Search

Eva Y. Montalvo

Supervisory Patent Examiner (ID: 18787, Phone: (571)270-3829 , Office: P/2817 )

Most Active Art Unit
2814
Art Unit(s)
2814, 4158, 2817, 2899, 2800, 2818
Total Applications
368
Issued Applications
274
Pending Applications
16
Abandoned Applications
82

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4715357 [patent_doc_number] => 20080237879 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-02 [patent_title] => 'SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME' [patent_app_type] => utility [patent_app_number] => 11/694719 [patent_app_country] => US [patent_app_date] => 2007-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4700 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0237/20080237879.pdf [firstpage_image] =>[orig_patent_app_number] => 11694719 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/694719
Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same Mar 29, 2007 Issued
Array ( [id] => 5123463 [patent_doc_number] => 20070235733 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-11 [patent_title] => 'TRANSISTOR, PIXEL ELECTRODE SUBSTRATE, ELECTRO-OPTIC DEVICE, ELECTRONIC APPARATUS, AND PROCESS FOR MANUFACTURING SEMICONDUCTOR ELEMENT' [patent_app_type] => utility [patent_app_number] => 11/693138 [patent_app_country] => US [patent_app_date] => 2007-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6056 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0235/20070235733.pdf [firstpage_image] =>[orig_patent_app_number] => 11693138 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/693138
TRANSISTOR, PIXEL ELECTRODE SUBSTRATE, ELECTRO-OPTIC DEVICE, ELECTRONIC APPARATUS, AND PROCESS FOR MANUFACTURING SEMICONDUCTOR ELEMENT Mar 28, 2007 Abandoned
Array ( [id] => 8294953 [patent_doc_number] => 08222741 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-07-17 [patent_title] => 'Semiconductor module with current connection element' [patent_app_type] => utility [patent_app_number] => 11/693379 [patent_app_country] => US [patent_app_date] => 2007-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 19 [patent_no_of_words] => 4283 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11693379 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/693379
Semiconductor module with current connection element Mar 28, 2007 Issued
Array ( [id] => 4715323 [patent_doc_number] => 20080237845 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-02 [patent_title] => 'SYSTEMS AND METHODS FOR REMOVING HEAT FROM FLIP-CHIP DIE' [patent_app_type] => utility [patent_app_number] => 11/692348 [patent_app_country] => US [patent_app_date] => 2007-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4714 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0237/20080237845.pdf [firstpage_image] =>[orig_patent_app_number] => 11692348 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/692348
SYSTEMS AND METHODS FOR REMOVING HEAT FROM FLIP-CHIP DIE Mar 27, 2007 Abandoned
Array ( [id] => 4919330 [patent_doc_number] => 20080067642 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-20 [patent_title] => 'PACKAGED MICROELECTRONIC COMPONENTS' [patent_app_type] => utility [patent_app_number] => 11/692068 [patent_app_country] => US [patent_app_date] => 2007-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6921 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0067/20080067642.pdf [firstpage_image] =>[orig_patent_app_number] => 11692068 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/692068
Packaged microelectronic components with terminals exposed through encapsulant Mar 26, 2007 Issued
Array ( [id] => 5060405 [patent_doc_number] => 20070222042 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-27 [patent_title] => 'SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES' [patent_app_type] => utility [patent_app_number] => 11/690908 [patent_app_country] => US [patent_app_date] => 2007-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2659 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0222/20070222042.pdf [firstpage_image] =>[orig_patent_app_number] => 11690908 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/690908
Semiconductor devices and electrical parts manufacturing using metal coated wires Mar 25, 2007 Issued
Array ( [id] => 5066603 [patent_doc_number] => 20070187704 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-16 [patent_title] => 'SEMICONDUCTOR LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, INTEGRATED SEMICONDUCTOR LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, IMAGE DISPLAY DEVICE, MANUFACTURING METHOD THEREOF, ILLUMINATING DEVICE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 11/691299 [patent_app_country] => US [patent_app_date] => 2007-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 13639 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0187/20070187704.pdf [firstpage_image] =>[orig_patent_app_number] => 11691299 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/691299
SEMICONDUCTOR LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, INTEGRATED SEMICONDUCTOR LIGHT EMITTING DEVICE, MANUFACTURING METHOD THEREOF, IMAGE DISPLAY DEVICE, MANUFACTURING METHOD THEREOF, ILLUMINATING DEVICE AND MANUFACTURING METHOD THEREOF Mar 25, 2007 Abandoned
Array ( [id] => 5002561 [patent_doc_number] => 20070200127 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-30 [patent_title] => 'POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/689868 [patent_app_country] => US [patent_app_date] => 2007-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6274 [patent_no_of_claims] => 49 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0200/20070200127.pdf [firstpage_image] =>[orig_patent_app_number] => 11689868 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/689868
Power surface mount light emitting die package Mar 21, 2007 Issued
Array ( [id] => 5002634 [patent_doc_number] => 20070200200 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-30 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/705678 [patent_app_country] => US [patent_app_date] => 2007-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 4948 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0200/20070200200.pdf [firstpage_image] =>[orig_patent_app_number] => 11705678 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/705678
Method of manufacturing semiconductor device having resistor formed of a polycrystalline silicon film Feb 12, 2007 Issued
Array ( [id] => 5163066 [patent_doc_number] => 20070284647 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-13 [patent_title] => 'Semiconductor device and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 11/705109 [patent_app_country] => US [patent_app_date] => 2007-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6237 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0284/20070284647.pdf [firstpage_image] =>[orig_patent_app_number] => 11705109 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/705109
DRAM device with cell epitaxial layers partially overlap buried cell gate electrode Feb 11, 2007 Issued
Array ( [id] => 4810714 [patent_doc_number] => 20080191345 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-14 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP OVER VIA' [patent_app_type] => utility [patent_app_number] => 11/673558 [patent_app_country] => US [patent_app_date] => 2007-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3363 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0191/20080191345.pdf [firstpage_image] =>[orig_patent_app_number] => 11673558 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/673558
Integrated circuit package system with bump over via Feb 8, 2007 Issued
Array ( [id] => 5066577 [patent_doc_number] => 20070187678 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-16 [patent_title] => 'Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/704838 [patent_app_country] => US [patent_app_date] => 2007-02-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5772 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0187/20070187678.pdf [firstpage_image] =>[orig_patent_app_number] => 11704838 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/704838
Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof Feb 8, 2007 Issued
Array ( [id] => 4462179 [patent_doc_number] => 07880172 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-01 [patent_title] => 'Transistors having implanted channels and implanted P-type regions beneath the source region' [patent_app_type] => utility [patent_app_number] => 11/700268 [patent_app_country] => US [patent_app_date] => 2007-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 9227 [patent_no_of_claims] => 42 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/880/07880172.pdf [firstpage_image] =>[orig_patent_app_number] => 11700268 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/700268
Transistors having implanted channels and implanted P-type regions beneath the source region Jan 30, 2007 Issued
Array ( [id] => 7540843 [patent_doc_number] => 08058687 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-11-15 [patent_title] => 'Split gate with different gate materials and work functions to reduce gate resistance of ultra high density MOSFET' [patent_app_type] => utility [patent_app_number] => 11/700688 [patent_app_country] => US [patent_app_date] => 2007-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 2743 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/058/08058687.pdf [firstpage_image] =>[orig_patent_app_number] => 11700688 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/700688
Split gate with different gate materials and work functions to reduce gate resistance of ultra high density MOSFET Jan 29, 2007 Issued
Array ( [id] => 7741884 [patent_doc_number] => 08106453 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-01-31 [patent_title] => 'Semiconductor device having super junction structure' [patent_app_type] => utility [patent_app_number] => 11/699579 [patent_app_country] => US [patent_app_date] => 2007-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 36 [patent_no_of_words] => 12773 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 222 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/106/08106453.pdf [firstpage_image] =>[orig_patent_app_number] => 11699579 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/699579
Semiconductor device having super junction structure Jan 29, 2007 Issued
Array ( [id] => 5256754 [patent_doc_number] => 20070210386 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-13 [patent_title] => 'Plasma display apparatus' [patent_app_type] => utility [patent_app_number] => 11/655209 [patent_app_country] => US [patent_app_date] => 2007-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6002 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0210/20070210386.pdf [firstpage_image] =>[orig_patent_app_number] => 11655209 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/655209
Plasma display apparatus Jan 18, 2007 Abandoned
Array ( [id] => 5002545 [patent_doc_number] => 20070200111 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-30 [patent_title] => 'IMAGE DISPLAY DEVICE' [patent_app_type] => utility [patent_app_number] => 11/624419 [patent_app_country] => US [patent_app_date] => 2007-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4020 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0200/20070200111.pdf [firstpage_image] =>[orig_patent_app_number] => 11624419 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/624419
Array substrate for an image display device Jan 17, 2007 Issued
Array ( [id] => 239969 [patent_doc_number] => 07592688 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-09-22 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/653579 [patent_app_country] => US [patent_app_date] => 2007-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 4263 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 293 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/592/07592688.pdf [firstpage_image] =>[orig_patent_app_number] => 11653579 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/653579
Semiconductor package Jan 15, 2007 Issued
Array ( [id] => 4749265 [patent_doc_number] => 20080157336 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'Wafer level package with die receiving through-hole and method of the same' [patent_app_type] => utility [patent_app_number] => 11/648688 [patent_app_country] => US [patent_app_date] => 2007-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4179 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20080157336.pdf [firstpage_image] =>[orig_patent_app_number] => 11648688 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/648688
Wafer level package with die receiving through-hole and method of the same Jan 2, 2007 Issued
Array ( [id] => 4614361 [patent_doc_number] => 07989937 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-08-02 [patent_title] => 'Package structure and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/647299 [patent_app_country] => US [patent_app_date] => 2006-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 18 [patent_no_of_words] => 2385 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/989/07989937.pdf [firstpage_image] =>[orig_patent_app_number] => 11647299 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/647299
Package structure and manufacturing method thereof Dec 28, 2006 Issued
Menu