Search

Fang-xing Jiang

Examiner (ID: 7225, Phone: (571)270-7548 , Office: P/2815 )

Most Active Art Unit
2815
Art Unit(s)
2815
Total Applications
386
Issued Applications
221
Pending Applications
0
Abandoned Applications
168

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4768829 [patent_doc_number] => 20080054485 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-06 [patent_title] => 'SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 11/846311 [patent_app_country] => US [patent_app_date] => 2007-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3317 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0054/20080054485.pdf [firstpage_image] =>[orig_patent_app_number] => 11846311 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/846311
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF Aug 27, 2007 Abandoned
Array ( [id] => 5334586 [patent_doc_number] => 20090051050 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-26 [patent_title] => ' CORNER I/O PAD DENSITY' [patent_app_type] => utility [patent_app_number] => 11/844881 [patent_app_country] => US [patent_app_date] => 2007-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2257 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0051/20090051050.pdf [firstpage_image] =>[orig_patent_app_number] => 11844881 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/844881
CORNER I/O PAD DENSITY Aug 23, 2007 Abandoned
Array ( [id] => 5334555 [patent_doc_number] => 20090051019 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-26 [patent_title] => 'Multi-chip module package' [patent_app_type] => utility [patent_app_number] => 11/894341 [patent_app_country] => US [patent_app_date] => 2007-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3527 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0051/20090051019.pdf [firstpage_image] =>[orig_patent_app_number] => 11894341 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/894341
Multi-chip module package Aug 19, 2007 Abandoned
Array ( [id] => 5008170 [patent_doc_number] => 20070278647 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-06 [patent_title] => 'PACKAGE MOUNTED MODULE AND PACKAGE BOARD MODULE' [patent_app_type] => utility [patent_app_number] => 11/838431 [patent_app_country] => US [patent_app_date] => 2007-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2769 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0278/20070278647.pdf [firstpage_image] =>[orig_patent_app_number] => 11838431 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/838431
Package mounted module and package board module Aug 13, 2007 Issued
Array ( [id] => 5413614 [patent_doc_number] => 20090039501 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-12 [patent_title] => 'INTEGRATED CIRCUIT WITH GALVANICALLY BONDED HEAT SINK' [patent_app_type] => utility [patent_app_number] => 11/835781 [patent_app_country] => US [patent_app_date] => 2007-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2950 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0039/20090039501.pdf [firstpage_image] =>[orig_patent_app_number] => 11835781 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/835781
Integrated circuit with galvanically bonded heat sink Aug 7, 2007 Issued
Array ( [id] => 4768802 [patent_doc_number] => 20080054458 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-06 [patent_title] => 'Electronic device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/890671 [patent_app_country] => US [patent_app_date] => 2007-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 6050 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0054/20080054458.pdf [firstpage_image] =>[orig_patent_app_number] => 11890671 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/890671
Electronic device and method of manufacturing the same Aug 6, 2007 Abandoned
Array ( [id] => 5358077 [patent_doc_number] => 20090032871 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-05 [patent_title] => 'INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT' [patent_app_type] => utility [patent_app_number] => 11/832451 [patent_app_country] => US [patent_app_date] => 2007-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3584 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0032/20090032871.pdf [firstpage_image] =>[orig_patent_app_number] => 11832451 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/832451
INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT Jul 31, 2007 Abandoned
Array ( [id] => 8283404 [patent_doc_number] => 08217511 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-07-10 [patent_title] => 'Redistributed chip packaging with thermal contact to device backside' [patent_app_type] => utility [patent_app_number] => 11/831651 [patent_app_country] => US [patent_app_date] => 2007-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 13 [patent_no_of_words] => 3758 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 215 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11831651 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/831651
Redistributed chip packaging with thermal contact to device backside Jul 30, 2007 Issued
Array ( [id] => 8104955 [patent_doc_number] => 08154127 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2012-04-10 [patent_title] => 'Optical device and method of making the same' [patent_app_type] => utility [patent_app_number] => 11/829995 [patent_app_country] => US [patent_app_date] => 2007-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 3897 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/154/08154127.pdf [firstpage_image] =>[orig_patent_app_number] => 11829995 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/829995
Optical device and method of making the same Jul 29, 2007 Issued
Array ( [id] => 5518618 [patent_doc_number] => 20090026599 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-29 [patent_title] => 'Memory module capable of lessening shock stress' [patent_app_type] => utility [patent_app_number] => 11/878891 [patent_app_country] => US [patent_app_date] => 2007-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2358 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0026/20090026599.pdf [firstpage_image] =>[orig_patent_app_number] => 11878891 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/878891
Memory module capable of lessening shock stress Jul 26, 2007 Abandoned
Array ( [id] => 4654954 [patent_doc_number] => 20080023814 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-31 [patent_title] => 'STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/829851 [patent_app_country] => US [patent_app_date] => 2007-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5090 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20080023814.pdf [firstpage_image] =>[orig_patent_app_number] => 11829851 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/829851
STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE Jul 26, 2007 Abandoned
Array ( [id] => 4649230 [patent_doc_number] => 20080036485 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-14 [patent_title] => 'SEMICONDUCTOR WAFER AND METHOD OF TESTING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/829388 [patent_app_country] => US [patent_app_date] => 2007-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 43 [patent_figures_cnt] => 43 [patent_no_of_words] => 11735 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20080036485.pdf [firstpage_image] =>[orig_patent_app_number] => 11829388 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/829388
Semiconductor wafer and method of testing the same Jul 26, 2007 Issued
Array ( [id] => 4936455 [patent_doc_number] => 20080073769 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-27 [patent_title] => 'Semiconductor package and semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/828351 [patent_app_country] => US [patent_app_date] => 2007-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3811 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0073/20080073769.pdf [firstpage_image] =>[orig_patent_app_number] => 11828351 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/828351
Semiconductor package and semiconductor device Jul 25, 2007 Abandoned
Array ( [id] => 4479723 [patent_doc_number] => 07906842 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-03-15 [patent_title] => 'Wafer level system in package and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 11/828741 [patent_app_country] => US [patent_app_date] => 2007-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 27 [patent_no_of_words] => 4439 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 236 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/906/07906842.pdf [firstpage_image] =>[orig_patent_app_number] => 11828741 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/828741
Wafer level system in package and fabrication method thereof Jul 25, 2007 Issued
Array ( [id] => 5293842 [patent_doc_number] => 20090008768 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-08 [patent_title] => 'SEMICONDUCTOR PACKAGE SYSTEM WITH PATTERNED MASK OVER THERMAL RELIEF' [patent_app_type] => utility [patent_app_number] => 11/773951 [patent_app_country] => US [patent_app_date] => 2007-07-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2021 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0008/20090008768.pdf [firstpage_image] =>[orig_patent_app_number] => 11773951 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/773951
Semiconductor package system with patterned mask over thermal relief Jul 4, 2007 Issued
Array ( [id] => 5293803 [patent_doc_number] => 20090008729 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-08 [patent_title] => 'IMAGE SENSOR PACKAGE UTILIZING A REMOVABLE PROTECTION FILM AND METHOD OF MAKING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/772861 [patent_app_country] => US [patent_app_date] => 2007-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3301 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0008/20090008729.pdf [firstpage_image] =>[orig_patent_app_number] => 11772861 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/772861
IMAGE SENSOR PACKAGE UTILIZING A REMOVABLE PROTECTION FILM AND METHOD OF MAKING THE SAME Jul 2, 2007 Abandoned
Array ( [id] => 5293838 [patent_doc_number] => 20090008764 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-08 [patent_title] => 'Ultra-Thin Wafer-Level Contact Grid Array' [patent_app_type] => utility [patent_app_number] => 11/772321 [patent_app_country] => US [patent_app_date] => 2007-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2409 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0008/20090008764.pdf [firstpage_image] =>[orig_patent_app_number] => 11772321 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/772321
Ultra-Thin Wafer-Level Contact Grid Array Jul 1, 2007 Abandoned
Array ( [id] => 5346180 [patent_doc_number] => 20090001541 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-01 [patent_title] => 'Method and apparatus for stackable modular integrated circuits' [patent_app_type] => utility [patent_app_number] => 11/824351 [patent_app_country] => US [patent_app_date] => 2007-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4143 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20090001541.pdf [firstpage_image] =>[orig_patent_app_number] => 11824351 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/824351
Method and apparatus for stackable modular integrated circuits Jun 28, 2007 Abandoned
Array ( [id] => 4849632 [patent_doc_number] => 20080315374 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-25 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM' [patent_app_type] => utility [patent_app_number] => 11/768041 [patent_app_country] => US [patent_app_date] => 2007-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3554 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0315/20080315374.pdf [firstpage_image] =>[orig_patent_app_number] => 11768041 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/768041
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM Jun 24, 2007 Abandoned
Array ( [id] => 4820792 [patent_doc_number] => 20080122063 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-29 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/819162 [patent_app_country] => US [patent_app_date] => 2007-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4946 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0122/20080122063.pdf [firstpage_image] =>[orig_patent_app_number] => 11819162 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/819162
Semiconductor device Jun 24, 2007 Abandoned
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