
Eric Coleman
Examiner (ID: 7488, Phone: (571)272-4163 , Office: P/2183 )
| Most Active Art Unit | 2183 |
| Art Unit(s) | 2302, 2183, 2783 |
| Total Applications | 2413 |
| Issued Applications | 2133 |
| Pending Applications | 67 |
| Abandoned Applications | 235 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 8615294
[patent_doc_number] => 20130020606
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-01-24
[patent_title] => 'CIRCUIT BOARD WITH THERMO-CONDUCTIVE PILLAR'
[patent_app_type] => utility
[patent_app_number] => 13/186461
[patent_app_country] => US
[patent_app_date] => 2011-07-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13186461
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/186461 | Circuit board with thermo-conductive pillar | Jul 18, 2011 | Issued |
Array
(
[id] => 9047327
[patent_doc_number] => 08541881
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-09-24
[patent_title] => 'Package structure and manufacturing method thereof'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/186448 | Package structure and manufacturing method thereof | Jul 18, 2011 | Issued |
Array
(
[id] => 8653808
[patent_doc_number] => 08373559
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[patent_kind] => B2
[patent_issue_date] => 2013-02-12
[patent_title] => 'Microelectronic device with integrated energy source'
[patent_app_type] => utility
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[patent_app_country] => US
[patent_app_date] => 2011-07-11
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/180540 | Microelectronic device with integrated energy source | Jul 10, 2011 | Issued |
Array
(
[id] => 8543939
[patent_doc_number] => 08319232
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-11-27
[patent_title] => 'Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof'
[patent_app_type] => utility
[patent_app_number] => 13/150482
[patent_app_country] => US
[patent_app_date] => 2011-06-01
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13150482
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/150482 | Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof | May 31, 2011 | Issued |
Array
(
[id] => 6009214
[patent_doc_number] => 20110219611
[patent_country] => US
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[patent_issue_date] => 2011-09-15
[patent_title] => 'ENHANCED INTEGRATED CIRCUIT PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 13/113089
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[firstpage_image] =>[orig_patent_app_number] => 13113089
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/113089 | Enhanced integrated circuit package | May 22, 2011 | Issued |
Array
(
[id] => 8571648
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[patent_issue_date] => 2012-12-25
[patent_title] => 'Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices'
[patent_app_type] => utility
[patent_app_number] => 13/109639
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/109639 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | May 16, 2011 | Issued |
Array
(
[id] => 7585020
[patent_doc_number] => 20110279530
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[patent_issue_date] => 2011-11-17
[patent_title] => 'MAINTENANCE SYSTEM HAVING CLEANABLE WIPER FOR PRINTHEAD'
[patent_app_type] => utility
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[pdf_file] => publications/A1/0279/20110279530.pdf
[firstpage_image] =>[orig_patent_app_number] => 13107977
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/107977 | Maintenance system having cleanable wiper for printhead | May 15, 2011 | Issued |
Array
(
[id] => 7727314
[patent_doc_number] => 20120012365
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-01-19
[patent_title] => 'THERMAL FLEX CONTACT CARRIERS #2'
[patent_app_type] => utility
[patent_app_number] => 13/107911
[patent_app_country] => US
[patent_app_date] => 2011-05-14
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[firstpage_image] =>[orig_patent_app_number] => 13107911
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/107911 | THERMAL FLEX CONTACT CARRIERS #2 | May 13, 2011 | Abandoned |
Array
(
[id] => 8270851
[patent_doc_number] => 08212360
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[patent_issue_date] => 2012-07-03
[patent_title] => 'Semiconductor die having a redistribution layer'
[patent_app_type] => utility
[patent_app_number] => 13/103792
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/103792 | Semiconductor die having a redistribution layer | May 8, 2011 | Issued |
Array
(
[id] => 8375723
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[patent_issue_date] => 2012-09-04
[patent_title] => 'Thin-film transistor substrate, method of manufacturing the same and display panel having the same'
[patent_app_type] => utility
[patent_app_number] => 13/090868
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[patent_app_date] => 2011-04-20
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/090868 | Thin-film transistor substrate, method of manufacturing the same and display panel having the same | Apr 19, 2011 | Issued |
Array
(
[id] => 5955757
[patent_doc_number] => 20110180827
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[patent_kind] => A1
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[patent_title] => 'SOLID STATE LIGHTING DEVICE'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/082699 | Solid state lighting device | Apr 7, 2011 | Issued |
Array
(
[id] => 8104925
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[patent_title] => 'Semiconductor memory apparatus'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/077131 | Semiconductor memory apparatus | Mar 30, 2011 | Issued |
Array
(
[id] => 8305731
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Array
(
[id] => 6106074
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Array
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[patent_title] => 'Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same'
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/015011 | Electronic device and electronic apparatus | Jan 26, 2011 | Issued |