Evren Seven

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Array ( [id] => 8846133 [patent_doc_number] => 08455312 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-06-04 [patent_title] => 'Fabrication methods for T-gate and inverted L-gate structure for high frequency devices and circuits' [patent_app_type] => utility [patent_app_number] => 13/199816 [patent_app_country] => US [patent_app_date] => 2011-09-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 27 [patent_no_of_words] => 4603 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 435 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13199816 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8042443 [patent_doc_number] => 20120070957 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-03-22 [patent_title] => 'AIR GAP FORMATION' [patent_app_type] => utility [patent_app_number] => 13/229673 [patent_app_country] => US [patent_app_date] => 2011-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 7144 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0070/20120070957.pdf [firstpage_image] =>[orig_patent_app_number] => 13229673 [rel_patent_id] =>[rel_patent_doc_number] =>)

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Array ( [id] => 8859139 [patent_doc_number] => 08461676 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-06-11 [patent_title] => 'Soldering relief method and semiconductor device employing same' [patent_app_type] => utility [patent_app_number] => 13/228925 [patent_app_country] => US [patent_app_date] => 2011-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 2779 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13228925 [rel_patent_id] =>[rel_patent_doc_number] =>)

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Array ( [id] => 8563753 [patent_doc_number] => 20120326324 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-12-27 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 13/166679 [patent_app_country] => US [patent_app_date] => 2011-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 12548 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13166679 [rel_patent_id] =>[rel_patent_doc_number] =>)

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