
Fang-xing Jiang
Examiner (ID: 7225, Phone: (571)270-7548 , Office: P/2815 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815 |
| Total Applications | 386 |
| Issued Applications | 221 |
| Pending Applications | 0 |
| Abandoned Applications | 168 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4768829
[patent_doc_number] => 20080054485
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-06
[patent_title] => 'SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/846311
[patent_app_country] => US
[patent_app_date] => 2007-08-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3317
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0054/20080054485.pdf
[firstpage_image] =>[orig_patent_app_number] => 11846311
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/846311 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | Aug 27, 2007 | Abandoned |
Array
(
[id] => 5334586
[patent_doc_number] => 20090051050
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-26
[patent_title] => ' CORNER I/O PAD DENSITY'
[patent_app_type] => utility
[patent_app_number] => 11/844881
[patent_app_country] => US
[patent_app_date] => 2007-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2257
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0051/20090051050.pdf
[firstpage_image] =>[orig_patent_app_number] => 11844881
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/844881 | CORNER I/O PAD DENSITY | Aug 23, 2007 | Abandoned |
Array
(
[id] => 5334555
[patent_doc_number] => 20090051019
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-26
[patent_title] => 'Multi-chip module package'
[patent_app_type] => utility
[patent_app_number] => 11/894341
[patent_app_country] => US
[patent_app_date] => 2007-08-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3527
[patent_no_of_claims] => 24
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[pdf_file] => publications/A1/0051/20090051019.pdf
[firstpage_image] =>[orig_patent_app_number] => 11894341
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/894341 | Multi-chip module package | Aug 19, 2007 | Abandoned |
Array
(
[id] => 5008170
[patent_doc_number] => 20070278647
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-06
[patent_title] => 'PACKAGE MOUNTED MODULE AND PACKAGE BOARD MODULE'
[patent_app_type] => utility
[patent_app_number] => 11/838431
[patent_app_country] => US
[patent_app_date] => 2007-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2769
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0278/20070278647.pdf
[firstpage_image] =>[orig_patent_app_number] => 11838431
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/838431 | Package mounted module and package board module | Aug 13, 2007 | Issued |
Array
(
[id] => 5413614
[patent_doc_number] => 20090039501
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-12
[patent_title] => 'INTEGRATED CIRCUIT WITH GALVANICALLY BONDED HEAT SINK'
[patent_app_type] => utility
[patent_app_number] => 11/835781
[patent_app_country] => US
[patent_app_date] => 2007-08-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2950
[patent_no_of_claims] => 21
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0039/20090039501.pdf
[firstpage_image] =>[orig_patent_app_number] => 11835781
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/835781 | Integrated circuit with galvanically bonded heat sink | Aug 7, 2007 | Issued |
Array
(
[id] => 4768802
[patent_doc_number] => 20080054458
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-06
[patent_title] => 'Electronic device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/890671
[patent_app_country] => US
[patent_app_date] => 2007-08-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 6050
[patent_no_of_claims] => 14
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0054/20080054458.pdf
[firstpage_image] =>[orig_patent_app_number] => 11890671
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/890671 | Electronic device and method of manufacturing the same | Aug 6, 2007 | Abandoned |
Array
(
[id] => 5358077
[patent_doc_number] => 20090032871
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-02-05
[patent_title] => 'INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT'
[patent_app_type] => utility
[patent_app_number] => 11/832451
[patent_app_country] => US
[patent_app_date] => 2007-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3584
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0032/20090032871.pdf
[firstpage_image] =>[orig_patent_app_number] => 11832451
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/832451 | INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT | Jul 31, 2007 | Abandoned |
Array
(
[id] => 8283404
[patent_doc_number] => 08217511
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-07-10
[patent_title] => 'Redistributed chip packaging with thermal contact to device backside'
[patent_app_type] => utility
[patent_app_number] => 11/831651
[patent_app_country] => US
[patent_app_date] => 2007-07-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 13
[patent_no_of_words] => 3758
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 215
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11831651
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/831651 | Redistributed chip packaging with thermal contact to device backside | Jul 30, 2007 | Issued |
Array
(
[id] => 8104955
[patent_doc_number] => 08154127
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2012-04-10
[patent_title] => 'Optical device and method of making the same'
[patent_app_type] => utility
[patent_app_number] => 11/829995
[patent_app_country] => US
[patent_app_date] => 2007-07-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 3897
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/154/08154127.pdf
[firstpage_image] =>[orig_patent_app_number] => 11829995
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/829995 | Optical device and method of making the same | Jul 29, 2007 | Issued |
Array
(
[id] => 5518618
[patent_doc_number] => 20090026599
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-29
[patent_title] => 'Memory module capable of lessening shock stress'
[patent_app_type] => utility
[patent_app_number] => 11/878891
[patent_app_country] => US
[patent_app_date] => 2007-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2358
[patent_no_of_claims] => 11
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0026/20090026599.pdf
[firstpage_image] =>[orig_patent_app_number] => 11878891
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/878891 | Memory module capable of lessening shock stress | Jul 26, 2007 | Abandoned |
Array
(
[id] => 4654954
[patent_doc_number] => 20080023814
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-31
[patent_title] => 'STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 11/829851
[patent_app_country] => US
[patent_app_date] => 2007-07-27
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 5090
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0023/20080023814.pdf
[firstpage_image] =>[orig_patent_app_number] => 11829851
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/829851 | STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE | Jul 26, 2007 | Abandoned |
Array
(
[id] => 4649230
[patent_doc_number] => 20080036485
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-14
[patent_title] => 'SEMICONDUCTOR WAFER AND METHOD OF TESTING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/829388
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[patent_app_date] => 2007-07-27
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[firstpage_image] =>[orig_patent_app_number] => 11829388
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/829388 | Semiconductor wafer and method of testing the same | Jul 26, 2007 | Issued |
Array
(
[id] => 4936455
[patent_doc_number] => 20080073769
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-27
[patent_title] => 'Semiconductor package and semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 11828351
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/828351 | Semiconductor package and semiconductor device | Jul 25, 2007 | Abandoned |
Array
(
[id] => 4479723
[patent_doc_number] => 07906842
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-03-15
[patent_title] => 'Wafer level system in package and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/828741
[patent_app_country] => US
[patent_app_date] => 2007-07-26
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/906/07906842.pdf
[firstpage_image] =>[orig_patent_app_number] => 11828741
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/828741 | Wafer level system in package and fabrication method thereof | Jul 25, 2007 | Issued |
Array
(
[id] => 5293842
[patent_doc_number] => 20090008768
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-08
[patent_title] => 'SEMICONDUCTOR PACKAGE SYSTEM WITH PATTERNED MASK OVER THERMAL RELIEF'
[patent_app_type] => utility
[patent_app_number] => 11/773951
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11773951
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/773951 | Semiconductor package system with patterned mask over thermal relief | Jul 4, 2007 | Issued |
Array
(
[id] => 5293803
[patent_doc_number] => 20090008729
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-08
[patent_title] => 'IMAGE SENSOR PACKAGE UTILIZING A REMOVABLE PROTECTION FILM AND METHOD OF MAKING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/772861
[patent_app_country] => US
[patent_app_date] => 2007-07-03
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[pdf_file] => publications/A1/0008/20090008729.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/772861 | IMAGE SENSOR PACKAGE UTILIZING A REMOVABLE PROTECTION FILM AND METHOD OF MAKING THE SAME | Jul 2, 2007 | Abandoned |
Array
(
[id] => 5293838
[patent_doc_number] => 20090008764
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-08
[patent_title] => 'Ultra-Thin Wafer-Level Contact Grid Array'
[patent_app_type] => utility
[patent_app_number] => 11/772321
[patent_app_country] => US
[patent_app_date] => 2007-07-02
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11772321
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/772321 | Ultra-Thin Wafer-Level Contact Grid Array | Jul 1, 2007 | Abandoned |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/824351 | Method and apparatus for stackable modular integrated circuits | Jun 28, 2007 | Abandoned |
Array
(
[id] => 4849632
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[patent_title] => 'INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/768041 | INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM | Jun 24, 2007 | Abandoned |
Array
(
[id] => 4820792
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[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
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[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11819162
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/819162 | Semiconductor device | Jun 24, 2007 | Abandoned |