
Eva Y. Montalvo
Supervisory Patent Examiner (ID: 18787, Phone: (571)270-3829 , Office: P/2817 )
| Most Active Art Unit | 2814 |
| Art Unit(s) | 2814, 4158, 2817, 2899, 2800, 2818 |
| Total Applications | 368 |
| Issued Applications | 274 |
| Pending Applications | 16 |
| Abandoned Applications | 82 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4715357
[patent_doc_number] => 20080237879
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-02
[patent_title] => 'SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/694719
[patent_app_country] => US
[patent_app_date] => 2007-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4700
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[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0237/20080237879.pdf
[firstpage_image] =>[orig_patent_app_number] => 11694719
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/694719 | Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same | Mar 29, 2007 | Issued |
Array
(
[id] => 5123463
[patent_doc_number] => 20070235733
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-11
[patent_title] => 'TRANSISTOR, PIXEL ELECTRODE SUBSTRATE, ELECTRO-OPTIC DEVICE, ELECTRONIC APPARATUS, AND PROCESS FOR MANUFACTURING SEMICONDUCTOR ELEMENT'
[patent_app_type] => utility
[patent_app_number] => 11/693138
[patent_app_country] => US
[patent_app_date] => 2007-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[pdf_file] => publications/A1/0235/20070235733.pdf
[firstpage_image] =>[orig_patent_app_number] => 11693138
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/693138 | TRANSISTOR, PIXEL ELECTRODE SUBSTRATE, ELECTRO-OPTIC DEVICE, ELECTRONIC APPARATUS, AND PROCESS FOR MANUFACTURING SEMICONDUCTOR ELEMENT | Mar 28, 2007 | Abandoned |
Array
(
[id] => 8294953
[patent_doc_number] => 08222741
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-07-17
[patent_title] => 'Semiconductor module with current connection element'
[patent_app_type] => utility
[patent_app_number] => 11/693379
[patent_app_country] => US
[patent_app_date] => 2007-03-29
[patent_effective_date] => 0000-00-00
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11693379
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/693379 | Semiconductor module with current connection element | Mar 28, 2007 | Issued |
Array
(
[id] => 4715323
[patent_doc_number] => 20080237845
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-02
[patent_title] => 'SYSTEMS AND METHODS FOR REMOVING HEAT FROM FLIP-CHIP DIE'
[patent_app_type] => utility
[patent_app_number] => 11/692348
[patent_app_country] => US
[patent_app_date] => 2007-03-28
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11692348
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/692348 | SYSTEMS AND METHODS FOR REMOVING HEAT FROM FLIP-CHIP DIE | Mar 27, 2007 | Abandoned |
Array
(
[id] => 4919330
[patent_doc_number] => 20080067642
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-20
[patent_title] => 'PACKAGED MICROELECTRONIC COMPONENTS'
[patent_app_type] => utility
[patent_app_number] => 11/692068
[patent_app_country] => US
[patent_app_date] => 2007-03-27
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0067/20080067642.pdf
[firstpage_image] =>[orig_patent_app_number] => 11692068
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/692068 | Packaged microelectronic components with terminals exposed through encapsulant | Mar 26, 2007 | Issued |
Array
(
[id] => 5060405
[patent_doc_number] => 20070222042
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-27
[patent_title] => 'SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES'
[patent_app_type] => utility
[patent_app_number] => 11/690908
[patent_app_country] => US
[patent_app_date] => 2007-03-26
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0222/20070222042.pdf
[firstpage_image] =>[orig_patent_app_number] => 11690908
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/690908 | Semiconductor devices and electrical parts manufacturing using metal coated wires | Mar 25, 2007 | Issued |
Array
(
[id] => 5066603
[patent_doc_number] => 20070187704
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-16
[patent_title] => 'SEMICONDUCTOR LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, INTEGRATED SEMICONDUCTOR LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, IMAGE DISPLAY DEVICE, MANUFACTURING METHOD THEREOF, ILLUMINATING DEVICE AND MANUFACTURING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/691299
[patent_app_country] => US
[patent_app_date] => 2007-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
[patent_figures_cnt] => 18
[patent_no_of_words] => 13639
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[pdf_file] => publications/A1/0187/20070187704.pdf
[firstpage_image] =>[orig_patent_app_number] => 11691299
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/691299 | SEMICONDUCTOR LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, INTEGRATED SEMICONDUCTOR LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, IMAGE DISPLAY DEVICE, MANUFACTURING METHOD THEREOF, ILLUMINATING DEVICE AND MANUFACTURING METHOD THEREOF | Mar 25, 2007 | Abandoned |
Array
(
[id] => 5002561
[patent_doc_number] => 20070200127
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-30
[patent_title] => 'POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 11/689868
[patent_app_country] => US
[patent_app_date] => 2007-03-22
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11689868
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/689868 | Power surface mount light emitting die package | Mar 21, 2007 | Issued |
Array
(
[id] => 5002634
[patent_doc_number] => 20070200200
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-30
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/705678
[patent_app_country] => US
[patent_app_date] => 2007-02-13
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[firstpage_image] =>[orig_patent_app_number] => 11705678
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/705678 | Method of manufacturing semiconductor device having resistor formed of a polycrystalline silicon film | Feb 12, 2007 | Issued |
Array
(
[id] => 5163066
[patent_doc_number] => 20070284647
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-13
[patent_title] => 'Semiconductor device and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/705109
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[firstpage_image] =>[orig_patent_app_number] => 11705109
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/705109 | DRAM device with cell epitaxial layers partially overlap buried cell gate electrode | Feb 11, 2007 | Issued |
Array
(
[id] => 4810714
[patent_doc_number] => 20080191345
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-08-14
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP OVER VIA'
[patent_app_type] => utility
[patent_app_number] => 11/673558
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[patent_app_date] => 2007-02-09
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[firstpage_image] =>[orig_patent_app_number] => 11673558
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/673558 | Integrated circuit package system with bump over via | Feb 8, 2007 | Issued |
Array
(
[id] => 5066577
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[patent_title] => 'Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof'
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[patent_app_number] => 11/704838
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Array
(
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[patent_title] => 'Transistors having implanted channels and implanted P-type regions beneath the source region'
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Array
(
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[patent_issue_date] => 2011-11-15
[patent_title] => 'Split gate with different gate materials and work functions to reduce gate resistance of ultra high density MOSFET'
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Array
(
[id] => 7741884
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[patent_title] => 'Semiconductor device having super junction structure'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/699579 | Semiconductor device having super junction structure | Jan 29, 2007 | Issued |
Array
(
[id] => 5256754
[patent_doc_number] => 20070210386
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[patent_issue_date] => 2007-09-13
[patent_title] => 'Plasma display apparatus'
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[firstpage_image] =>[orig_patent_app_number] => 11655209
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Array
(
[id] => 5002545
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[patent_title] => 'IMAGE DISPLAY DEVICE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/624419 | Array substrate for an image display device | Jan 17, 2007 | Issued |
Array
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Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/647299 | Package structure and manufacturing method thereof | Dec 28, 2006 | Issued |