
Eva Y. Montalvo
Supervisory Patent Examiner (ID: 18787, Phone: (571)270-3829 , Office: P/2817 )
| Most Active Art Unit | 2814 |
| Art Unit(s) | 2814, 4158, 2817, 2899, 2800, 2818 |
| Total Applications | 368 |
| Issued Applications | 274 |
| Pending Applications | 16 |
| Abandoned Applications | 82 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5250656
[patent_doc_number] => 20070132112
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-14
[patent_title] => 'Semiconductor device and mold for resin-molding semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/599258
[patent_app_country] => US
[patent_app_date] => 2006-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4262
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0132/20070132112.pdf
[firstpage_image] =>[orig_patent_app_number] => 11599258
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/599258 | Semiconductor device and mold for resin-molding semiconductor device | Nov 14, 2006 | Issued |
Array
(
[id] => 7811624
[patent_doc_number] => 08134156
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-03-13
[patent_title] => 'Semiconductor device including zinc oxide containing semiconductor film'
[patent_app_type] => utility
[patent_app_number] => 11/598669
[patent_app_country] => US
[patent_app_date] => 2006-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 45
[patent_no_of_words] => 14564
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/134/08134156.pdf
[firstpage_image] =>[orig_patent_app_number] => 11598669
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/598669 | Semiconductor device including zinc oxide containing semiconductor film | Nov 13, 2006 | Issued |
Array
(
[id] => 4477158
[patent_doc_number] => 07868407
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-01-11
[patent_title] => 'Substrate comprising a lower silicone resin film and an upper silicone resin film'
[patent_app_type] => utility
[patent_app_number] => 11/598749
[patent_app_country] => US
[patent_app_date] => 2006-11-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 14843
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/868/07868407.pdf
[firstpage_image] =>[orig_patent_app_number] => 11598749
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/598749 | Substrate comprising a lower silicone resin film and an upper silicone resin film | Nov 13, 2006 | Issued |
Array
(
[id] => 5093001
[patent_doc_number] => 20070114610
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-24
[patent_title] => 'Semiconductor device and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/599218
[patent_app_country] => US
[patent_app_date] => 2006-11-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3688
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0114/20070114610.pdf
[firstpage_image] =>[orig_patent_app_number] => 11599218
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/599218 | Semiconductor device and method of fabricating the same | Nov 12, 2006 | Abandoned |
Array
(
[id] => 4901821
[patent_doc_number] => 20080111233
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-15
[patent_title] => 'Semiconductor package with embedded die'
[patent_app_type] => utility
[patent_app_number] => 11/595638
[patent_app_country] => US
[patent_app_date] => 2006-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 5395
[patent_no_of_claims] => 37
[patent_no_of_ind_claims] => 6
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0111/20080111233.pdf
[firstpage_image] =>[orig_patent_app_number] => 11595638
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/595638 | Semiconductor package with embedded die | Nov 9, 2006 | Issued |
Array
(
[id] => 5215845
[patent_doc_number] => 20070104926
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-10
[patent_title] => 'Circuit device in particular frequency converter'
[patent_app_type] => utility
[patent_app_number] => 11/595088
[patent_app_country] => US
[patent_app_date] => 2006-11-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1452
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0104/20070104926.pdf
[firstpage_image] =>[orig_patent_app_number] => 11595088
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/595088 | Circuit device in particular frequency converter | Nov 8, 2006 | Abandoned |
Array
(
[id] => 5031556
[patent_doc_number] => 20070096095
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-03
[patent_title] => 'Test pattern for semiconductor device and method for measuring pattern shift'
[patent_app_type] => utility
[patent_app_number] => 11/589959
[patent_app_country] => US
[patent_app_date] => 2006-10-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2636
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0096/20070096095.pdf
[firstpage_image] =>[orig_patent_app_number] => 11589959
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/589959 | Test pattern for semiconductor device and method for measuring pattern shift | Oct 30, 2006 | Abandoned |
Array
(
[id] => 4890693
[patent_doc_number] => 20080099790
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-01
[patent_title] => 'LAYOUT STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 11/553788
[patent_app_country] => US
[patent_app_date] => 2006-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 3757
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 0
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0099/20080099790.pdf
[firstpage_image] =>[orig_patent_app_number] => 11553788
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/553788 | Layout structure having a fill element arranged at an angle to a conducting line | Oct 26, 2006 | Issued |
Array
(
[id] => 5031753
[patent_doc_number] => 20070096292
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-03
[patent_title] => 'Electronic-part built-in substrate and manufacturing method therefor'
[patent_app_type] => utility
[patent_app_number] => 11/586628
[patent_app_country] => US
[patent_app_date] => 2006-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 21
[patent_no_of_words] => 8115
[patent_no_of_claims] => 7
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0096/20070096292.pdf
[firstpage_image] =>[orig_patent_app_number] => 11586628
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/586628 | Electronic-part built-in substrate and manufacturing method therefor | Oct 25, 2006 | Abandoned |
Array
(
[id] => 5208242
[patent_doc_number] => 20070246826
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-25
[patent_title] => 'Wafer level semiconductor module and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/585088
[patent_app_country] => US
[patent_app_date] => 2006-10-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 4803
[patent_no_of_claims] => 31
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0246/20070246826.pdf
[firstpage_image] =>[orig_patent_app_number] => 11585088
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/585088 | Wafer level semiconductor module and method for manufacturing the same | Oct 23, 2006 | Abandoned |
Array
(
[id] => 5082972
[patent_doc_number] => 20070273023
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-29
[patent_title] => 'Integrated circuit package having exposed thermally conducting body'
[patent_app_type] => utility
[patent_app_number] => 11/583718
[patent_app_country] => US
[patent_app_date] => 2006-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 7926
[patent_no_of_claims] => 37
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0273/20070273023.pdf
[firstpage_image] =>[orig_patent_app_number] => 11583718
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/583718 | Integrated circuit package having exposed thermally conducting body | Oct 19, 2006 | Abandoned |
Array
(
[id] => 4913150
[patent_doc_number] => 20080093749
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-24
[patent_title] => 'Partial Solder Mask Defined Pad Design'
[patent_app_type] => utility
[patent_app_number] => 11/551508
[patent_app_country] => US
[patent_app_date] => 2006-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 6754
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0093/20080093749.pdf
[firstpage_image] =>[orig_patent_app_number] => 11551508
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/551508 | Partial Solder Mask Defined Pad Design | Oct 19, 2006 | Abandoned |
Array
(
[id] => 5031616
[patent_doc_number] => 20070096155
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-03
[patent_title] => 'Cell structure for a semiconductor memory device and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/581359
[patent_app_country] => US
[patent_app_date] => 2006-10-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
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[patent_no_of_words] => 8104
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0096/20070096155.pdf
[firstpage_image] =>[orig_patent_app_number] => 11581359
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/581359 | Cell structure for a semiconductor memory device and method of fabricating the same | Oct 16, 2006 | Abandoned |
Array
(
[id] => 121346
[patent_doc_number] => 07709292
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-05-04
[patent_title] => 'Processes and packaging for high voltage integrated circuits, electronic devices, and circuits'
[patent_app_type] => utility
[patent_app_number] => 11/541429
[patent_app_country] => US
[patent_app_date] => 2006-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[patent_no_of_words] => 8483
[patent_no_of_claims] => 19
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/709/07709292.pdf
[firstpage_image] =>[orig_patent_app_number] => 11541429
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/541429 | Processes and packaging for high voltage integrated circuits, electronic devices, and circuits | Sep 28, 2006 | Issued |
Array
(
[id] => 591440
[patent_doc_number] => 07439611
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-10-21
[patent_title] => 'Circuit board with auxiliary wiring configuration to suppress breakage during bonding process'
[patent_app_type] => utility
[patent_app_number] => 11/534288
[patent_app_country] => US
[patent_app_date] => 2006-09-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/439/07439611.pdf
[firstpage_image] =>[orig_patent_app_number] => 11534288
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/534288 | Circuit board with auxiliary wiring configuration to suppress breakage during bonding process | Sep 21, 2006 | Issued |
Array
(
[id] => 4817024
[patent_doc_number] => 20080224283
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-09-18
[patent_title] => 'Leadframe-based semiconductor package and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/523719
[patent_app_country] => US
[patent_app_date] => 2006-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 4195
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0224/20080224283.pdf
[firstpage_image] =>[orig_patent_app_number] => 11523719
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/523719 | Leadframe-based semiconductor package and fabrication method thereof | Sep 19, 2006 | Abandoned |
Array
(
[id] => 4985896
[patent_doc_number] => 20070152234
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-05
[patent_title] => 'LIGHT EMITTING DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/533149
[patent_app_country] => US
[patent_app_date] => 2006-09-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0152/20070152234.pdf
[firstpage_image] =>[orig_patent_app_number] => 11533149
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/533149 | Light emitting device with filled tetrahedral (FT) semiconductor in the active layer | Sep 18, 2006 | Issued |
Array
(
[id] => 7593310
[patent_doc_number] => 07651890
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-01-26
[patent_title] => 'Method and apparatus for prevention of solder corrosion'
[patent_app_type] => utility
[patent_app_number] => 11/532329
[patent_app_country] => US
[patent_app_date] => 2006-09-15
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[pdf_file] => patents/07/651/07651890.pdf
[firstpage_image] =>[orig_patent_app_number] => 11532329
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/532329 | Method and apparatus for prevention of solder corrosion | Sep 14, 2006 | Issued |
Array
(
[id] => 4634325
[patent_doc_number] => 08012774
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-09-06
[patent_title] => 'Coating process for a light-emitting diode (LED)'
[patent_app_type] => utility
[patent_app_number] => 11/530128
[patent_app_country] => US
[patent_app_date] => 2006-09-08
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/012/08012774.pdf
[firstpage_image] =>[orig_patent_app_number] => 11530128
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/530128 | Coating process for a light-emitting diode (LED) | Sep 7, 2006 | Issued |
Array
(
[id] => 5152127
[patent_doc_number] => 20070035009
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-15
[patent_title] => 'Printed circuit board, semiconductor package and multi-stack semiconductor package using the same'
[patent_app_type] => utility
[patent_app_number] => 11/502399
[patent_app_country] => US
[patent_app_date] => 2006-08-11
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0035/20070035009.pdf
[firstpage_image] =>[orig_patent_app_number] => 11502399
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/502399 | Printed circuit board, semiconductor package and multi-stack semiconductor package using the same | Aug 10, 2006 | Abandoned |