Eric Chang

Array ( [id] => 308402 [patent_doc_number] => 07532480 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2009-05-12 [patent_title] => 'Power delivery for electronic assemblies' [patent_app_type] => utility [patent_app_number] => 11/611038 [patent_app_country] => US [patent_app_date] => 2006-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4305 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 23 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/532/07532480.pdf [firstpage_image] =>[orig_patent_app_number] => 11611038 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 597082 [patent_doc_number] => 07436660 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-10-14 [patent_title] => 'Heat sinks for electronic enclosures' [patent_app_type] => utility [patent_app_number] => 11/637840 [patent_app_country] => US [patent_app_date] => 2006-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3802 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/436/07436660.pdf [firstpage_image] =>[orig_patent_app_number] => 11637840 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5067890 [patent_doc_number] => 20070188991 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-16 [patent_title] => 'Liquid cooled heat sink with cold plate retention mechanism' [patent_app_type] => utility [patent_app_number] => 11/637633 [patent_app_country] => US [patent_app_date] => 2006-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3174 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0188/20070188991.pdf [firstpage_image] =>[orig_patent_app_number] => 11637633 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 367457 [patent_doc_number] => 07480142 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-20 [patent_title] => 'Boost spring holder for securing a power device to a heatsink' [patent_app_type] => utility [patent_app_number] => 11/637538 [patent_app_country] => US [patent_app_date] => 2006-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 3485 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/480/07480142.pdf [firstpage_image] =>[orig_patent_app_number] => 11637538 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4783963 [patent_doc_number] => 20080137292 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-12 [patent_title] => 'HEAT DISSIPATION DEVICE FOR COMPUTER ADD-ON CARDS' [patent_app_type] => utility [patent_app_number] => 11/608650 [patent_app_country] => US [patent_app_date] => 2006-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1559 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0137/20080137292.pdf [firstpage_image] =>[orig_patent_app_number] => 11608650 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4703126 [patent_doc_number] => 20080062649 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-13 [patent_title] => 'CIRCUIT BOARD WITH A PERFORATED STRUCTURE FOR DISPOSING A HEAT PIPE' [patent_app_type] => utility [patent_app_number] => 11/566236 [patent_app_country] => US [patent_app_date] => 2006-12-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2526 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0062/20080062649.pdf [firstpage_image] =>[orig_patent_app_number] => 11566236 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5253520 [patent_doc_number] => 20070134976 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-14 [patent_title] => 'Power module structure and solid state relay using same' [patent_app_type] => utility [patent_app_number] => 11/607152 [patent_app_country] => US [patent_app_date] => 2006-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 5204 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0134/20070134976.pdf [firstpage_image] =>[orig_patent_app_number] => 11607152 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 902443 [patent_doc_number] => 07339789 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-03-04 [patent_title] => 'Modular, scalable thermal solution' [patent_app_type] => utility [patent_app_number] => 11/565559 [patent_app_country] => US [patent_app_date] => 2006-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5582 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 237 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/339/07339789.pdf [firstpage_image] =>[orig_patent_app_number] => 11565559 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 374223 [patent_doc_number] => 07474529 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-06 [patent_title] => 'Folded-sheet-metal heatsinks for closely packaged heat-producing devices' [patent_app_type] => utility [patent_app_number] => 11/564353 [patent_app_country] => US [patent_app_date] => 2006-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 47 [patent_no_of_words] => 16748 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/474/07474529.pdf [firstpage_image] =>[orig_patent_app_number] => 11564353 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4897984 [patent_doc_number] => 20080117597 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-22 [patent_title] => 'LIGHT EMITTING DIODE MODULE HAVING A THERMAL MANAGEMENT ELEMENT' [patent_app_type] => utility [patent_app_number] => 11/561344 [patent_app_country] => US [patent_app_date] => 2006-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 1752 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0117/20080117597.pdf [firstpage_image] =>[orig_patent_app_number] => 11561344 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 221972 [patent_doc_number] => 07609518 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-10-27 [patent_title] => 'Cooling computer components' [patent_app_type] => utility [patent_app_number] => 11/600440 [patent_app_country] => US [patent_app_date] => 2006-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 4593 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/609/07609518.pdf [firstpage_image] =>[orig_patent_app_number] => 11600440 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 830971 [patent_doc_number] => 07400494 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-07-15 [patent_title] => 'Meter socket assembly and quick change mechanism therefor' [patent_app_type] => utility [patent_app_number] => 11/560146 [patent_app_country] => US [patent_app_date] => 2006-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 7424 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 227 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/400/07400494.pdf [firstpage_image] =>[orig_patent_app_number] => 11560146 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8154727 [patent_doc_number] => 08169791 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-01 [patent_title] => 'Electronic module and method for producing such a module' [patent_app_type] => utility [patent_app_number] => 12/092920 [patent_app_country] => US [patent_app_date] => 2006-11-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 2486 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/169/08169791.pdf [firstpage_image] =>[orig_patent_app_number] => 12092920 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 592942 [patent_doc_number] => 07447033 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-11-04 [patent_title] => 'Embedded thermal-electric cooling modules for surface spreading of heat' [patent_app_type] => utility [patent_app_number] => 11/591851 [patent_app_country] => US [patent_app_date] => 2006-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2497 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/447/07447033.pdf [firstpage_image] =>[orig_patent_app_number] => 11591851 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5094035 [patent_doc_number] => 20070115644 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-24 [patent_title] => 'Method of cooling electronic device and electronic device with improved cooling efficiency' [patent_app_type] => utility [patent_app_number] => 11/589740 [patent_app_country] => US [patent_app_date] => 2006-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3777 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0115/20070115644.pdf [firstpage_image] =>[orig_patent_app_number] => 11589740 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4891938 [patent_doc_number] => 20080101035 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-01 [patent_title] => 'Heat-dissipating assembly structure' [patent_app_type] => utility [patent_app_number] => 11/586636 [patent_app_country] => US [patent_app_date] => 2006-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2041 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0101/20080101035.pdf [firstpage_image] =>[orig_patent_app_number] => 11586636 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 331461 [patent_doc_number] => 07511961 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-03-31 [patent_title] => 'Base plate for a power semiconductor module' [patent_app_type] => utility [patent_app_number] => 11/553248 [patent_app_country] => US [patent_app_date] => 2006-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 17 [patent_no_of_words] => 6804 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/511/07511961.pdf [firstpage_image] =>[orig_patent_app_number] => 11553248 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4891939 [patent_doc_number] => 20080101036 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-01 [patent_title] => 'Heat-dissipating assembly structure' [patent_app_type] => utility [patent_app_number] => 11/586637 [patent_app_country] => US [patent_app_date] => 2006-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1383 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0101/20080101036.pdf [firstpage_image] =>[orig_patent_app_number] => 11586637 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 581150 [patent_doc_number] => 07463485 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2008-12-09 [patent_title] => 'Circuit board housing and circuit board assembly' [patent_app_type] => utility [patent_app_number] => 11/585555 [patent_app_country] => US [patent_app_date] => 2006-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 3634 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/463/07463485.pdf [firstpage_image] =>[orig_patent_app_number] => 11585555 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4744429 [patent_doc_number] => 20080089031 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'Heat sink assembly' [patent_app_type] => utility [patent_app_number] => 11/309883 [patent_app_country] => US [patent_app_date] => 2006-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1120 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20080089031.pdf [firstpage_image] =>[orig_patent_app_number] => 11309883 [rel_patent_id] =>[rel_patent_doc_number] =>)