
Ermias T. Woldegeorgis
Examiner (ID: 9205, Phone: (571)270-5350 , Office: P/2893 )
| Most Active Art Unit | 2893 |
| Art Unit(s) | 2893, 2821 |
| Total Applications | 990 |
| Issued Applications | 699 |
| Pending Applications | 103 |
| Abandoned Applications | 225 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9497192
[patent_doc_number] => 08736014
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[patent_kind] => B2
[patent_issue_date] => 2014-05-27
[patent_title] => 'High mechanical strength additives for porous ultra low-k material'
[patent_app_type] => utility
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[patent_app_country] => US
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Array
(
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[patent_issue_date] => 2013-10-08
[patent_title] => 'Trench shielding structure for semiconductor device and method'
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Array
(
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[patent_kind] => A1
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[patent_title] => 'FUSE STRUCTURE FOR INTERGRATED CIRCUIT DEVICES'
[patent_app_type] => utility
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[patent_app_date] => 2008-11-13
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/270717 | FUSE STRUCTURE FOR INTERGRATED CIRCUIT DEVICES | Nov 12, 2008 | Abandoned |
Array
(
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[patent_doc_number] => 08304854
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[patent_kind] => B2
[patent_issue_date] => 2012-11-06
[patent_title] => 'Semiconductor integrated circuit chip, multilayer chip capacitor and semiconductor integrated circuit chip package'
[patent_app_type] => utility
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[patent_app_country] => US
[patent_app_date] => 2008-11-13
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/270457 | Semiconductor integrated circuit chip, multilayer chip capacitor and semiconductor integrated circuit chip package | Nov 12, 2008 | Issued |
Array
(
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[patent_title] => 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE'
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Array
(
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[patent_title] => 'Embedded semiconductor device and method of manufacturing an embedded semiconductor device'
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Array
(
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[patent_title] => 'Semiconductor device having electrode film in which film thickness of periphery is thinner than film thickness of center'
[patent_app_type] => utility
[patent_app_number] => 12/230577
[patent_app_country] => US
[patent_app_date] => 2008-09-02
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/230577 | Semiconductor device having electrode film in which film thickness of periphery is thinner than film thickness of center | Sep 1, 2008 | Issued |
Array
(
[id] => 5268504
[patent_doc_number] => 20090072279
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-03-19
[patent_title] => 'Capacitor-less memory and abrupt switch based on hysteresis characteristics in punch-through impact ionization mos transistor (PI-MOS)'
[patent_app_type] => utility
[patent_app_number] => 12/230557
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/230557 | Capacitor-less memory and abrupt switch based on hysteresis characteristics in punch-through impact ionization mos transistor (PI-MOS) | Aug 28, 2008 | Abandoned |
Array
(
[id] => 6247668
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[patent_issue_date] => 2010-06-03
[patent_title] => 'METHOD FOR PRODUCTION OF THIN FILM AND APPARATUS FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/531436
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/531436 | METHOD FOR PRODUCTION OF THIN FILM AND APPARATUS FOR MANUFACTURING THE SAME | Aug 18, 2008 | Abandoned |
Array
(
[id] => 5518637
[patent_doc_number] => 20090026618
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-29
[patent_title] => 'Semiconductor device including interlayer interconnecting structures and methods of forming the same'
[patent_app_type] => utility
[patent_app_number] => 12/220527
[patent_app_country] => US
[patent_app_date] => 2008-07-25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/220527 | Semiconductor device including interlayer interconnecting structures and methods of forming the same | Jul 24, 2008 | Abandoned |
Array
(
[id] => 9355860
[patent_doc_number] => 08674398
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[patent_kind] => B2
[patent_issue_date] => 2014-03-18
[patent_title] => 'Group III nitride semiconductor light emitting device and production method thereof, and lamp'
[patent_app_type] => utility
[patent_app_number] => 12/666594
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/666594 | Group III nitride semiconductor light emitting device and production method thereof, and lamp | Jul 2, 2008 | Issued |
Array
(
[id] => 173750
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[patent_issue_date] => 2010-02-09
[patent_title] => 'Fabricating method for quantum dot of active layer of LED by nano-lithography'
[patent_app_type] => utility
[patent_app_number] => 12/216018
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/216018 | Fabricating method for quantum dot of active layer of LED by nano-lithography | Jun 26, 2008 | Issued |
Array
(
[id] => 5432276
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[patent_title] => 'Semiconductor device and method of manufacturing the same'
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Array
(
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[patent_issue_date] => 2009-09-17
[patent_title] => 'Semiconductor package structure, lead frame and conductive assembly for the same'
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Array
(
[id] => 32555
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[patent_title] => 'Solder cap application process on copper bump using solder powder film'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/134337 | Solder cap application process on copper bump using solder powder film | Jun 5, 2008 | Issued |
Array
(
[id] => 9153559
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[patent_issue_date] => 2013-11-19
[patent_title] => 'Through silicon via dies and packages'
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Array
(
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[patent_title] => 'METHOD FOR REMOVING POLY SILICON'
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/132187 | Manufacturing method of substrate with through electrode | Jun 2, 2008 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/130828 | System and method to manufacture an implantable electrode | May 29, 2008 | Issued |