Search

Errol V. Fernandes

Examiner (ID: 18752, Phone: (571)270-7433 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2893, 2894, 2821
Total Applications
1201
Issued Applications
1015
Pending Applications
73
Abandoned Applications
130

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18542797 [patent_doc_number] => 20230247915 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/132992 [patent_app_country] => US [patent_app_date] => 2023-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2987 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18132992 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/132992
Semiconductor device Apr 10, 2023 Issued
Array ( [id] => 18542796 [patent_doc_number] => 20230247914 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/132989 [patent_app_country] => US [patent_app_date] => 2023-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2971 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18132989 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/132989
Semiconductor device Apr 10, 2023 Issued
Array ( [id] => 18540791 [patent_doc_number] => 20230245902 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/132650 [patent_app_country] => US [patent_app_date] => 2023-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8013 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18132650 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/132650
Stack package and methods of manufacturing the same Apr 9, 2023 Issued
Array ( [id] => 19414780 [patent_doc_number] => 12080617 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-03 [patent_title] => Underfill structure for semiconductor packages and methods of forming the same [patent_app_type] => utility [patent_app_number] => 18/194876 [patent_app_country] => US [patent_app_date] => 2023-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 11603 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18194876 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/194876
Underfill structure for semiconductor packages and methods of forming the same Apr 2, 2023 Issued
Array ( [id] => 18514666 [patent_doc_number] => 20230230927 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-20 [patent_title] => COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSEMBLY [patent_app_type] => utility [patent_app_number] => 18/192542 [patent_app_country] => US [patent_app_date] => 2023-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3083 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18192542 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/192542
Combined backing plate and housing for use in bump bonded chip assembly Mar 28, 2023 Issued
Array ( [id] => 18555505 [patent_doc_number] => 20230253522 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => METHODS OF FABRICATING PLANAR INFRARED PHOTODETECTORS [patent_app_type] => utility [patent_app_number] => 18/185507 [patent_app_country] => US [patent_app_date] => 2023-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9274 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18185507 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/185507
Methods of fabricating planar infrared photodetectors Mar 16, 2023 Issued
Array ( [id] => 20484311 [patent_doc_number] => 12532792 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-20 [patent_title] => Fan-out packaging device using bridge and method of manufacturing fan-out packaging device using bridge [patent_app_type] => utility [patent_app_number] => 18/121769 [patent_app_country] => US [patent_app_date] => 2023-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 0 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 225 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18121769 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/121769
Fan-out packaging device using bridge and method of manufacturing fan-out packaging device using bridge Mar 14, 2023 Issued
Array ( [id] => 18488426 [patent_doc_number] => 20230215774 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-06 [patent_title] => PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/182364 [patent_app_country] => US [patent_app_date] => 2023-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7360 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18182364 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/182364
Package structure Mar 12, 2023 Issued
Array ( [id] => 20638144 [patent_doc_number] => 12599043 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-07 [patent_title] => Semiconductor device package and method of manufacturing the same [patent_app_type] => utility [patent_app_number] => 18/119784 [patent_app_country] => US [patent_app_date] => 2023-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 37 [patent_no_of_words] => 8229 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18119784 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/119784
Semiconductor device package and method of manufacturing the same Mar 8, 2023 Issued
Array ( [id] => 18473153 [patent_doc_number] => 20230207441 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/111100 [patent_app_country] => US [patent_app_date] => 2023-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11767 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18111100 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/111100
Semiconductor package and method of fabricating the same Feb 16, 2023 Issued
Array ( [id] => 18615886 [patent_doc_number] => 20230282625 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-07 [patent_title] => SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE [patent_app_type] => utility [patent_app_number] => 18/107520 [patent_app_country] => US [patent_app_date] => 2023-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2090 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18107520 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/107520
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE Feb 8, 2023 Abandoned
Array ( [id] => 20244250 [patent_doc_number] => 12424582 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-09-23 [patent_title] => Semiconductor package including a plurality of semiconductor chips [patent_app_type] => utility [patent_app_number] => 18/165419 [patent_app_country] => US [patent_app_date] => 2023-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 17 [patent_no_of_words] => 2204 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18165419 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/165419
Semiconductor package including a plurality of semiconductor chips Feb 6, 2023 Issued
Array ( [id] => 18381935 [patent_doc_number] => 20230157026 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-18 [patent_title] => VERTICAL MEMORY DEVICES [patent_app_type] => utility [patent_app_number] => 18/156467 [patent_app_country] => US [patent_app_date] => 2023-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8839 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18156467 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/156467
Vertical memory devices Jan 18, 2023 Issued
Array ( [id] => 18396763 [patent_doc_number] => 20230164984 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-25 [patent_title] => NON-VOLATILE MEMORY DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/094960 [patent_app_country] => US [patent_app_date] => 2023-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8505 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18094960 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/094960
Non-volatile memory device and manufacturing method thereof Jan 8, 2023 Issued
Array ( [id] => 18361491 [patent_doc_number] => 20230143082 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-11 [patent_title] => MEMORY DEVICE HAVING RECESSED ACTIVE REGION [patent_app_type] => utility [patent_app_number] => 18/092423 [patent_app_country] => US [patent_app_date] => 2023-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6467 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18092423 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/092423
Memory device having recessed active region Jan 1, 2023 Issued
Array ( [id] => 19285739 [patent_doc_number] => 20240222216 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-04 [patent_title] => PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING [patent_app_type] => utility [patent_app_number] => 18/091034 [patent_app_country] => US [patent_app_date] => 2022-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6362 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18091034 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/091034
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING Dec 28, 2022 Pending
Array ( [id] => 18440130 [patent_doc_number] => 20230187425 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => SEMICONDUCTOR DIE WITH IMPROVED THERMAL INSULATION BETWEEN A POWER PORTION AND A PERIPHERAL PORTION, METHOD OF MANUFACTURING, AND PACKAGE HOUSING THE DIE [patent_app_type] => utility [patent_app_number] => 18/147563 [patent_app_country] => US [patent_app_date] => 2022-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3511 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18147563 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/147563
Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the die Dec 27, 2022 Issued
Array ( [id] => 19269460 [patent_doc_number] => 20240213164 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS [patent_app_type] => utility [patent_app_number] => 18/089483 [patent_app_country] => US [patent_app_date] => 2022-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5932 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18089483 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/089483
TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS Dec 26, 2022 Pending
Array ( [id] => 18335800 [patent_doc_number] => 20230127749 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => MICROELECTRONIC ASSEMBLIES [patent_app_type] => utility [patent_app_number] => 18/086308 [patent_app_country] => US [patent_app_date] => 2022-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 20892 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 196 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18086308 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/086308
Microelectronic assemblies Dec 20, 2022 Issued
Array ( [id] => 19252808 [patent_doc_number] => 20240203805 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-20 [patent_title] => EMBEDDED MEMORY FOR GLASS CORE PACKAGES [patent_app_type] => utility [patent_app_number] => 18/084275 [patent_app_country] => US [patent_app_date] => 2022-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5987 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 37 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18084275 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/084275
EMBEDDED MEMORY FOR GLASS CORE PACKAGES Dec 18, 2022 Pending
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