
Eric E. Silverman
Examiner (ID: 15411)
| Most Active Art Unit | 1618 |
| Art Unit(s) | 1618, 1615 |
| Total Applications | 298 |
| Issued Applications | 111 |
| Pending Applications | 2 |
| Abandoned Applications | 185 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 334191
[patent_doc_number] => 07507602
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-24
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/138418
[patent_app_country] => US
[patent_app_date] => 2005-05-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 52
[patent_no_of_words] => 11778
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 226
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/507/07507602.pdf
[firstpage_image] =>[orig_patent_app_number] => 11138418
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/138418 | Semiconductor device and method of manufacturing the same | May 26, 2005 | Issued |
Array
(
[id] => 7107278
[patent_doc_number] => 20050205012
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-09-22
[patent_title] => 'Transfer chamber for cluster system'
[patent_app_type] => utility
[patent_app_number] => 11/135727
[patent_app_country] => US
[patent_app_date] => 2005-05-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2800
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 6
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0205/20050205012.pdf
[firstpage_image] =>[orig_patent_app_number] => 11135727
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/135727 | Transfer chamber for cluster system | May 22, 2005 | Issued |
Array
(
[id] => 535732
[patent_doc_number] => 07180144
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-02-20
[patent_title] => 'Corner compensation method for fabricating MEMS and structure thereof'
[patent_app_type] => utility
[patent_app_number] => 11/129145
[patent_app_country] => US
[patent_app_date] => 2005-05-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 32
[patent_no_of_words] => 3107
[patent_no_of_claims] => 12
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/180/07180144.pdf
[firstpage_image] =>[orig_patent_app_number] => 11129145
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/129145 | Corner compensation method for fabricating MEMS and structure thereof | May 12, 2005 | Issued |
Array
(
[id] => 623510
[patent_doc_number] => 07138282
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-11-21
[patent_title] => 'Correcting device, exposure apparatus, device production method, and device produced by the device production method'
[patent_app_type] => utility
[patent_app_number] => 11/125082
[patent_app_country] => US
[patent_app_date] => 2005-05-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 8877
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 5
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/138/07138282.pdf
[firstpage_image] =>[orig_patent_app_number] => 11125082
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/125082 | Correcting device, exposure apparatus, device production method, and device produced by the device production method | May 9, 2005 | Issued |
Array
(
[id] => 425110
[patent_doc_number] => 07271092
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-09-18
[patent_title] => 'Boron incorporated diffusion barrier material'
[patent_app_type] => utility
[patent_app_number] => 11/119370
[patent_app_country] => US
[patent_app_date] => 2005-04-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3958
[patent_no_of_claims] => 18
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/271/07271092.pdf
[firstpage_image] =>[orig_patent_app_number] => 11119370
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/119370 | Boron incorporated diffusion barrier material | Apr 28, 2005 | Issued |
Array
(
[id] => 5832128
[patent_doc_number] => 20060243958
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-02
[patent_title] => 'Microelectronic package interconnect and method of fabrication thereof'
[patent_app_type] => utility
[patent_app_number] => 11/116537
[patent_app_country] => US
[patent_app_date] => 2005-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 3051
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[pdf_file] => publications/A1/0243/20060243958.pdf
[firstpage_image] =>[orig_patent_app_number] => 11116537
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/116537 | Microelectronic package interconnect and method of fabrication thereof | Apr 27, 2005 | Issued |
Array
(
[id] => 404609
[patent_doc_number] => 07288438
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-10-30
[patent_title] => 'Solder deposition on wafer backside for thin-die thermal interface material'
[patent_app_type] => utility
[patent_app_number] => 11/116554
[patent_app_country] => US
[patent_app_date] => 2005-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 4936
[patent_no_of_claims] => 24
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/288/07288438.pdf
[firstpage_image] =>[orig_patent_app_number] => 11116554
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/116554 | Solder deposition on wafer backside for thin-die thermal interface material | Apr 27, 2005 | Issued |
Array
(
[id] => 7048409
[patent_doc_number] => 20050184296
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-08-25
[patent_title] => 'System and method for fabricating diodes'
[patent_app_type] => utility
[patent_app_number] => 11/111602
[patent_app_country] => US
[patent_app_date] => 2005-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 4258
[patent_no_of_claims] => 24
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0184/20050184296.pdf
[firstpage_image] =>[orig_patent_app_number] => 11111602
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/111602 | System and method for fabricating diodes | Apr 20, 2005 | Abandoned |
Array
(
[id] => 5903070
[patent_doc_number] => 20060046207
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-02
[patent_title] => 'Exposure method'
[patent_app_type] => utility
[patent_app_number] => 11/112454
[patent_app_country] => US
[patent_app_date] => 2005-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0046/20060046207.pdf
[firstpage_image] =>[orig_patent_app_number] => 11112454
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/112454 | Exposure method | Apr 20, 2005 | Abandoned |
Array
(
[id] => 5851241
[patent_doc_number] => 20060234432
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-19
[patent_title] => 'SOI bottom pre-doping merged e-SiGe for poly height reduction'
[patent_app_type] => utility
[patent_app_number] => 11/107843
[patent_app_country] => US
[patent_app_date] => 2005-04-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 2516
[patent_no_of_claims] => 14
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0234/20060234432.pdf
[firstpage_image] =>[orig_patent_app_number] => 11107843
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/107843 | SOI bottom pre-doping merged e-SiGe for poly height reduction | Apr 17, 2005 | Issued |
Array
(
[id] => 7518800
[patent_doc_number] => 07972901
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-05
[patent_title] => 'Chip package sealing method'
[patent_app_type] => utility
[patent_app_number] => 11/105635
[patent_app_country] => US
[patent_app_date] => 2005-04-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/972/07972901.pdf
[firstpage_image] =>[orig_patent_app_number] => 11105635
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/105635 | Chip package sealing method | Apr 13, 2005 | Issued |
Array
(
[id] => 889142
[patent_doc_number] => 07348654
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-03-25
[patent_title] => 'Capacitor and inductor scheme with e-fuse application'
[patent_app_type] => utility
[patent_app_number] => 11/106089
[patent_app_country] => US
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[pdf_file] => patents/07/348/07348654.pdf
[firstpage_image] =>[orig_patent_app_number] => 11106089
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/106089 | Capacitor and inductor scheme with e-fuse application | Apr 13, 2005 | Issued |
Array
(
[id] => 7045711
[patent_doc_number] => 20050250306
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-11-10
[patent_title] => 'Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device'
[patent_app_type] => utility
[patent_app_number] => 11/102903
[patent_app_country] => US
[patent_app_date] => 2005-04-08
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[pdf_file] => publications/A1/0250/20050250306.pdf
[firstpage_image] =>[orig_patent_app_number] => 11102903
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/102903 | Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating | Apr 7, 2005 | Issued |
Array
(
[id] => 5705371
[patent_doc_number] => 20060194419
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-31
[patent_title] => 'Crystalline-si-layer-bearing substrate and its production method, and crystalline si device'
[patent_app_type] => utility
[patent_app_number] => 10/552513
[patent_app_country] => US
[patent_app_date] => 2005-04-06
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0194/20060194419.pdf
[firstpage_image] =>[orig_patent_app_number] => 10552513
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/552513 | Crystalline-si-layer-bearing substrate and its production method, and crystalline si device | Apr 5, 2005 | Abandoned |
Array
(
[id] => 5751032
[patent_doc_number] => 20060220181
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-05
[patent_title] => 'Controllable varactor within dummy substrate pattern'
[patent_app_type] => utility
[patent_app_number] => 11/097743
[patent_app_country] => US
[patent_app_date] => 2005-04-01
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[firstpage_image] =>[orig_patent_app_number] => 11097743
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/097743 | Controllable varactor within dummy substrate pattern | Mar 31, 2005 | Issued |
Array
(
[id] => 141794
[patent_doc_number] => 07687409
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-30
[patent_title] => 'Atomic layer deposited titanium silicon oxide films'
[patent_app_type] => utility
[patent_app_number] => 11/093104
[patent_app_country] => US
[patent_app_date] => 2005-03-29
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[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/07/687/07687409.pdf
[firstpage_image] =>[orig_patent_app_number] => 11093104
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/093104 | Atomic layer deposited titanium silicon oxide films | Mar 28, 2005 | Issued |
Array
(
[id] => 5707545
[patent_doc_number] => 20060048889
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-03-09
[patent_title] => 'Method for connecting a chip and a substrate'
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[patent_app_number] => 11/088514
[patent_app_country] => US
[patent_app_date] => 2005-03-24
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[firstpage_image] =>[orig_patent_app_number] => 11088514
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/088514 | Method for connecting a chip and a substrate | Mar 23, 2005 | Abandoned |
Array
(
[id] => 5141918
[patent_doc_number] => 20070004134
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[patent_issue_date] => 2007-01-04
[patent_title] => 'Vertically integrated flash EPROM for greater density and lower cost'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/083683 | Vertically integrated flash EPROM for greater density and lower cost | Mar 16, 2005 | Abandoned |
Array
(
[id] => 5785524
[patent_doc_number] => 20060205113
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[patent_kind] => A1
[patent_issue_date] => 2006-09-14
[patent_title] => 'Radio frequency identification (RFID) tag lamination process'
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[patent_app_number] => 11/079143
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[firstpage_image] =>[orig_patent_app_number] => 11079143
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/079143 | Radio frequency identification (RFID) tag lamination process | Mar 13, 2005 | Abandoned |
Array
(
[id] => 7136852
[patent_doc_number] => 20050181541
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-08-18
[patent_title] => 'Method of producing a COF flexible printed wiring board'
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[pdf_file] => publications/A1/0181/20050181541.pdf
[firstpage_image] =>[orig_patent_app_number] => 11078293
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/078293 | Method of producing a COF flexible printed wiring board | Mar 13, 2005 | Issued |