Search

Douglas W. Owens

Examiner (ID: 10431)

Most Active Art Unit
2811
Art Unit(s)
2821, 2844, 2823, 2897, 2814, 2811
Total Applications
1072
Issued Applications
875
Pending Applications
94
Abandoned Applications
125

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19206311 [patent_doc_number] => 20240178210 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => THREE LAYER SYSTEM IN PACKAGE AND A METHOD OF ENABLING THEREOF [patent_app_type] => utility [patent_app_number] => 18/525356 [patent_app_country] => US [patent_app_date] => 2023-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8379 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 276 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18525356 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/525356
THREE LAYER SYSTEM IN PACKAGE AND A METHOD OF ENABLING THEREOF Nov 29, 2023 Pending
Array ( [id] => 19966644 [patent_doc_number] => 12336181 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-06-17 [patent_title] => Three-dimensional memory device having source-select-gate cut structures and methods for forming the same [patent_app_type] => utility [patent_app_number] => 18/518798 [patent_app_country] => US [patent_app_date] => 2023-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 16 [patent_no_of_words] => 16404 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18518798 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/518798
Three-dimensional memory device having source-select-gate cut structures and methods for forming the same Nov 23, 2023 Issued
Array ( [id] => 19038265 [patent_doc_number] => 20240088080 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS [patent_app_type] => utility [patent_app_number] => 18/514466 [patent_app_country] => US [patent_app_date] => 2023-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6337 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18514466 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/514466
Electroplated indium bump stacks for cryogenic electronics Nov 19, 2023 Issued
Array ( [id] => 19255263 [patent_doc_number] => 20240206260 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-20 [patent_title] => DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 18/512896 [patent_app_country] => US [patent_app_date] => 2023-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13321 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18512896 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/512896
DISPLAY DEVICE Nov 16, 2023 Issued
Array ( [id] => 19176137 [patent_doc_number] => 20240162111 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-16 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS [patent_app_type] => utility [patent_app_number] => 18/510056 [patent_app_country] => US [patent_app_date] => 2023-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4157 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18510056 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/510056
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYERS Nov 14, 2023 Pending
Array ( [id] => 19452990 [patent_doc_number] => 20240313120 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-19 [patent_title] => SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/508612 [patent_app_country] => US [patent_app_date] => 2023-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6450 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18508612 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/508612
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Nov 13, 2023 Pending
Array ( [id] => 20175983 [patent_doc_number] => 12394740 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-08-19 [patent_title] => Solder based hybrid bonding for fine pitch and thin BLT interconnection [patent_app_type] => utility [patent_app_number] => 18/502389 [patent_app_country] => US [patent_app_date] => 2023-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 0 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18502389 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/502389
Solder based hybrid bonding for fine pitch and thin BLT interconnection Nov 5, 2023 Issued
Array ( [id] => 20111564 [patent_doc_number] => 12362300 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-15 [patent_title] => Electronic substrate and electronic device [patent_app_type] => utility [patent_app_number] => 18/489871 [patent_app_country] => US [patent_app_date] => 2023-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 0 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18489871 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/489871
Electronic substrate and electronic device Oct 18, 2023 Issued
Array ( [id] => 19766042 [patent_doc_number] => 12224345 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-11 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/489389 [patent_app_country] => US [patent_app_date] => 2023-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 31 [patent_no_of_words] => 7032 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 259 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18489389 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/489389
Semiconductor device Oct 17, 2023 Issued
Array ( [id] => 20204131 [patent_doc_number] => 12406915 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-02 [patent_title] => Plated metal layer in power packages [patent_app_type] => utility [patent_app_number] => 18/484310 [patent_app_country] => US [patent_app_date] => 2023-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 0 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18484310 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/484310
Plated metal layer in power packages Oct 9, 2023 Issued
Array ( [id] => 20267073 [patent_doc_number] => 12438072 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-07 [patent_title] => Multilayer package substrate with stress buffer [patent_app_type] => utility [patent_app_number] => 18/482944 [patent_app_country] => US [patent_app_date] => 2023-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 19 [patent_no_of_words] => 0 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18482944 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/482944
Multilayer package substrate with stress buffer Oct 8, 2023 Issued
Array ( [id] => 19116463 [patent_doc_number] => 20240128213 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-18 [patent_title] => Platinum-Based Solder Body Contacts for Integration of a First Substrate with a Second Substrate [patent_app_type] => utility [patent_app_number] => 18/375687 [patent_app_country] => US [patent_app_date] => 2023-10-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6853 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18375687 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/375687
Platinum-based solder body contacts for integration of a first substrate with a second substrate Oct 1, 2023 Issued
Array ( [id] => 18927209 [patent_doc_number] => 20240030213 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-25 [patent_title] => HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES [patent_app_type] => utility [patent_app_number] => 18/474275 [patent_app_country] => US [patent_app_date] => 2023-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 46924 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18474275 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/474275
Hybrid manufacturing for integrated circuit devices and assemblies Sep 25, 2023 Issued
Array ( [id] => 19964940 [patent_doc_number] => 12334460 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-06-17 [patent_title] => Semiconductor device and manufacturing method of semiconductor device [patent_app_type] => utility [patent_app_number] => 18/469469 [patent_app_country] => US [patent_app_date] => 2023-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 39 [patent_no_of_words] => 7824 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18469469 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/469469
Semiconductor device and manufacturing method of semiconductor device Sep 17, 2023 Issued
Array ( [id] => 19407166 [patent_doc_number] => 20240290677 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-29 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/459111 [patent_app_country] => US [patent_app_date] => 2023-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7214 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18459111 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/459111
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Aug 30, 2023 Pending
Array ( [id] => 18821207 [patent_doc_number] => 20230395548 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/236545 [patent_app_country] => US [patent_app_date] => 2023-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12578 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18236545 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/236545
Semiconductor package Aug 21, 2023 Issued
Array ( [id] => 18821207 [patent_doc_number] => 20230395548 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/236545 [patent_app_country] => US [patent_app_date] => 2023-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12578 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18236545 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/236545
Semiconductor package Aug 21, 2023 Issued
Array ( [id] => 18821207 [patent_doc_number] => 20230395548 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/236545 [patent_app_country] => US [patent_app_date] => 2023-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12578 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18236545 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/236545
Semiconductor package Aug 21, 2023 Issued
Array ( [id] => 18821207 [patent_doc_number] => 20230395548 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/236545 [patent_app_country] => US [patent_app_date] => 2023-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12578 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18236545 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/236545
Semiconductor package Aug 21, 2023 Issued
Array ( [id] => 19806188 [patent_doc_number] => 20250072113 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-27 [patent_title] => Stacked FET With Local Contact [patent_app_type] => utility [patent_app_number] => 18/453285 [patent_app_country] => US [patent_app_date] => 2023-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10274 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18453285 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/453285
Stacked FET With Local Contact Aug 20, 2023 Pending
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