376887 [patent_doc_number] => 06288452 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-11 [patent_title] => 'Semiconductor device including registration accuracy marks' [patent_app_type] => 1 [patent_app_number] => 9/281111 [patent_app_country] => US [patent_app_date] => 1999-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 20 [patent_no_of_words] => 2693 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/288/06288452.pdf [firstpage_image] =>[orig_patent_app_number] => 281111 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/281111
Semiconductor device including registration accuracy marks Mar 28, 1999 Issued
Array ( [id] => 4257877 [patent_doc_number] => 06208031 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-27 [patent_title] => 'Circuit fabrication using a particle filled adhesive' [patent_app_type] => 1 [patent_app_number] => 9/267497 [patent_app_country] => US [patent_app_date] => 1999-03-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2523 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/208/06208031.pdf [firstpage_image] =>[orig_patent_app_number] => 267497 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/267497
Circuit fabrication using a particle filled adhesive Mar 11, 1999 Issued
Array ( [id] => 4266174 [patent_doc_number] => 06259156 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-10 [patent_title] => 'Semiconductor device and method for manufacturing same' [patent_app_type] => 1 [patent_app_number] => 9/266652 [patent_app_country] => US [patent_app_date] => 1999-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 3541 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/259/06259156.pdf [firstpage_image] =>[orig_patent_app_number] => 266652 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/266652
Semiconductor device and method for manufacturing same Mar 10, 1999 Issued
Array ( [id] => 4292879 [patent_doc_number] => 06268660 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-07-31 [patent_title] => 'Silicon packaging with through wafer interconnects' [patent_app_type] => 1 [patent_app_number] => 9/263032 [patent_app_country] => US [patent_app_date] => 1999-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4024 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/268/06268660.pdf [firstpage_image] =>[orig_patent_app_number] => 263032 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/263032
Silicon packaging with through wafer interconnects Mar 4, 1999 Issued
Array ( [id] => 6221929 [patent_doc_number] => 20020003281 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-10 [patent_title] => 'COMPOSITE COMPONENTS AND THE METHOD OF MANUFACTURING THE SAME' [patent_app_type] => new [patent_app_number] => 09/255701 [patent_app_country] => US [patent_app_date] => 1999-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3449 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0003/20020003281.pdf [firstpage_image] =>[orig_patent_app_number] => 09255701 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/255701
Composite components and the method of manufacturing the same Feb 22, 1999 Issued
Array ( [id] => 4331777 [patent_doc_number] => 06329700 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-11 [patent_title] => 'Semiconductor wafer and semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/253041 [patent_app_country] => US [patent_app_date] => 1999-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3512 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/329/06329700.pdf [firstpage_image] =>[orig_patent_app_number] => 253041 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/253041
Semiconductor wafer and semiconductor device Feb 18, 1999 Issued
Array ( [id] => 1597192 [patent_doc_number] => 06384479 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-07 [patent_title] => 'Semiconductor integrated circuit device' [patent_app_type] => B1 [patent_app_number] => 09/252801 [patent_app_country] => US [patent_app_date] => 1999-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 2734 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 201 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/384/06384479.pdf [firstpage_image] =>[orig_patent_app_number] => 09252801 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/252801
Semiconductor integrated circuit device Feb 18, 1999 Issued
Array ( [id] => 4364825 [patent_doc_number] => 06191477 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-02-20 [patent_title] => 'Leadless chip carrier design and structure' [patent_app_type] => 1 [patent_app_number] => 9/252851 [patent_app_country] => US [patent_app_date] => 1999-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2647 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/191/06191477.pdf [firstpage_image] =>[orig_patent_app_number] => 252851 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/252851
Leadless chip carrier design and structure Feb 16, 1999 Issued
Array ( [id] => 1522290 [patent_doc_number] => 06414375 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-07-02 [patent_title] => 'Semiconductor device with metal silicide film on partial area of substrate surface and its manufacture method' [patent_app_type] => B1 [patent_app_number] => 09/236091 [patent_app_country] => US [patent_app_date] => 1999-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 47 [patent_no_of_words] => 9454 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/414/06414375.pdf [firstpage_image] =>[orig_patent_app_number] => 09236091 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/236091
Semiconductor device with metal silicide film on partial area of substrate surface and its manufacture method Jan 24, 1999 Issued
Array ( [id] => 1455512 [patent_doc_number] => 06462406 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-10-08 [patent_title] => 'Semiconductor device and lead frame' [patent_app_type] => B2 [patent_app_number] => 09/234712 [patent_app_country] => US [patent_app_date] => 1999-01-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 31 [patent_no_of_words] => 5239 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/462/06462406.pdf [firstpage_image] =>[orig_patent_app_number] => 09234712 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/234712
Semiconductor device and lead frame Jan 20, 1999 Issued
Array ( [id] => 4294325 [patent_doc_number] => 06211567 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-04-03 [patent_title] => 'Top heatsink for IGBT' [patent_app_type] => 1 [patent_app_number] => 9/232491 [patent_app_country] => US [patent_app_date] => 1999-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 1596 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/211/06211567.pdf [firstpage_image] =>[orig_patent_app_number] => 232491 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/232491
Top heatsink for IGBT Jan 14, 1999 Issued
Array ( [id] => 6897472 [patent_doc_number] => 20010045637 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-29 [patent_title] => 'METHOD AND APPARATUS FOR INJECTION MOLDED FLIP CHIP ENCAPSULATION' [patent_app_type] => new [patent_app_number] => 09/228601 [patent_app_country] => US [patent_app_date] => 1999-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3715 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0045/20010045637.pdf [firstpage_image] =>[orig_patent_app_number] => 09228601 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/228601
Method and apparatus for injection molded flip chip encapsulation Jan 11, 1999 Issued
Array ( [id] => 1404462 [patent_doc_number] => 06541872 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-04-01 [patent_title] => 'Multi-layered adhesive for attaching a semiconductor die to a substrate' [patent_app_type] => B1 [patent_app_number] => 09/227942 [patent_app_country] => US [patent_app_date] => 1999-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 4728 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/541/06541872.pdf [firstpage_image] =>[orig_patent_app_number] => 09227942 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/227942
Multi-layered adhesive for attaching a semiconductor die to a substrate Jan 10, 1999 Issued
Array ( [id] => 4411110 [patent_doc_number] => 06232664 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-05-15 [patent_title] => 'Semiconductor device having A1 alloy wiring' [patent_app_type] => 1 [patent_app_number] => 9/227263 [patent_app_country] => US [patent_app_date] => 1999-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 3052 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/232/06232664.pdf [firstpage_image] =>[orig_patent_app_number] => 227263 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/227263
Semiconductor device having A1 alloy wiring Jan 7, 1999 Issued
09/216791 TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S Dec 20, 1998 Abandoned
Array ( [id] => 4255066 [patent_doc_number] => 06222268 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-04-24 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 9/215203 [patent_app_country] => US [patent_app_date] => 1998-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 31 [patent_no_of_words] => 6373 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/222/06222268.pdf [firstpage_image] =>[orig_patent_app_number] => 215203 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/215203
Semiconductor device and method for manufacturing the same Dec 17, 1998 Issued
Array ( [id] => 4363766 [patent_doc_number] => 06169325 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-01-02 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 9/210883 [patent_app_country] => US [patent_app_date] => 1998-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 39 [patent_no_of_words] => 4879 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 330 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/169/06169325.pdf [firstpage_image] =>[orig_patent_app_number] => 210883 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/210883
Semiconductor device Dec 14, 1998 Issued
Array ( [id] => 4319949 [patent_doc_number] => 06242799 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-05 [patent_title] => 'Anisotropic stress buffer and semiconductor device using the same' [patent_app_type] => 1 [patent_app_number] => 9/192490 [patent_app_country] => US [patent_app_date] => 1998-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 4782 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/242/06242799.pdf [firstpage_image] =>[orig_patent_app_number] => 192490 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/192490
Anisotropic stress buffer and semiconductor device using the same Nov 16, 1998 Issued
Array ( [id] => 4301688 [patent_doc_number] => 06198164 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-03-06 [patent_title] => 'Ultra high density integrated circuit semiconductor package and method for fabricating the same' [patent_app_type] => 1 [patent_app_number] => 9/191193 [patent_app_country] => US [patent_app_date] => 1998-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 33 [patent_no_of_words] => 5700 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/198/06198164.pdf [firstpage_image] =>[orig_patent_app_number] => 191193 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/191193
Ultra high density integrated circuit semiconductor package and method for fabricating the same Nov 12, 1998 Issued
Array ( [id] => 1364040 [patent_doc_number] => 06573538 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-06-03 [patent_title] => 'Semiconductor device with internal heat dissipation' [patent_app_type] => B2 [patent_app_number] => 09/191721 [patent_app_country] => US [patent_app_date] => 1998-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 3814 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/573/06573538.pdf [firstpage_image] =>[orig_patent_app_number] => 09191721 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/191721
Semiconductor device with internal heat dissipation Nov 11, 1998 Issued
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