
Farun Lu
Examiner (ID: 659, Phone: (571)270-0164 , Office: P/2898 )
| Most Active Art Unit | 2898 |
| Art Unit(s) | 2898 |
| Total Applications | 618 |
| Issued Applications | 575 |
| Pending Applications | 0 |
| Abandoned Applications | 47 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 11539515
[patent_doc_number] => 09613931
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[patent_issue_date] => 2017-04-04
[patent_title] => 'Fan-out stacked system in package (SIP) having dummy dies and methods of making the same'
[patent_app_type] => utility
[patent_app_number] => 14/701255
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Array
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[patent_issue_date] => 2017-01-05
[patent_title] => 'SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE DICED FROM SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE'
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Array
(
[id] => 11125352
[patent_doc_number] => 20160322326
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[patent_title] => 'WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIBUTION LAYER'
[patent_app_type] => utility
[patent_app_number] => 14/701049
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Array
(
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Array
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[patent_title] => 'METHOD OF PRODUCING A HOUSING FOR AN ELECTRONIC DEVICE AND AN ELECTRONIC DEVICE, HOUSING FOR AN ELECTRONIC DEVICE, AND ELECTRONIC DEVICE'
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Array
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[patent_issue_date] => 2018-04-24
[patent_title] => Die-bonding layer formation film, processed product having die-bonding layer formation film attached thereto, and semiconductor device
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Array
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[patent_title] => Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same
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Array
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[patent_title] => 'METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE'
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Array
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Array
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[id] => 11014387
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[patent_issue_date] => 2016-07-21
[patent_title] => 'IMPLANTATION FORMED METAL-INSULATOR-SEMICONDUCTOR (MIS) CONTACTS'
[patent_app_type] => utility
[patent_app_number] => 14/600077
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Array
(
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[patent_title] => 'APPARATUS FOR AND METHOD OF CRYSTALLIZING ACTIVE LAYER OF THIN FILM TRANSISTOR'
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Array
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Array
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Array
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Array
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Array
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