Edward Chin

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Array ( [id] => 20229302 [patent_doc_number] => 12417958 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-16 [patent_title] => Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone [patent_app_type] => utility [patent_app_number] => 18/399205 [patent_app_country] => US [patent_app_date] => 2023-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 1081 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18399205 [rel_patent_id] =>[rel_patent_doc_number] =>)

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