
Eva Y. Montalvo
Supervisory Patent Examiner (ID: 18787, Phone: (571)270-3829 , Office: P/2817 )
| Most Active Art Unit | 2814 |
| Art Unit(s) | 2814, 4158, 2817, 2899, 2800, 2818 |
| Total Applications | 368 |
| Issued Applications | 274 |
| Pending Applications | 16 |
| Abandoned Applications | 82 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5512099
[patent_doc_number] => 20090212403
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-08-27
[patent_title] => 'THERMALLY ENHANCED MOLDED LEADLESS PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 12/037428
[patent_app_country] => US
[patent_app_date] => 2008-02-26
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0212/20090212403.pdf
[firstpage_image] =>[orig_patent_app_number] => 12037428
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/037428 | Thermally enhanced molded leadless package | Feb 25, 2008 | Issued |
Array
(
[id] => 5512065
[patent_doc_number] => 20090212369
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-08-27
[patent_title] => 'Gate Effective-Workfunction Modification for CMOS'
[patent_app_type] => utility
[patent_app_number] => 12/037158
[patent_app_country] => US
[patent_app_date] => 2008-02-26
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 12037158
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/037158 | Gate effective-workfunction modification for CMOS | Feb 25, 2008 | Issued |
Array
(
[id] => 4724033
[patent_doc_number] => 20080203574
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-08-28
[patent_title] => 'INSULATING FILM MATERIAL, MULTILAYER INTERCONNECTION STRUCTURE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/037439
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[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0203/20080203574.pdf
[firstpage_image] =>[orig_patent_app_number] => 12037439
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/037439 | Insulating film material, multilayer interconnection structure, method for manufacturing same, and method for manufacturing semiconductor device | Feb 25, 2008 | Issued |
Array
(
[id] => 132691
[patent_doc_number] => 07700977
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-20
[patent_title] => 'Integrated circuit with a subsurface diode'
[patent_app_type] => utility
[patent_app_number] => 12/037569
[patent_app_country] => US
[patent_app_date] => 2008-02-26
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 12037569
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/037569 | Integrated circuit with a subsurface diode | Feb 25, 2008 | Issued |
Array
(
[id] => 4723942
[patent_doc_number] => 20080203483
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[patent_issue_date] => 2008-08-28
[patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING A RECESSED-CHANNEL-ARRAY MISFET'
[patent_app_type] => utility
[patent_app_number] => 12/036439
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/036439 | SEMICONDUCTOR DEVICE INCLUDING A RECESSED-CHANNEL-ARRAY MISFET | Feb 24, 2008 | Abandoned |
Array
(
[id] => 4644938
[patent_doc_number] => 08022545
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[patent_kind] => B2
[patent_issue_date] => 2011-09-20
[patent_title] => 'Top layers of metal for high performance IC\'s'
[patent_app_type] => utility
[patent_app_number] => 12/036308
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/036308 | Top layers of metal for high performance IC's | Feb 24, 2008 | Issued |
Array
(
[id] => 5512142
[patent_doc_number] => 20090212446
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[patent_kind] => A1
[patent_issue_date] => 2009-08-27
[patent_title] => 'Semiconductor Device'
[patent_app_type] => utility
[patent_app_number] => 12/036930
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[firstpage_image] =>[orig_patent_app_number] => 12036930
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/036930 | Semiconductor devices having a resin with warpage compensated surfaces | Feb 24, 2008 | Issued |
Array
(
[id] => 8214951
[patent_doc_number] => 08193624
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2012-06-05
[patent_title] => 'Semiconductor device having improved contact interface reliability and method therefor'
[patent_app_type] => utility
[patent_app_number] => 12/036498
[patent_app_country] => US
[patent_app_date] => 2008-02-25
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/08/193/08193624.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/036498 | Semiconductor device having improved contact interface reliability and method therefor | Feb 24, 2008 | Issued |
Array
(
[id] => 5511980
[patent_doc_number] => 20090212284
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[patent_issue_date] => 2009-08-27
[patent_title] => 'ELECTRONIC DEVICE AND MANUFACTURING THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/035598
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[patent_app_date] => 2008-02-22
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[firstpage_image] =>[orig_patent_app_number] => 12035598
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/035598 | Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof | Feb 21, 2008 | Issued |
Array
(
[id] => 8317868
[patent_doc_number] => 08232647
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[patent_issue_date] => 2012-07-31
[patent_title] => 'Structure and process for metallization in high aspect ratio features'
[patent_app_type] => utility
[patent_app_number] => 12/034708
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[patent_app_date] => 2008-02-21
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/034708 | Structure and process for metallization in high aspect ratio features | Feb 20, 2008 | Issued |
Array
(
[id] => 4695606
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[patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF'
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Array
(
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Array
(
[id] => 7763379
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[patent_title] => 'Semiconductor device capable of providing identical strains to each channel region of the transistors'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/034939 | Semiconductor device capable of providing identical strains to each channel region of the transistors | Feb 20, 2008 | Issued |
Array
(
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[patent_title] => 'Reduced Leakage Current Field-Effect Transistor Having Asymmetric Doping And Fabrication Method Therefor'
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Array
(
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Array
(
[id] => 5389012
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Array
(
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Array
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Array
(
[id] => 5524774
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[patent_issue_date] => 2009-08-06
[patent_title] => 'Crack Stops for Semiconductor Devices'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/024758 | Crack stops for semiconductor devices | Jan 31, 2008 | Issued |