
Feben Haile
Examiner (ID: 9505, Phone: (571)272-3072 , Office: P/2474 )
| Most Active Art Unit | 2474 |
| Art Unit(s) | 2416, 2616, 2663, OPA, 2474 |
| Total Applications | 534 |
| Issued Applications | 353 |
| Pending Applications | 33 |
| Abandoned Applications | 151 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4756688
[patent_doc_number] => 20080308913
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-12-18
[patent_title] => 'STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/140190
[patent_app_country] => US
[patent_app_date] => 2008-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0308/20080308913.pdf
[firstpage_image] =>[orig_patent_app_number] => 12140190
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/140190 | STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Jun 15, 2008 | Abandoned |
Array
(
[id] => 8115539
[patent_doc_number] => 08158988
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-04-17
[patent_title] => 'Interlevel conductive light shield'
[patent_app_type] => utility
[patent_app_number] => 12/133380
[patent_app_country] => US
[patent_app_date] => 2008-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 16251
[patent_no_of_claims] => 13
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[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/158/08158988.pdf
[firstpage_image] =>[orig_patent_app_number] => 12133380
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/133380 | Interlevel conductive light shield | Jun 4, 2008 | Issued |
Array
(
[id] => 4433593
[patent_doc_number] => 07969014
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-06-28
[patent_title] => 'Power layout of integrated circuits and designing method thereof'
[patent_app_type] => utility
[patent_app_number] => 12/129390
[patent_app_country] => US
[patent_app_date] => 2008-05-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 2644
[patent_no_of_claims] => 8
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[patent_words_short_claim] => 221
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/969/07969014.pdf
[firstpage_image] =>[orig_patent_app_number] => 12129390
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/129390 | Power layout of integrated circuits and designing method thereof | May 28, 2008 | Issued |
Array
(
[id] => 4776019
[patent_doc_number] => 20080284017
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-20
[patent_title] => 'METHODS OF FABRICATING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE, AND CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE FABRICATED USING THE METHODS'
[patent_app_type] => utility
[patent_app_number] => 12/112998
[patent_app_country] => US
[patent_app_date] => 2008-04-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 4526
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0284/20080284017.pdf
[firstpage_image] =>[orig_patent_app_number] => 12112998
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/112998 | METHODS OF FABRICATING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE, AND CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE FABRICATED USING THE METHODS | Apr 29, 2008 | Abandoned |
Array
(
[id] => 4789510
[patent_doc_number] => 20080290483
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-27
[patent_title] => 'SEMICONDUCTOR DEVICE, LEADFRAME AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/112428
[patent_app_country] => US
[patent_app_date] => 2008-04-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0290/20080290483.pdf
[firstpage_image] =>[orig_patent_app_number] => 12112428
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/112428 | SEMICONDUCTOR DEVICE, LEADFRAME AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE | Apr 29, 2008 | Abandoned |
Array
(
[id] => 4836891
[patent_doc_number] => 20080277774
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-13
[patent_title] => 'POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 12/110739
[patent_app_country] => US
[patent_app_date] => 2008-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
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[patent_no_of_words] => 9402
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0277/20080277774.pdf
[firstpage_image] =>[orig_patent_app_number] => 12110739
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/110739 | POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE | Apr 27, 2008 | Abandoned |
Array
(
[id] => 5555661
[patent_doc_number] => 20090267238
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-10-29
[patent_title] => 'BRIDGES FOR INTERCONNECTING INTERPOSERS IN MULTI-CHIP INTEGRATED CIRCUITS'
[patent_app_type] => utility
[patent_app_number] => 12/110579
[patent_app_country] => US
[patent_app_date] => 2008-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4482
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0267/20090267238.pdf
[firstpage_image] =>[orig_patent_app_number] => 12110579
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/110579 | Bridges for interconnecting interposers in multi-chip integrated circuits | Apr 27, 2008 | Issued |
Array
(
[id] => 4479728
[patent_doc_number] => 07906845
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2011-03-15
[patent_title] => 'Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor'
[patent_app_type] => utility
[patent_app_number] => 12/108419
[patent_app_country] => US
[patent_app_date] => 2008-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 3517
[patent_no_of_claims] => 20
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[pdf_file] => patents/07/906/07906845.pdf
[firstpage_image] =>[orig_patent_app_number] => 12108419
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/108419 | Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor | Apr 22, 2008 | Issued |
Array
(
[id] => 4883972
[patent_doc_number] => 20080258304
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-23
[patent_title] => 'Semiconductor device having multiple wiring layers'
[patent_app_type] => utility
[patent_app_number] => 12/081809
[patent_app_country] => US
[patent_app_date] => 2008-04-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 5819
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0258/20080258304.pdf
[firstpage_image] =>[orig_patent_app_number] => 12081809
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/081809 | Semiconductor device having multiple wiring layers | Apr 21, 2008 | Abandoned |
Array
(
[id] => 7519315
[patent_doc_number] => 07973418
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-05
[patent_title] => 'Solder bump interconnect for improved mechanical and thermo-mechanical performance'
[patent_app_type] => utility
[patent_app_number] => 12/107009
[patent_app_country] => US
[patent_app_date] => 2008-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 3944
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[pdf_file] => patents/07/973/07973418.pdf
[firstpage_image] =>[orig_patent_app_number] => 12107009
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/107009 | Solder bump interconnect for improved mechanical and thermo-mechanical performance | Apr 20, 2008 | Issued |
Array
(
[id] => 8910046
[patent_doc_number] => 08482113
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-07-09
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/081739
[patent_app_country] => US
[patent_app_date] => 2008-04-21
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12081739
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/081739 | Semiconductor device | Apr 20, 2008 | Issued |
Array
(
[id] => 5307592
[patent_doc_number] => 20090014873
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[patent_title] => 'ELECTRONIC DEVICE AND MANUFACTURING METHOD'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/106459 | Electronic device and manufacturing method | Apr 20, 2008 | Issued |
Array
(
[id] => 7519314
[patent_doc_number] => 07973417
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[patent_kind] => B2
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[patent_title] => 'Integrated circuit and method of fabricating the same'
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[firstpage_image] =>[orig_patent_app_number] => 12105489
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/105489 | Integrated circuit and method of fabricating the same | Apr 17, 2008 | Issued |
Array
(
[id] => 5469889
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[patent_title] => 'Leadframe, semiconductor packaging structure and manufacturing method thereof'
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Array
(
[id] => 4958049
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/105388 | OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME | Apr 17, 2008 | Abandoned |
Array
(
[id] => 4433662
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[patent_title] => 'Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device'
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Array
(
[id] => 7535658
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Array
(
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Array
(
[id] => 4724023
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[patent_title] => 'Semiconductor device having stress alleviating portion positioned at outer circumference of chip, wiring substrate, and method for producing the same'
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[patent_app_number] => 12/068438
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/068438 | Semiconductor device having stress alleviating portion positioned at outer circumference of chip, wiring substrate, and method for producing the same | Feb 5, 2008 | Abandoned |
Array
(
[id] => 5524785
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[patent_title] => 'Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level'
[patent_app_type] => utility
[patent_app_number] => 12/012589
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/012589 | Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level | Feb 3, 2008 | Abandoned |