
Dung H. Bui
Examiner (ID: 7927, Phone: (571)270-7077 , Office: P/1773 )
| Most Active Art Unit | 1773 |
| Art Unit(s) | 4153, 1773, 1797, 1775, 1776, 1772 |
| Total Applications | 1707 |
| Issued Applications | 1289 |
| Pending Applications | 185 |
| Abandoned Applications | 275 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1341912
[patent_doc_number] => 06582618
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[patent_kind] => B1
[patent_issue_date] => 2003-06-24
[patent_title] => 'Method of determining etch endpoint using principal components analysis of optical emission spectra'
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Array
(
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[patent_issue_date] => 2004-08-31
[patent_title] => 'Reactor with remote plasma system and method of processing a semiconductor substrate'
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Array
(
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[patent_title] => 'Method to improve reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and aluminum-copper-TiN layers in integrated circuits'
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Array
(
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[patent_issue_date] => 2001-02-27
[patent_title] => 'Etch residue clean with aqueous HF/organic solution'
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Array
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Array
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Array
(
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[patent_issue_date] => 2001-02-20
[patent_title] => 'Polishing process for manufacturing dopant-striation-free polished silicon wafers'
[patent_app_type] => 1
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Array
(
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[patent_issue_date] => 2003-11-04
[patent_title] => 'Method for testing for blind hole formed in wafer layer'
[patent_app_type] => B1
[patent_app_number] => 09/473029
[patent_app_country] => US
[patent_app_date] => 1999-12-28
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/473029 | Method for testing for blind hole formed in wafer layer | Dec 27, 1999 | Issued |
Array
(
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[patent_title] => 'Mitigation of radiation induced surface contamination'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/470860 | Mitigation of radiation induced surface contamination | Dec 22, 1999 | Issued |
Array
(
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[patent_issue_date] => 2001-07-24
[patent_title] => 'Method of minimizing reactive ion etch damage of organic insulating layers in semiconductor fabrication'
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[patent_app_number] => 9/467389
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Array
(
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[patent_title] => 'High through-put Cu CMP with significantly reduced erosion and dishing'
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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