
Eric Coleman
Examiner (ID: 7488, Phone: (571)272-4163 , Office: P/2183 )
| Most Active Art Unit | 2183 |
| Art Unit(s) | 2302, 2183, 2783 |
| Total Applications | 2413 |
| Issued Applications | 2133 |
| Pending Applications | 67 |
| Abandoned Applications | 235 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10112210
[patent_doc_number] => 09147629
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-09-29
[patent_title] => 'Extremely thin package'
[patent_app_type] => utility
[patent_app_number] => 14/032696
[patent_app_country] => US
[patent_app_date] => 2013-09-20
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/032696 | Extremely thin package | Sep 19, 2013 | Issued |
Array
(
[id] => 10845147
[patent_doc_number] => 08872327
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-10-28
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 14/024732
[patent_app_country] => US
[patent_app_date] => 2013-09-12
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/024732 | Semiconductor device | Sep 11, 2013 | Issued |
Array
(
[id] => 9778630
[patent_doc_number] => 08853838
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[patent_issue_date] => 2014-10-07
[patent_title] => 'Lead frame and flip packaging device thereof'
[patent_app_type] => utility
[patent_app_number] => 14/022877
[patent_app_country] => US
[patent_app_date] => 2013-09-10
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Array
(
[id] => 10015968
[patent_doc_number] => 09058989
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-06-16
[patent_title] => 'Large area thin freestanding nitride layers and their use as circuit layers'
[patent_app_type] => utility
[patent_app_number] => 14/020894
[patent_app_country] => US
[patent_app_date] => 2013-09-08
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/020894 | Large area thin freestanding nitride layers and their use as circuit layers | Sep 7, 2013 | Issued |
Array
(
[id] => 9360519
[patent_doc_number] => 20140070391
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-03-13
[patent_title] => 'LEAD CARRIER WITH PRINT-FORMED TERMINAL PADS'
[patent_app_type] => utility
[patent_app_number] => 14/018771
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/018771 | Lead carrier with print-formed terminal pads | Sep 4, 2013 | Issued |
Array
(
[id] => 10132015
[patent_doc_number] => 09165856
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-10-20
[patent_title] => 'Coupling assembly of power semiconductor device and PCB and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 14/018932
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/018932 | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same | Sep 4, 2013 | Issued |
Array
(
[id] => 9360512
[patent_doc_number] => 20140070384
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-03-13
[patent_title] => 'STACKED SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 14/017410
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/017410 | Stacked semiconductor device and printed circuit board | Sep 3, 2013 | Issued |
Array
(
[id] => 9202450
[patent_doc_number] => 20140001627
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-01-02
[patent_title] => 'Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation'
[patent_app_type] => utility
[patent_app_number] => 14/017963
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/017963 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Sep 3, 2013 | Issued |
Array
(
[id] => 10551306
[patent_doc_number] => 09275938
[patent_country] => US
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[patent_issue_date] => 2016-03-01
[patent_title] => 'Low profile high temperature double sided flip chip power packaging'
[patent_app_type] => utility
[patent_app_number] => 14/016728
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[patent_app_date] => 2013-09-03
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/016728 | Low profile high temperature double sided flip chip power packaging | Sep 2, 2013 | Issued |
Array
(
[id] => 11014253
[patent_doc_number] => 20160211206
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[patent_kind] => A1
[patent_issue_date] => 2016-07-21
[patent_title] => 'MULTILAYER STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A MULTILAYER STRUCTURE FOR A SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 14/914775
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/914775 | Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device | Aug 27, 2013 | Issued |
Array
(
[id] => 9335099
[patent_doc_number] => 20140061881
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[patent_issue_date] => 2014-03-06
[patent_title] => 'INTEGRATED CIRCUIT'
[patent_app_type] => utility
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[patent_app_country] => US
[patent_app_date] => 2013-08-27
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/011270 | Integrated circuit | Aug 26, 2013 | Issued |
Array
(
[id] => 10958396
[patent_doc_number] => 20140361421
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-12-11
[patent_title] => 'LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/972885 | Lead frame based semiconductor die package | Aug 20, 2013 | Issued |
Array
(
[id] => 10845136
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/968289 | Manufacturing method of semiconductor device and semiconductor device | Aug 14, 2013 | Issued |
Array
(
[id] => 9861950
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Array
(
[id] => 9303928
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[patent_title] => 'WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/963246 | Wiring board and method for manufacturing wiring board | Aug 8, 2013 | Issued |
Array
(
[id] => 9178479
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[patent_title] => 'INTEGRALLY MOLDED DIE AND BEZEL STRUCTURE FOR FINGERPRINT SENSORS AND THE LIKE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/960405 | Integrally molded die and bezel structure for fingerprint sensors and the like | Aug 5, 2013 | Issued |
Array
(
[id] => 9277833
[patent_doc_number] => 20140027801
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/953438 | Solid state lighting device | Jul 28, 2013 | Issued |
Array
(
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Array
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Array
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