Eva Y. Montalvo

Array ( [id] => 8519859 [patent_doc_number] => 20120319267 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-12-20 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THERMAL DISPERSAL STRUCTURES AND METHOD OF MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 13/163611 [patent_app_country] => US [patent_app_date] => 2011-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 11679 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13163611 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9441554 [patent_doc_number] => 08710668 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-29 [patent_title] => 'Integrated circuit packaging system with laser hole and method of manufacture thereof' [patent_app_type] => utility [patent_app_number] => 13/163150 [patent_app_country] => US [patent_app_date] => 2011-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 8480 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13163150 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9530530 [patent_doc_number] => 08754405 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-17 [patent_title] => 'Organic electroluminescence device having anode including metal oxide and conductive polymer, light emission apparatus, and method of fabricating organic electroluminescence device' [patent_app_type] => utility [patent_app_number] => 13/162637 [patent_app_country] => US [patent_app_date] => 2011-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 10 [patent_no_of_words] => 13869 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13162637 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7717177 [patent_doc_number] => 20120007227 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-01-12 [patent_title] => 'HIGH DENSITY CHIP STACKED PACKAGE, PACKAGE-ON-PACKAGE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/162846 [patent_app_country] => US [patent_app_date] => 2011-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 9548 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20120007227.pdf [firstpage_image] =>[orig_patent_app_number] => 13162846 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7660213 [patent_doc_number] => 20110309482 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-12-22 [patent_title] => 'FINGER SENSOR INCLUDING ENCAPSULATING LAYER OVER SENSING AREA AND RELATED METHODS' [patent_app_type] => utility [patent_app_number] => 13/163108 [patent_app_country] => US [patent_app_date] => 2011-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3529 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0309/20110309482.pdf [firstpage_image] =>[orig_patent_app_number] => 13163108 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8533281 [patent_doc_number] => 08309435 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-11-13 [patent_title] => 'Crack stops for semiconductor devices' [patent_app_type] => utility [patent_app_number] => 13/160214 [patent_app_country] => US [patent_app_date] => 2011-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 7463 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13160214 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9184354 [patent_doc_number] => 08624292 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-01-07 [patent_title] => 'Non-polar semiconductor light emission devices' [patent_app_type] => utility [patent_app_number] => 13/155857 [patent_app_country] => US [patent_app_date] => 2011-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 22 [patent_no_of_words] => 6172 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13155857 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7696546 [patent_doc_number] => 20110230044 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-09-22 [patent_title] => 'CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MANUFACTURING METHOD FOR THE SAME' [patent_app_type] => utility [patent_app_number] => 13/150470 [patent_app_country] => US [patent_app_date] => 2011-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 6684 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0230/20110230044.pdf [firstpage_image] =>[orig_patent_app_number] => 13150470 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9524712 [patent_doc_number] => 08748988 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-10 [patent_title] => 'Semiconductor device having resistor formed of a polycrystalline silicon film' [patent_app_type] => utility [patent_app_number] => 13/134039 [patent_app_country] => US [patent_app_date] => 2011-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 15 [patent_no_of_words] => 4990 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13134039 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9455817 [patent_doc_number] => 08716829 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-05-06 [patent_title] => 'Semiconductor devices with sealed, unlined trenches and methods of forming same' [patent_app_type] => utility [patent_app_number] => 13/091416 [patent_app_country] => US [patent_app_date] => 2011-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 45 [patent_figures_cnt] => 48 [patent_no_of_words] => 13544 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13091416 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9497197 [patent_doc_number] => 08736019 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-05-27 [patent_title] => 'Semiconductor devices with sealed, unlined trenches and methods of forming same' [patent_app_type] => utility [patent_app_number] => 13/091410 [patent_app_country] => US [patent_app_date] => 2011-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 45 [patent_figures_cnt] => 48 [patent_no_of_words] => 13544 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13091410 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8462589 [patent_doc_number] => 20120267757 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-25 [patent_title] => 'CAPACITOR STRUCTURE WITH METAL BILAYER AND METHOD FOR USING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/090277 [patent_app_country] => US [patent_app_date] => 2011-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2612 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13090277 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8462608 [patent_doc_number] => 20120267776 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-25 [patent_title] => 'CHIP STACK PACKAGE' [patent_app_type] => utility [patent_app_number] => 13/090281 [patent_app_country] => US [patent_app_date] => 2011-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4156 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13090281 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7558952 [patent_doc_number] => 20110272783 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-10 [patent_title] => 'SEMICONDUCTOR DEVICE WITH BIPOLAR TRANSISTOR AND CAPACITOR' [patent_app_type] => utility [patent_app_number] => 13/090347 [patent_app_country] => US [patent_app_date] => 2011-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1771 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0272/20110272783.pdf [firstpage_image] =>[orig_patent_app_number] => 13090347 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8846771 [patent_doc_number] => 08455958 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-06-04 [patent_title] => 'Insulated gate semiconductor device with well region edge positioned within ring-shaped buffer trench' [patent_app_type] => utility [patent_app_number] => 13/090288 [patent_app_country] => US [patent_app_date] => 2011-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 7107 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13090288 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9227896 [patent_doc_number] => 08633566 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-01-21 [patent_title] => 'Memory cell repair' [patent_app_type] => utility [patent_app_number] => 13/089967 [patent_app_country] => US [patent_app_date] => 2011-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 4301 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13089967 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8944003 [patent_doc_number] => 08497182 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-07-30 [patent_title] => 'Sidewall thin film electrode with self-aligned top electrode and programmable resistance memory' [patent_app_type] => utility [patent_app_number] => 13/089934 [patent_app_country] => US [patent_app_date] => 2011-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 24 [patent_no_of_words] => 6850 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13089934 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7558968 [patent_doc_number] => 20110272799 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-11-10 [patent_title] => 'IC CHIP AND IC CHIP MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 13/089438 [patent_app_country] => US [patent_app_date] => 2011-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1926 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0272/20110272799.pdf [firstpage_image] =>[orig_patent_app_number] => 13089438 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9711545 [patent_doc_number] => 08836120 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-09-16 [patent_title] => 'Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer' [patent_app_type] => utility [patent_app_number] => 13/090092 [patent_app_country] => US [patent_app_date] => 2011-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 4918 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13090092 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7773118 [patent_doc_number] => 20120038004 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-02-16 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/089743 [patent_app_country] => US [patent_app_date] => 2011-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 33 [patent_no_of_words] => 9093 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20120038004.pdf [firstpage_image] =>[orig_patent_app_number] => 13089743 [rel_patent_id] =>[rel_patent_doc_number] =>)