
Eric J. Bycer
Examiner (ID: 19805, Phone: (571)270-3741 , Office: P/2173 )
| Most Active Art Unit | 2173 |
| Art Unit(s) | 2141, 2173 |
| Total Applications | 562 |
| Issued Applications | 381 |
| Pending Applications | 34 |
| Abandoned Applications | 160 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 20552857
[patent_doc_number] => 12563665
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-02-24
[patent_title] => Insulating circuit board and semiconductor device in which same is used
[patent_app_type] => utility
[patent_app_number] => 18/339515
[patent_app_country] => US
[patent_app_date] => 2023-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 7068
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18339515
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/339515 | Insulating circuit board and semiconductor device in which same is used | Jun 21, 2023 | Issued |
Array
(
[id] => 18848860
[patent_doc_number] => 20230411264
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-21
[patent_title] => LAMINATED WIRING BOARD
[patent_app_type] => utility
[patent_app_number] => 18/331625
[patent_app_country] => US
[patent_app_date] => 2023-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 17732
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -11
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18331625
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/331625 | Laminated wiring board | Jun 7, 2023 | Issued |
Array
(
[id] => 19621416
[patent_doc_number] => 20240407096
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-12-05
[patent_title] => ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE STRUCTURES PASSING THERETHROUGH
[patent_app_type] => utility
[patent_app_number] => 18/203679
[patent_app_country] => US
[patent_app_date] => 2023-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5416
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 101
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18203679
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/203679 | ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE STRUCTURES PASSING THERETHROUGH | May 30, 2023 | Pending |
Array
(
[id] => 18823001
[patent_doc_number] => 20230397342
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-07
[patent_title] => WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD
[patent_app_type] => utility
[patent_app_number] => 18/324632
[patent_app_country] => US
[patent_app_date] => 2023-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7045
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -10
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18324632
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/324632 | Wiring board, semiconductor device, and wiring board manufacturing method | May 25, 2023 | Issued |
Array
(
[id] => 19271458
[patent_doc_number] => 20240215165
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-06-27
[patent_title] => PRINTED CIRCUIT BOARD
[patent_app_type] => utility
[patent_app_number] => 18/200224
[patent_app_country] => US
[patent_app_date] => 2023-05-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7594
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -20
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18200224
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/200224 | PRINTED CIRCUIT BOARD | May 21, 2023 | Pending |
Array
(
[id] => 18776349
[patent_doc_number] => 20230371187
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-16
[patent_title] => PACKAGE SUBSTRATE STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 18/315735
[patent_app_country] => US
[patent_app_date] => 2023-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 2111
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -5
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18315735
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/315735 | PACKAGE SUBSTRATE STRUCTURE | May 10, 2023 | Abandoned |
Array
(
[id] => 19285773
[patent_doc_number] => 20240222250
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-07-04
[patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/310985
[patent_app_country] => US
[patent_app_date] => 2023-05-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4897
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 47
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18310985
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/310985 | Electronic package and manufacturing method thereof | May 1, 2023 | Issued |
Array
(
[id] => 20470874
[patent_doc_number] => 12526919
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-01-13
[patent_title] => Printed circuit board
[patent_app_type] => utility
[patent_app_number] => 18/138893
[patent_app_country] => US
[patent_app_date] => 2023-04-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 16
[patent_no_of_words] => 2448
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 181
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18138893
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/138893 | Printed circuit board | Apr 24, 2023 | Issued |
Array
(
[id] => 18572551
[patent_doc_number] => 20230262888
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-17
[patent_title] => MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/303648
[patent_app_country] => US
[patent_app_date] => 2023-04-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7293
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 127
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18303648
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/303648 | MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Apr 19, 2023 | Pending |
Array
(
[id] => 18516209
[patent_doc_number] => 20230232531
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-07-20
[patent_title] => CIRCUIT SUBSTRATE AND MODULE
[patent_app_type] => utility
[patent_app_number] => 18/189460
[patent_app_country] => US
[patent_app_date] => 2023-03-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4263
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18189460
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/189460 | Circuit substrate and module | Mar 23, 2023 | Issued |
Array
(
[id] => 18743396
[patent_doc_number] => 20230352384
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-02
[patent_title] => THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASITIC INDUCTANCE
[patent_app_type] => utility
[patent_app_number] => 18/188622
[patent_app_country] => US
[patent_app_date] => 2023-03-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9837
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 162
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18188622
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/188622 | THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASITIC INDUCTANCE | Mar 22, 2023 | Abandoned |
Array
(
[id] => 18617644
[patent_doc_number] => 20230284385
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-07
[patent_title] => SUBSTRATE
[patent_app_type] => utility
[patent_app_number] => 18/178001
[patent_app_country] => US
[patent_app_date] => 2023-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5538
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -5
[patent_words_short_claim] => 176
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18178001
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/178001 | SUBSTRATE | Mar 2, 2023 | Pending |
Array
(
[id] => 20612526
[patent_doc_number] => 12588142
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-03-24
[patent_title] => High-frequency electronic component
[patent_app_type] => utility
[patent_app_number] => 18/174166
[patent_app_country] => US
[patent_app_date] => 2023-02-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 5374
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 247
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18174166
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/174166 | High-frequency electronic component | Feb 23, 2023 | Issued |
Array
(
[id] => 20026510
[patent_doc_number] => 20250164732
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-05-22
[patent_title] => CABLE SEALING ARRANGEMENT FOR AN ENCLOSURE
[patent_app_type] => utility
[patent_app_number] => 18/840310
[patent_app_country] => US
[patent_app_date] => 2023-02-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 0
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 248
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18840310
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/840310 | CABLE SEALING ARRANGEMENT FOR AN ENCLOSURE | Feb 16, 2023 | Pending |
Array
(
[id] => 18572549
[patent_doc_number] => 20230262886
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-17
[patent_title] => 3D PRINTED ATTACHMENT DEVICES FOR ELECTRONICS
[patent_app_type] => utility
[patent_app_number] => 18/105454
[patent_app_country] => US
[patent_app_date] => 2023-02-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4588
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 30
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18105454
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/105454 | 3D PRINTED ATTACHMENT DEVICES FOR ELECTRONICS | Feb 2, 2023 | Pending |
Array
(
[id] => 19351229
[patent_doc_number] => 20240260193
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-01
[patent_title] => DECOUPLING CAPACITOR BOOSTER MODULE
[patent_app_type] => utility
[patent_app_number] => 18/102394
[patent_app_country] => US
[patent_app_date] => 2023-01-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9156
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18102394
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/102394 | DECOUPLING CAPACITOR BOOSTER MODULE | Jan 26, 2023 | Pending |
Array
(
[id] => 20004496
[patent_doc_number] => 20250142718
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-05-01
[patent_title] => COMPOSITE WIRING BOARD, ELECTRONIC COMPONENT ACCOMMODATING PACKAGE, AND ELECTRONIC DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/834246
[patent_app_country] => US
[patent_app_date] => 2023-01-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5443
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18834246
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/834246 | COMPOSITE WIRING BOARD, ELECTRONIC COMPONENT ACCOMMODATING PACKAGE, AND ELECTRONIC DEVICE | Jan 25, 2023 | Pending |
Array
(
[id] => 19837386
[patent_doc_number] => 20250089172
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-03-13
[patent_title] => CIRCUIT BOARD
[patent_app_type] => utility
[patent_app_number] => 18/726707
[patent_app_country] => US
[patent_app_date] => 2023-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 28038
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 164
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18726707
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/726707 | CIRCUIT BOARD | Jan 2, 2023 | Pending |
Array
(
[id] => 20792600
[patent_doc_number] => 12666532
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-06-23
[patent_title] => High speed camera interface PCB floor plan for autonomous vehicles
[patent_app_type] => utility
[patent_app_number] => 18/026794
[patent_app_country] => US
[patent_app_date] => 2022-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 6691
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 284
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18026794
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/026794 | High speed camera interface PCB floor plan for autonomous vehicles | Dec 28, 2022 | Issued |
Array
(
[id] => 19546474
[patent_doc_number] => 20240363510
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-10-31
[patent_title] => CHIP ON FILM, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/580229
[patent_app_country] => US
[patent_app_date] => 2022-11-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12779
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18580229
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/580229 | CHIP ON FILM, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE | Nov 23, 2022 | Pending |