Eric D. Bertram

Array ( [id] => 9065155 [patent_doc_number] => 20130256911 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-10-03 [patent_title] => 'SEMICONDUCTOR CHIP STACK PACKAGE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/391063 [patent_app_country] => US [patent_app_date] => 2010-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3132 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13391063 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8533911 [patent_doc_number] => 08310067 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-11-13 [patent_title] => 'Ball grid array package enhanced with a thermal and electrical connector' [patent_app_type] => utility [patent_app_number] => 13/030950 [patent_app_country] => US [patent_app_date] => 2011-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 62 [patent_figures_cnt] => 91 [patent_no_of_words] => 26844 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13030950 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9552907 [patent_doc_number] => 08759959 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-24 [patent_title] => 'Stacked semiconductor packages' [patent_app_type] => utility [patent_app_number] => 13/029736 [patent_app_country] => US [patent_app_date] => 2011-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 23 [patent_no_of_words] => 10293 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13029736 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8458595 [patent_doc_number] => 08294266 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-23 [patent_title] => 'Conductor bump method and apparatus' [patent_app_type] => utility [patent_app_number] => 13/027076 [patent_app_country] => US [patent_app_date] => 2011-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 20 [patent_no_of_words] => 5173 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13027076 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5940926 [patent_doc_number] => 20110101546 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-05-05 [patent_title] => 'System and Method for Directional Grinding on Backside of a Semiconductor Wafer' [patent_app_type] => utility [patent_app_number] => 13/005666 [patent_app_country] => US [patent_app_date] => 2011-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2447 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0101/20110101546.pdf [firstpage_image] =>[orig_patent_app_number] => 13005666 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5944232 [patent_doc_number] => 20110104852 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-05-05 [patent_title] => 'SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/005350 [patent_app_country] => US [patent_app_date] => 2011-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 5775 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0104/20110104852.pdf [firstpage_image] =>[orig_patent_app_number] => 13005350 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5980347 [patent_doc_number] => 20110095440 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-28 [patent_title] => 'SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP CONTROLLER AT BOTTOM OF DIE STACK' [patent_app_type] => utility [patent_app_number] => 12/986927 [patent_app_country] => US [patent_app_date] => 2011-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4654 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0095/20110095440.pdf [firstpage_image] =>[orig_patent_app_number] => 12986927 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8190280 [patent_doc_number] => 08183685 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-22 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/986716 [patent_app_country] => US [patent_app_date] => 2011-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 35 [patent_no_of_words] => 12960 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/183/08183685.pdf [firstpage_image] =>[orig_patent_app_number] => 12986716 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7761989 [patent_doc_number] => 08114687 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-02-14 [patent_title] => 'Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/929057 [patent_app_country] => US [patent_app_date] => 2010-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 23 [patent_no_of_words] => 8649 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/114/08114687.pdf [firstpage_image] =>[orig_patent_app_number] => 12929057 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7660089 [patent_doc_number] => 20110309358 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-22 [patent_title] => 'SEMICONDUCTOR CHIP WITH FINE PITCH LEADS FOR NORMAL TESTING OF SAME' [patent_app_type] => utility [patent_app_number] => 12/979317 [patent_app_country] => US [patent_app_date] => 2010-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5651 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0309/20110309358.pdf [firstpage_image] =>[orig_patent_app_number] => 12979317 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8398971 [patent_doc_number] => 08269356 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-09-18 [patent_title] => 'Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates' [patent_app_type] => utility [patent_app_number] => 12/973410 [patent_app_country] => US [patent_app_date] => 2010-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 28 [patent_no_of_words] => 5390 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12973410 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7654789 [patent_doc_number] => 20110304058 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-15 [patent_title] => 'Semiconductor Device and Method of Forming Flipchip Interconnection Structure with Bump on Partial Pad' [patent_app_type] => utility [patent_app_number] => 12/969451 [patent_app_country] => US [patent_app_date] => 2010-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 14454 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0304/20110304058.pdf [firstpage_image] =>[orig_patent_app_number] => 12969451 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8364169 [patent_doc_number] => 08253239 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-08-28 [patent_title] => 'Multi-chip semiconductor connector' [patent_app_type] => utility [patent_app_number] => 12/956786 [patent_app_country] => US [patent_app_date] => 2010-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 10 [patent_no_of_words] => 5103 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12956786 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6199793 [patent_doc_number] => 20110062579 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-03-17 [patent_title] => 'GROUP III NITRIDE BASED FLIP-CHIP INTEGRATED CIRCUIT AND METHOD FOR FABRICATING' [patent_app_type] => utility [patent_app_number] => 12/951372 [patent_app_country] => US [patent_app_date] => 2010-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 7489 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0062/20110062579.pdf [firstpage_image] =>[orig_patent_app_number] => 12951372 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8390937 [patent_doc_number] => 20120228782 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-09-13 [patent_title] => 'METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE' [patent_app_type] => utility [patent_app_number] => 13/510744 [patent_app_country] => US [patent_app_date] => 2010-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 10000 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13510744 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6052373 [patent_doc_number] => 20110108968 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-05-12 [patent_title] => 'Semiconductor package with metal straps' [patent_app_type] => utility [patent_app_number] => 12/927341 [patent_app_country] => US [patent_app_date] => 2010-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4452 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20110108968.pdf [firstpage_image] =>[orig_patent_app_number] => 12927341 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6070790 [patent_doc_number] => 20110045641 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-02-24 [patent_title] => 'Semiconductor Device Having Solder-Free Gold Bump Contacts for Stability in Repeated Temperature Cycles' [patent_app_type] => utility [patent_app_number] => 12/917620 [patent_app_country] => US [patent_app_date] => 2010-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3812 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0045/20110045641.pdf [firstpage_image] =>[orig_patent_app_number] => 12917620 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8178338 [patent_doc_number] => 08178975 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-15 [patent_title] => 'Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers' [patent_app_type] => utility [patent_app_number] => 12/916907 [patent_app_country] => US [patent_app_date] => 2010-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 10 [patent_no_of_words] => 7287 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 309 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/178/08178975.pdf [firstpage_image] =>[orig_patent_app_number] => 12916907 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9324081 [patent_doc_number] => 08659106 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-02-25 [patent_title] => 'Light emitting device and method of manufacturing the light emitting device' [patent_app_type] => utility [patent_app_number] => 13/258316 [patent_app_country] => US [patent_app_date] => 2010-10-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 14928 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13258316 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5925362 [patent_doc_number] => 20110037136 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-02-17 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH IMAGE SENSOR SYSTEM' [patent_app_type] => utility [patent_app_number] => 12/912730 [patent_app_country] => US [patent_app_date] => 2010-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4159 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0037/20110037136.pdf [firstpage_image] =>[orig_patent_app_number] => 12912730 [rel_patent_id] =>[rel_patent_doc_number] =>)