
Dung H. Bui
Examiner (ID: 7927, Phone: (571)270-7077 , Office: P/1773 )
| Most Active Art Unit | 1773 |
| Art Unit(s) | 4153, 1773, 1797, 1775, 1776, 1772 |
| Total Applications | 1707 |
| Issued Applications | 1289 |
| Pending Applications | 185 |
| Abandoned Applications | 275 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 953711
[patent_doc_number] => 06958123
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-10-25
[patent_title] => 'Method for removing a sacrificial material with a compressed fluid'
[patent_app_type] => utility
[patent_app_number] => 10/167272
[patent_app_country] => US
[patent_app_date] => 2002-06-10
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[pdf_file] => patents/06/958/06958123.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/167272 | Method for removing a sacrificial material with a compressed fluid | Jun 9, 2002 | Issued |
Array
(
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[patent_issue_date] => 2004-04-20
[patent_title] => 'Method of fabricating a semiconductor memory device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/157819 | Method of fabricating a semiconductor memory device | May 30, 2002 | Issued |
Array
(
[id] => 1129318
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[patent_issue_date] => 2004-08-31
[patent_title] => 'Method of protecting a passivation layer during solder bump formation'
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[patent_app_date] => 2002-05-23
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Array
(
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Array
(
[id] => 1379585
[patent_doc_number] => 06555477
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[patent_kind] => B1
[patent_issue_date] => 2003-04-29
[patent_title] => 'Method for preventing Cu CMP corrosion'
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[patent_app_number] => 10/152939
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/152939 | Method for preventing Cu CMP corrosion | May 21, 2002 | Issued |
Array
(
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[patent_issue_date] => 2002-09-12
[patent_title] => 'Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates'
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[patent_app_number] => 10/142677
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[firstpage_image] =>[orig_patent_app_number] => 10142677
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/142677 | Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates | May 9, 2002 | Issued |
Array
(
[id] => 6607678
[patent_doc_number] => 20030209520
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[patent_title] => 'METHODS FOR ETCHING AN ORGANIC ANTI-REFLECTIVE COATING'
[patent_app_type] => new
[patent_app_number] => 10/143489
[patent_app_country] => US
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[pdf_file] => publications/A1/0209/20030209520.pdf
[firstpage_image] =>[orig_patent_app_number] => 10143489
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/143489 | Methods for etching an organic anti-reflective coating | May 8, 2002 | Issued |
Array
(
[id] => 6636709
[patent_doc_number] => 20030211753
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[patent_kind] => A1
[patent_issue_date] => 2003-11-13
[patent_title] => 'Method of etching a trench in a silicon-on-insulator (SOI) structure'
[patent_app_type] => new
[patent_app_number] => 10/143269
[patent_app_country] => US
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[pdf_file] => publications/A1/0211/20030211753.pdf
[firstpage_image] =>[orig_patent_app_number] => 10143269
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/143269 | Method of etching a trench in a silicon-on-insulator (SOI) structure | May 8, 2002 | Issued |
Array
(
[id] => 1261539
[patent_doc_number] => 06664189
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-12-16
[patent_title] => 'Removal of wafer edge defocus due to CMP'
[patent_app_type] => B1
[patent_app_number] => 10/140659
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/140659 | Removal of wafer edge defocus due to CMP | May 7, 2002 | Issued |
Array
(
[id] => 6563702
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[patent_issue_date] => 2002-11-07
[patent_title] => 'Etchant for patterning indium tin oxide and method of fabricating liquid crystal display device using the same'
[patent_app_type] => new
[patent_app_number] => 10/138639
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/138639 | Etchant for patterning indium tin oxide and method of fabricating liquid crystal display device using the same | May 5, 2002 | Issued |
Array
(
[id] => 6813145
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[patent_issue_date] => 2003-04-17
[patent_title] => 'Method of removing oxidized portions at an interface of a metal surface and capping layer in a semiconductor metallization layer'
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Array
(
[id] => 6801340
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[patent_title] => 'Manufacturing method of semiconductor device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/124729 | Method of manufacturing semiconductor device | Apr 17, 2002 | Issued |
Array
(
[id] => 6789854
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[patent_title] => 'Method of detecting etching process end point in semiconductor fabricating equipment and detector therefor'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/121709 | Method of detecting etching process end point in semiconductor fabricating equipment and detector therefor | Apr 14, 2002 | Abandoned |
| 10/116157 | Creation of local semi-insulating regions on semiconductor substrates | Apr 3, 2002 | Abandoned |
Array
(
[id] => 1028336
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[patent_issue_date] => 2005-04-19
[patent_title] => 'Dry-etching method and apparatus, photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/107329 | Dry-etching method and apparatus, photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof | Mar 27, 2002 | Issued |
Array
(
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Array
(
[id] => 5906989
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Array
(
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/099492 | Chemical mechanical polishing slurry useful for copper substrates | Mar 14, 2002 | Issued |