
Ermias T. Woldegeorgis
Examiner (ID: 9205, Phone: (571)270-5350 , Office: P/2893 )
| Most Active Art Unit | 2893 |
| Art Unit(s) | 2893, 2821 |
| Total Applications | 990 |
| Issued Applications | 699 |
| Pending Applications | 103 |
| Abandoned Applications | 225 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4654948
[patent_doc_number] => 20080023808
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-31
[patent_title] => 'CHIP PACKAGE AND DIGITAL CAMERA MODULE USING SAME'
[patent_app_type] => utility
[patent_app_number] => 11/616835
[patent_app_country] => US
[patent_app_date] => 2006-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0023/20080023808.pdf
[firstpage_image] =>[orig_patent_app_number] => 11616835
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/616835 | CHIP PACKAGE AND DIGITAL CAMERA MODULE USING SAME | Dec 26, 2006 | Abandoned |
Array
(
[id] => 4985943
[patent_doc_number] => 20070152281
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-05
[patent_title] => 'NARROW WIDTH METAL OXIDE SEMICONDUCTOR TRANSISTOR HAVING A SUPPLEMENTAL GATE CONDUCTOR PATTERN'
[patent_app_type] => utility
[patent_app_number] => 11/616255
[patent_app_country] => US
[patent_app_date] => 2006-12-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0152/20070152281.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/616255 | NARROW WIDTH METAL OXIDE SEMICONDUCTOR TRANSISTOR HAVING A SUPPLEMENTAL GATE CONDUCTOR PATTERN | Dec 25, 2006 | Abandoned |
Array
(
[id] => 5217515
[patent_doc_number] => 20070158826
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/616125
[patent_app_country] => US
[patent_app_date] => 2006-12-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 20886
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[pdf_file] => publications/A1/0158/20070158826.pdf
[firstpage_image] =>[orig_patent_app_number] => 11616125
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/616125 | SEMICONDUCTOR DEVICE | Dec 25, 2006 | Abandoned |
Array
(
[id] => 4988776
[patent_doc_number] => 20070155115
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-05
[patent_title] => 'Semiconductor device having capacitor large in capacitance and high in reliability and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/638497
[patent_app_country] => US
[patent_app_date] => 2006-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 4820
[patent_no_of_claims] => 12
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[firstpage_image] =>[orig_patent_app_number] => 11638497
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/638497 | Semiconductor device having capacitor large in capacitance and high in reliability and method of manufacturing the same | Dec 13, 2006 | Abandoned |
Array
(
[id] => 4977432
[patent_doc_number] => 20070218665
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-20
[patent_title] => 'Cross-point memory array'
[patent_app_type] => utility
[patent_app_number] => 11/637967
[patent_app_country] => US
[patent_app_date] => 2006-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
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[patent_no_of_words] => 5729
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[pdf_file] => publications/A1/0218/20070218665.pdf
[firstpage_image] =>[orig_patent_app_number] => 11637967
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/637967 | Cross-point memory array | Dec 12, 2006 | Abandoned |
Array
(
[id] => 132821
[patent_doc_number] => 07701056
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-20
[patent_title] => 'Redistribution connecting structure of solder balls'
[patent_app_type] => utility
[patent_app_number] => 11/610486
[patent_app_country] => US
[patent_app_date] => 2006-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/701/07701056.pdf
[firstpage_image] =>[orig_patent_app_number] => 11610486
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/610486 | Redistribution connecting structure of solder balls | Dec 12, 2006 | Issued |
Array
(
[id] => 5125698
[patent_doc_number] => 20070237969
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-11
[patent_title] => 'Surface-metallized polyimide material and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/637987
[patent_app_country] => US
[patent_app_date] => 2006-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2610
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[pdf_file] => publications/A1/0237/20070237969.pdf
[firstpage_image] =>[orig_patent_app_number] => 11637987
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/637987 | Surface-metallized polyimide material and method for manufacturing the same | Dec 11, 2006 | Abandoned |
Array
(
[id] => 4782662
[patent_doc_number] => 20080135991
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-12
[patent_title] => 'SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS'
[patent_app_type] => utility
[patent_app_number] => 11/609706
[patent_app_country] => US
[patent_app_date] => 2006-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[patent_no_of_words] => 5604
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[pdf_file] => publications/A1/0135/20080135991.pdf
[firstpage_image] =>[orig_patent_app_number] => 11609706
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/609706 | SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS | Dec 11, 2006 | Abandoned |
Array
(
[id] => 8528301
[patent_doc_number] => 08304874
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-11-06
[patent_title] => 'Stackable integrated circuit package system'
[patent_app_type] => utility
[patent_app_number] => 11/608826
[patent_app_country] => US
[patent_app_date] => 2006-12-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11608826
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/608826 | Stackable integrated circuit package system | Dec 8, 2006 | Issued |
Array
(
[id] => 5019526
[patent_doc_number] => 20070145492
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-28
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE'
[patent_app_type] => utility
[patent_app_number] => 11/608635
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/608635 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | Dec 7, 2006 | Abandoned |
Array
(
[id] => 4782683
[patent_doc_number] => 20080136012
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-12
[patent_title] => 'IMAGINE SENSOR PACKAGE AND FORMING METHOD OF THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/608266
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[patent_app_date] => 2006-12-08
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Array
(
[id] => 5217443
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Array
(
[id] => 5077034
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/604855 | Semiconductor device | Nov 27, 2006 | Abandoned |
Array
(
[id] => 5076391
[patent_doc_number] => 20070119615
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[patent_kind] => A1
[patent_issue_date] => 2007-05-31
[patent_title] => 'Printed wiring board'
[patent_app_type] => utility
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[patent_app_country] => US
[patent_app_date] => 2006-11-27
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[firstpage_image] =>[orig_patent_app_number] => 11604375
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/604375 | Printed wiring board | Nov 26, 2006 | Abandoned |
Array
(
[id] => 5077041
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[patent_kind] => A1
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/602966 | Semiconductor device and its manufacturing method | Nov 21, 2006 | Abandoned |
Array
(
[id] => 4896931
[patent_doc_number] => 20080116544
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-22
[patent_title] => 'Packaged semiconductor chips with array'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/603935 | Packaged semiconductor chips with array | Nov 21, 2006 | Issued |
Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/602605 | Direct semiconductor contact ebullient cooling package | Nov 20, 2006 | Issued |
Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/602536 | Self-aligned through vias for chip stacking | Nov 20, 2006 | Abandoned |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/601266 | Ball grid array package assembly with integrated voltage regulator | Nov 16, 2006 | Abandoned |