
Eric Coleman
Examiner (ID: 7488, Phone: (571)272-4163 , Office: P/2183 )
| Most Active Art Unit | 2183 |
| Art Unit(s) | 2302, 2183, 2783 |
| Total Applications | 2413 |
| Issued Applications | 2133 |
| Pending Applications | 67 |
| Abandoned Applications | 235 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10331045
[patent_doc_number] => 20150216049
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-07-30
[patent_title] => 'WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/680371
[patent_app_country] => US
[patent_app_date] => 2015-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 27
[patent_figures_cnt] => 27
[patent_no_of_words] => 9556
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14680371
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/680371 | Wiring board and method for manufacturing the same | Apr 6, 2015 | Issued |
Array
(
[id] => 11180901
[patent_doc_number] => 09412901
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-08-09
[patent_title] => 'Superlattice structure'
[patent_app_type] => utility
[patent_app_number] => 14/675596
[patent_app_country] => US
[patent_app_date] => 2015-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 15
[patent_no_of_words] => 8933
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 109
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14675596
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/675596 | Superlattice structure | Mar 30, 2015 | Issued |
Array
(
[id] => 10689564
[patent_doc_number] => 20160035711
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2016-02-04
[patent_title] => 'STACKED PACKAGE-ON-PACKAGE MEMORY DEVICES'
[patent_app_type] => utility
[patent_app_number] => 14/671623
[patent_app_country] => US
[patent_app_date] => 2015-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 3178
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14671623
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/671623 | Stacked package-on-package memory devices | Mar 26, 2015 | Issued |
Array
(
[id] => 11740195
[patent_doc_number] => 09704788
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-07-11
[patent_title] => 'Power overlay structure and method of making same'
[patent_app_type] => utility
[patent_app_number] => 14/665735
[patent_app_country] => US
[patent_app_date] => 2015-03-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 20
[patent_no_of_words] => 6262
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 79
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14665735
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/665735 | Power overlay structure and method of making same | Mar 22, 2015 | Issued |
Array
(
[id] => 11178812
[patent_doc_number] => 09410799
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-08-09
[patent_title] => 'Device package and methods for the fabrication and testing thereof'
[patent_app_type] => utility
[patent_app_number] => 14/657131
[patent_app_country] => US
[patent_app_date] => 2015-03-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
[patent_figures_cnt] => 60
[patent_no_of_words] => 23047
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 147
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14657131
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/657131 | Device package and methods for the fabrication and testing thereof | Mar 12, 2015 | Issued |
Array
(
[id] => 11787617
[patent_doc_number] => 09397079
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-07-19
[patent_title] => 'Multichip integration with through silicon via (TSV) die embedded in package'
[patent_app_type] => utility
[patent_app_number] => 14/636016
[patent_app_country] => US
[patent_app_date] => 2015-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 25
[patent_no_of_words] => 9402
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14636016
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/636016 | Multichip integration with through silicon via (TSV) die embedded in package | Mar 1, 2015 | Issued |
Array
(
[id] => 10286062
[patent_doc_number] => 20150171061
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-06-18
[patent_title] => 'STACKED PACKAGED INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME'
[patent_app_type] => utility
[patent_app_number] => 14/629094
[patent_app_country] => US
[patent_app_date] => 2015-02-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2000
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14629094
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/629094 | Stacked packaged integrated circuit devices, and methods of making same | Feb 22, 2015 | Issued |
Array
(
[id] => 11770315
[patent_doc_number] => 09379008
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-06-28
[patent_title] => 'Metal PVD-free conducting structures'
[patent_app_type] => utility
[patent_app_number] => 14/627252
[patent_app_country] => US
[patent_app_date] => 2015-02-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 10
[patent_no_of_words] => 5771
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14627252
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/627252 | Metal PVD-free conducting structures | Feb 19, 2015 | Issued |
Array
(
[id] => 11807157
[patent_doc_number] => 09548240
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-01-17
[patent_title] => 'Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 14/616942
[patent_app_country] => US
[patent_app_date] => 2015-02-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 41
[patent_no_of_words] => 11399
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 35
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14616942
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/616942 | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package | Feb 8, 2015 | Issued |
Array
(
[id] => 10260116
[patent_doc_number] => 20150145113
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-05-28
[patent_title] => 'SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 14/611364
[patent_app_country] => US
[patent_app_date] => 2015-02-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 4026
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14611364
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/611364 | Semiconductor package | Feb 1, 2015 | Issued |
Array
(
[id] => 11208160
[patent_doc_number] => 09437793
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-09-06
[patent_title] => 'Package support, fabrication method and LED package'
[patent_app_type] => utility
[patent_app_number] => 14/606038
[patent_app_country] => US
[patent_app_date] => 2015-01-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 22
[patent_no_of_words] => 4966
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 54
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14606038
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/606038 | Package support, fabrication method and LED package | Jan 26, 2015 | Issued |
Array
(
[id] => 10270268
[patent_doc_number] => 20150155265
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-06-04
[patent_title] => 'STACKED MULTI-CHIP INTEGRATED CIRCUIT PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 14/598053
[patent_app_country] => US
[patent_app_date] => 2015-01-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
[patent_figures_cnt] => 26
[patent_no_of_words] => 11696
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14598053
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/598053 | Stacked multi-chip integrated circuit package | Jan 14, 2015 | Issued |
Array
(
[id] => 10230435
[patent_doc_number] => 20150115429
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-04-30
[patent_title] => 'SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 14/585575
[patent_app_country] => US
[patent_app_date] => 2014-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3312
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14585575
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/585575 | Semiconductor package | Dec 29, 2014 | Issued |
Array
(
[id] => 10590617
[patent_doc_number] => 09312237
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-04-12
[patent_title] => 'Integrated circuit package with spatially varied solder resist opening dimension'
[patent_app_type] => utility
[patent_app_number] => 14/581985
[patent_app_country] => US
[patent_app_date] => 2014-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 18
[patent_no_of_words] => 6199
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14581985
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/581985 | Integrated circuit package with spatially varied solder resist opening dimension | Dec 22, 2014 | Issued |
Array
(
[id] => 10583655
[patent_doc_number] => 09305780
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-04-05
[patent_title] => 'Self-limiting chemical vapor deposition and atomic layer deposition methods'
[patent_app_type] => utility
[patent_app_number] => 14/561525
[patent_app_country] => US
[patent_app_date] => 2014-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 4374
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 41
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14561525
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/561525 | Self-limiting chemical vapor deposition and atomic layer deposition methods | Dec 4, 2014 | Issued |
Array
(
[id] => 11904566
[patent_doc_number] => 09774012
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-09-26
[patent_title] => 'Organic light-emitting component'
[patent_app_type] => utility
[patent_app_number] => 15/101407
[patent_app_country] => US
[patent_app_date] => 2014-12-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 6335
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 193
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15101407
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/101407 | Organic light-emitting component | Dec 1, 2014 | Issued |
Array
(
[id] => 11687435
[patent_doc_number] => 09685485
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-06-20
[patent_title] => 'Organic electroluminescent device and manufacturing method therefor'
[patent_app_type] => utility
[patent_app_number] => 15/101528
[patent_app_country] => US
[patent_app_date] => 2014-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 27
[patent_no_of_words] => 29337
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 228
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15101528
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/101528 | Organic electroluminescent device and manufacturing method therefor | Nov 25, 2014 | Issued |
Array
(
[id] => 10260113
[patent_doc_number] => 20150145110
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-05-28
[patent_title] => 'LEADLESS SURFACE MOUNT ASSEMBLY PACKAGE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/553799
[patent_app_country] => US
[patent_app_date] => 2014-11-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 6197
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14553799
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/553799 | Leadless surface mount assembly package and method of manufacturing the same | Nov 24, 2014 | Issued |
Array
(
[id] => 10624674
[patent_doc_number] => 09343624
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-05-17
[patent_title] => 'Light emitting device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 14/552088
[patent_app_country] => US
[patent_app_date] => 2014-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 13
[patent_no_of_words] => 5446
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14552088
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/552088 | Light emitting device and method of manufacturing the same | Nov 23, 2014 | Issued |
Array
(
[id] => 10264110
[patent_doc_number] => 20150149107
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-05-28
[patent_title] => 'LOOPBACK TEST OF THE PROPER OPERATION OF TECHNICAL DEVICES IN AN INDUSTRIAL PROCESS AUTOMATION SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 14/552031
[patent_app_country] => US
[patent_app_date] => 2014-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2395
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14552031
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/552031 | LOOPBACK TEST OF THE PROPER OPERATION OF TECHNICAL DEVICES IN AN INDUSTRIAL PROCESS AUTOMATION SYSTEM | Nov 23, 2014 | Abandoned |