
Dinh Nguyen
Examiner (ID: 9375, Phone: (571)270-3196 , Office: P/2645 )
| Most Active Art Unit | 2645 |
| Art Unit(s) | 2617, 2645, 2647 |
| Total Applications | 734 |
| Issued Applications | 541 |
| Pending Applications | 13 |
| Abandoned Applications | 196 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4376887
[patent_doc_number] => 06288452
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-09-11
[patent_title] => 'Semiconductor device including registration accuracy marks'
[patent_app_type] => 1
[patent_app_number] => 9/281111
[patent_app_country] => US
[patent_app_date] => 1999-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 20
[patent_no_of_words] => 2693
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 144
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/288/06288452.pdf
[firstpage_image] =>[orig_patent_app_number] => 281111
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/281111 | Semiconductor device including registration accuracy marks | Mar 28, 1999 | Issued |
Array
(
[id] => 4257877
[patent_doc_number] => 06208031
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-03-27
[patent_title] => 'Circuit fabrication using a particle filled adhesive'
[patent_app_type] => 1
[patent_app_number] => 9/267497
[patent_app_country] => US
[patent_app_date] => 1999-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 2523
[patent_no_of_claims] => 15
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[patent_words_short_claim] => 86
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/208/06208031.pdf
[firstpage_image] =>[orig_patent_app_number] => 267497
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/267497 | Circuit fabrication using a particle filled adhesive | Mar 11, 1999 | Issued |
Array
(
[id] => 4266174
[patent_doc_number] => 06259156
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-10
[patent_title] => 'Semiconductor device and method for manufacturing same'
[patent_app_type] => 1
[patent_app_number] => 9/266652
[patent_app_country] => US
[patent_app_date] => 1999-03-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[firstpage_image] =>[orig_patent_app_number] => 266652
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/266652 | Semiconductor device and method for manufacturing same | Mar 10, 1999 | Issued |
Array
(
[id] => 4292879
[patent_doc_number] => 06268660
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-07-31
[patent_title] => 'Silicon packaging with through wafer interconnects'
[patent_app_type] => 1
[patent_app_number] => 9/263032
[patent_app_country] => US
[patent_app_date] => 1999-03-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 4024
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/268/06268660.pdf
[firstpage_image] =>[orig_patent_app_number] => 263032
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/263032 | Silicon packaging with through wafer interconnects | Mar 4, 1999 | Issued |
Array
(
[id] => 6221929
[patent_doc_number] => 20020003281
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-10
[patent_title] => 'COMPOSITE COMPONENTS AND THE METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => new
[patent_app_number] => 09/255701
[patent_app_country] => US
[patent_app_date] => 1999-02-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0003/20020003281.pdf
[firstpage_image] =>[orig_patent_app_number] => 09255701
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/255701 | Composite components and the method of manufacturing the same | Feb 22, 1999 | Issued |
Array
(
[id] => 4331777
[patent_doc_number] => 06329700
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-11
[patent_title] => 'Semiconductor wafer and semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 9/253041
[patent_app_country] => US
[patent_app_date] => 1999-02-19
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[pdf_file] => patents/06/329/06329700.pdf
[firstpage_image] =>[orig_patent_app_number] => 253041
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/253041 | Semiconductor wafer and semiconductor device | Feb 18, 1999 | Issued |
Array
(
[id] => 1597192
[patent_doc_number] => 06384479
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-07
[patent_title] => 'Semiconductor integrated circuit device'
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[patent_app_number] => 09/252801
[patent_app_country] => US
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[pdf_file] => patents/06/384/06384479.pdf
[firstpage_image] =>[orig_patent_app_number] => 09252801
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/252801 | Semiconductor integrated circuit device | Feb 18, 1999 | Issued |
Array
(
[id] => 4364825
[patent_doc_number] => 06191477
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-02-20
[patent_title] => 'Leadless chip carrier design and structure'
[patent_app_type] => 1
[patent_app_number] => 9/252851
[patent_app_country] => US
[patent_app_date] => 1999-02-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2647
[patent_no_of_claims] => 17
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/191/06191477.pdf
[firstpage_image] =>[orig_patent_app_number] => 252851
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/252851 | Leadless chip carrier design and structure | Feb 16, 1999 | Issued |
Array
(
[id] => 1522290
[patent_doc_number] => 06414375
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-02
[patent_title] => 'Semiconductor device with metal silicide film on partial area of substrate surface and its manufacture method'
[patent_app_type] => B1
[patent_app_number] => 09/236091
[patent_app_country] => US
[patent_app_date] => 1999-01-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[pdf_file] => patents/06/414/06414375.pdf
[firstpage_image] =>[orig_patent_app_number] => 09236091
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/236091 | Semiconductor device with metal silicide film on partial area of substrate surface and its manufacture method | Jan 24, 1999 | Issued |
Array
(
[id] => 1455512
[patent_doc_number] => 06462406
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-10-08
[patent_title] => 'Semiconductor device and lead frame'
[patent_app_type] => B2
[patent_app_number] => 09/234712
[patent_app_country] => US
[patent_app_date] => 1999-01-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 5239
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[pdf_file] => patents/06/462/06462406.pdf
[firstpage_image] =>[orig_patent_app_number] => 09234712
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/234712 | Semiconductor device and lead frame | Jan 20, 1999 | Issued |
Array
(
[id] => 4294325
[patent_doc_number] => 06211567
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-04-03
[patent_title] => 'Top heatsink for IGBT'
[patent_app_type] => 1
[patent_app_number] => 9/232491
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/211/06211567.pdf
[firstpage_image] =>[orig_patent_app_number] => 232491
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/232491 | Top heatsink for IGBT | Jan 14, 1999 | Issued |
Array
(
[id] => 6897472
[patent_doc_number] => 20010045637
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-11-29
[patent_title] => 'METHOD AND APPARATUS FOR INJECTION MOLDED FLIP CHIP ENCAPSULATION'
[patent_app_type] => new
[patent_app_number] => 09/228601
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[pdf_file] => publications/A1/0045/20010045637.pdf
[firstpage_image] =>[orig_patent_app_number] => 09228601
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/228601 | Method and apparatus for injection molded flip chip encapsulation | Jan 11, 1999 | Issued |
Array
(
[id] => 1404462
[patent_doc_number] => 06541872
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-04-01
[patent_title] => 'Multi-layered adhesive for attaching a semiconductor die to a substrate'
[patent_app_type] => B1
[patent_app_number] => 09/227942
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Array
(
[id] => 4411110
[patent_doc_number] => 06232664
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-05-15
[patent_title] => 'Semiconductor device having A1 alloy wiring'
[patent_app_type] => 1
[patent_app_number] => 9/227263
[patent_app_country] => US
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[pdf_file] => patents/06/232/06232664.pdf
[firstpage_image] =>[orig_patent_app_number] => 227263
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/227263 | Semiconductor device having A1 alloy wiring | Jan 7, 1999 | Issued |
| 09/216791 | TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S | Dec 20, 1998 | Abandoned |
Array
(
[id] => 4255066
[patent_doc_number] => 06222268
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[firstpage_image] =>[orig_patent_app_number] => 215203
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/215203 | Semiconductor device and method for manufacturing the same | Dec 17, 1998 | Issued |
Array
(
[id] => 4363766
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[firstpage_image] =>[orig_patent_app_number] => 210883
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/210883 | Semiconductor device | Dec 14, 1998 | Issued |
Array
(
[id] => 4319949
[patent_doc_number] => 06242799
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[patent_kind] => NA
[patent_issue_date] => 2001-06-05
[patent_title] => 'Anisotropic stress buffer and semiconductor device using the same'
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[pdf_file] => patents/06/242/06242799.pdf
[firstpage_image] =>[orig_patent_app_number] => 192490
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/192490 | Anisotropic stress buffer and semiconductor device using the same | Nov 16, 1998 | Issued |
Array
(
[id] => 4301688
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[firstpage_image] =>[orig_patent_app_number] => 191193
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/191193 | Ultra high density integrated circuit semiconductor package and method for fabricating the same | Nov 12, 1998 | Issued |
Array
(
[id] => 1364040
[patent_doc_number] => 06573538
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[patent_title] => 'Semiconductor device with internal heat dissipation'
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[firstpage_image] =>[orig_patent_app_number] => 09191721
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/191721 | Semiconductor device with internal heat dissipation | Nov 11, 1998 | Issued |