
Fang-xing Jiang
Examiner (ID: 7225, Phone: (571)270-7548 , Office: P/2815 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815 |
| Total Applications | 386 |
| Issued Applications | 221 |
| Pending Applications | 0 |
| Abandoned Applications | 168 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5076916
[patent_doc_number] => 20070120140
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-31
[patent_title] => 'Semiconductor apparatus with thin semiconductor film'
[patent_app_type] => utility
[patent_app_number] => 11/651579
[patent_app_country] => US
[patent_app_date] => 2007-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 45
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0120/20070120140.pdf
[firstpage_image] =>[orig_patent_app_number] => 11651579
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/651579 | Semiconductor apparatus with thin semiconductor film | Jan 9, 2007 | Abandoned |
Array
(
[id] => 5217534
[patent_doc_number] => 20070158845
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'METAL WIRING OF SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/619111
[patent_app_country] => US
[patent_app_date] => 2007-01-02
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0158/20070158845.pdf
[firstpage_image] =>[orig_patent_app_number] => 11619111
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/619111 | Metal wiring of semiconductor device and method of fabricating the same | Jan 1, 2007 | Issued |
Array
(
[id] => 4499044
[patent_doc_number] => 07947999
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-05-24
[patent_title] => 'Luminescent device and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/616161
[patent_app_country] => US
[patent_app_date] => 2006-12-26
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/947/07947999.pdf
[firstpage_image] =>[orig_patent_app_number] => 11616161
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/616161 | Luminescent device and method for manufacturing the same | Dec 25, 2006 | Issued |
Array
(
[id] => 4876718
[patent_doc_number] => 20080150101
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-26
[patent_title] => 'Microelectronic packages having improved input/output connections and methods therefor'
[patent_app_type] => utility
[patent_app_number] => 11/643041
[patent_app_country] => US
[patent_app_date] => 2006-12-20
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0150/20080150101.pdf
[firstpage_image] =>[orig_patent_app_number] => 11643041
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/643041 | Microelectronic packages having improved input/output connections and methods therefor | Dec 19, 2006 | Abandoned |
Array
(
[id] => 5116891
[patent_doc_number] => 20070138605
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-21
[patent_title] => 'ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 11/613881
[patent_app_country] => US
[patent_app_date] => 2006-12-20
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0138/20070138605.pdf
[firstpage_image] =>[orig_patent_app_number] => 11613881
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/613881 | ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE | Dec 19, 2006 | Abandoned |
Array
(
[id] => 4907197
[patent_doc_number] => 20080017963
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-24
[patent_title] => 'SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/612491
[patent_app_country] => US
[patent_app_date] => 2006-12-19
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0017/20080017963.pdf
[firstpage_image] =>[orig_patent_app_number] => 11612491
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/612491 | SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME | Dec 18, 2006 | Abandoned |
Array
(
[id] => 8834392
[patent_doc_number] => 08450148
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-05-28
[patent_title] => 'Molding compound adhesion for map-molded flip-chip'
[patent_app_type] => utility
[patent_app_number] => 11/638671
[patent_app_country] => US
[patent_app_date] => 2006-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11638671
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/638671 | Molding compound adhesion for map-molded flip-chip | Dec 13, 2006 | Issued |
Array
(
[id] => 8834392
[patent_doc_number] => 08450148
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-05-28
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[patent_app_type] => utility
[patent_app_number] => 11/638671
[patent_app_country] => US
[patent_app_date] => 2006-12-14
[patent_effective_date] => 0000-00-00
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Array
(
[id] => 5038253
[patent_doc_number] => 20070090535
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-26
[patent_title] => 'Semiconductor Component of Semiconductor Chip Size with Flip-Chip-Like External Contacts'
[patent_app_type] => utility
[patent_app_number] => 11/608981
[patent_app_country] => US
[patent_app_date] => 2006-12-11
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[pdf_file] => publications/A1/0090/20070090535.pdf
[firstpage_image] =>[orig_patent_app_number] => 11608981
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/608981 | Semiconductor component of semiconductor chip size with flip-chip-like external contacts | Dec 10, 2006 | Issued |
Array
(
[id] => 5038253
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Array
(
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Array
(
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Array
(
[id] => 5157512
[patent_doc_number] => 20070170556
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[patent_issue_date] => 2007-07-26
[patent_title] => 'Semiconductor device having flange structure'
[patent_app_type] => utility
[patent_app_number] => 11/635011
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[firstpage_image] =>[orig_patent_app_number] => 11635011
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/635011 | Semiconductor device having flange structure | Dec 6, 2006 | Abandoned |
Array
(
[id] => 5233971
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[patent_issue_date] => 2007-06-07
[patent_title] => 'Solder bonding structure using bridge type pattern'
[patent_app_type] => utility
[patent_app_number] => 11/634221
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Array
(
[id] => 4624676
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[patent_title] => 'Semiconductor integrated circuit device and method for fabricating the same'
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[firstpage_image] =>[orig_patent_app_number] => 11600101
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Array
(
[id] => 6101913
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[patent_issue_date] => 2011-07-07
[patent_title] => 'CONTINUOUSLY VARIABLE GRADED ARTIFICIAL DIELECTRICS USING NANOSTRUCTURES'
[patent_app_type] => utility
[patent_app_number] => 11/589988
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[firstpage_image] =>[orig_patent_app_number] => 11589988
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/589988 | Continuously variable graded artificial dielectrics using nanostructures | Oct 30, 2006 | Issued |
Array
(
[id] => 5145776
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Array
(
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Array
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Array
(
[id] => 4941826
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/529751 | Circuit board arrangement and method for producing a circuit board arrangement | Sep 27, 2006 | Abandoned |