Fang-xing Jiang

Array ( [id] => 4775730 [patent_doc_number] => 20080283728 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-11-20 [patent_title] => 'Solid-state image pickup device and a method of manufacturing the same, and image pickup apparatus' [patent_app_type] => utility [patent_app_number] => 12/081531 [patent_app_country] => US [patent_app_date] => 2008-04-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 8604 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0283/20080283728.pdf [firstpage_image] =>[orig_patent_app_number] => 12081531 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5439316 [patent_doc_number] => 20090090955 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-09 [patent_title] => 'ELEVATED CHANNEL FLASH DEVICE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 12/057391 [patent_app_country] => US [patent_app_date] => 2008-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3625 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0090/20090090955.pdf [firstpage_image] =>[orig_patent_app_number] => 12057391 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5469903 [patent_doc_number] => 20090243069 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-10-01 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION' [patent_app_type] => utility [patent_app_number] => 12/055612 [patent_app_country] => US [patent_app_date] => 2008-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 7892 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0243/20090243069.pdf [firstpage_image] =>[orig_patent_app_number] => 12055612 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8352564 [patent_doc_number] => 08247894 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-08-21 [patent_title] => 'Integrated circuit package system with step mold recess' [patent_app_type] => utility [patent_app_number] => 12/053751 [patent_app_country] => US [patent_app_date] => 2008-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 7840 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12053751 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4738968 [patent_doc_number] => 20080232621 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-25 [patent_title] => 'APPARATUS FOR VENTED HEARING ASSISTANCE SYSTEMS' [patent_app_type] => utility [patent_app_number] => 12/051635 [patent_app_country] => US [patent_app_date] => 2008-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4109 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0232/20080232621.pdf [firstpage_image] =>[orig_patent_app_number] => 12051635 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9324128 [patent_doc_number] => 08659154 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-02-25 [patent_title] => 'Semiconductor device including adhesive covered element' [patent_app_type] => utility [patent_app_number] => 12/048602 [patent_app_country] => US [patent_app_date] => 2008-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 14 [patent_no_of_words] => 2879 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12048602 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4856399 [patent_doc_number] => 20080265249 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-30 [patent_title] => 'STACKED SEMICONDUCTOR DEVICE ASSEMBLY AND PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/045271 [patent_app_country] => US [patent_app_date] => 2008-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2841 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0265/20080265249.pdf [firstpage_image] =>[orig_patent_app_number] => 12045271 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8749943 [patent_doc_number] => 08415777 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-04-09 [patent_title] => 'Integrated circuit with millimeter wave and inductive coupling and methods for use therewith' [patent_app_type] => utility [patent_app_number] => 12/040301 [patent_app_country] => US [patent_app_date] => 2008-02-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 43 [patent_figures_cnt] => 76 [patent_no_of_words] => 29574 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12040301 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8147108 [patent_doc_number] => 08164126 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-04-24 [patent_title] => 'CMOS image sensors including backside illumination structure' [patent_app_type] => utility [patent_app_number] => 12/037691 [patent_app_country] => US [patent_app_date] => 2008-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 4264 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/164/08164126.pdf [firstpage_image] =>[orig_patent_app_number] => 12037691 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5334490 [patent_doc_number] => 20090050954 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-26 [patent_title] => 'Non-volatile memory device including charge trap layer and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/071351 [patent_app_country] => US [patent_app_date] => 2008-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3729 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0050/20090050954.pdf [firstpage_image] =>[orig_patent_app_number] => 12071351 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4810706 [patent_doc_number] => 20080191337 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-14 [patent_title] => 'SEMICONDUCTOR DIE PACKAGE AND EMBEDDED PRINTED CIRCUIT BOARD' [patent_app_type] => utility [patent_app_number] => 12/029502 [patent_app_country] => US [patent_app_date] => 2008-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2081 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0191/20080191337.pdf [firstpage_image] =>[orig_patent_app_number] => 12029502 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4723952 [patent_doc_number] => 20080203493 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-28 [patent_title] => 'Semiconductor memory device and fabrication process thereof' [patent_app_type] => utility [patent_app_number] => 12/068692 [patent_app_country] => US [patent_app_date] => 2008-02-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 10527 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0203/20080203493.pdf [firstpage_image] =>[orig_patent_app_number] => 12068692 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4605056 [patent_doc_number] => 07986037 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-07-26 [patent_title] => 'Low noise semiconductor device' [patent_app_type] => utility [patent_app_number] => 12/068606 [patent_app_country] => US [patent_app_date] => 2008-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 16 [patent_no_of_words] => 5092 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 433 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/986/07986037.pdf [firstpage_image] =>[orig_patent_app_number] => 12068606 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4810642 [patent_doc_number] => 20080191273 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-14 [patent_title] => 'MOSFET DEVICE HAVING IMPROVED AVALANCHE CAPABILITY' [patent_app_type] => utility [patent_app_number] => 12/028101 [patent_app_country] => US [patent_app_date] => 2008-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1114 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0191/20080191273.pdf [firstpage_image] =>[orig_patent_app_number] => 12028101 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4870767 [patent_doc_number] => 20080197501 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-21 [patent_title] => 'INTERCONNECTION SUBSTRATE AND SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF INTERCONNECTION SUBSTRATE' [patent_app_type] => utility [patent_app_number] => 11/968341 [patent_app_country] => US [patent_app_date] => 2008-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 5188 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0197/20080197501.pdf [firstpage_image] =>[orig_patent_app_number] => 11968341 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5432257 [patent_doc_number] => 20090166843 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-07-02 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 11/965081 [patent_app_country] => US [patent_app_date] => 2007-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 3128 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0166/20090166843.pdf [firstpage_image] =>[orig_patent_app_number] => 11965081 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4876726 [patent_doc_number] => 20080150109 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-26 [patent_title] => 'ELECTRONIC COMPONENT' [patent_app_type] => utility [patent_app_number] => 11/962232 [patent_app_country] => US [patent_app_date] => 2007-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 5974 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20080150109.pdf [firstpage_image] =>[orig_patent_app_number] => 11962232 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5499351 [patent_doc_number] => 20090160039 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-25 [patent_title] => 'METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS' [patent_app_type] => utility [patent_app_number] => 11/961842 [patent_app_country] => US [patent_app_date] => 2007-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5569 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0160/20090160039.pdf [firstpage_image] =>[orig_patent_app_number] => 11961842 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9850774 [patent_doc_number] => 08952511 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-02-10 [patent_title] => 'Integrated circuit package having bottom-side stiffener' [patent_app_type] => utility [patent_app_number] => 11/959331 [patent_app_country] => US [patent_app_date] => 2007-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3498 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11959331 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5542806 [patent_doc_number] => 20090152683 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-06-18 [patent_title] => 'ROUNDED DIE CONFIGURATION FOR STRESS MINIMIZATION AND ENHANCED THERMO-MECHANICAL RELIABILITY' [patent_app_type] => utility [patent_app_number] => 11/959422 [patent_app_country] => US [patent_app_date] => 2007-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3520 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0152/20090152683.pdf [firstpage_image] =>[orig_patent_app_number] => 11959422 [rel_patent_id] =>[rel_patent_doc_number] =>)