Search

Feben Haile

Examiner (ID: 9505, Phone: (571)272-3072 , Office: P/2474 )

Most Active Art Unit
2474
Art Unit(s)
2416, 2616, 2663, OPA, 2474
Total Applications
534
Issued Applications
353
Pending Applications
33
Abandoned Applications
151

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4691207 [patent_doc_number] => 20080083977 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-10 [patent_title] => 'Edge connect wafer level stacking' [patent_app_type] => utility [patent_app_number] => 11/787209 [patent_app_country] => US [patent_app_date] => 2007-04-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 10945 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0083/20080083977.pdf [firstpage_image] =>[orig_patent_app_number] => 11787209 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/787209
Edge connect wafer level stacking Apr 12, 2007 Issued
Array ( [id] => 34511 [patent_doc_number] => 07786476 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-31 [patent_title] => 'Semiconductor device system and method for modifying a semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/734068 [patent_app_country] => US [patent_app_date] => 2007-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 5423 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/786/07786476.pdf [firstpage_image] =>[orig_patent_app_number] => 11734068 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/734068
Semiconductor device system and method for modifying a semiconductor device Apr 10, 2007 Issued
Array ( [id] => 4822136 [patent_doc_number] => 20080227276 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-18 [patent_title] => 'Silicon Substrate With Reduced Surface Roughness' [patent_app_type] => utility [patent_app_number] => 11/686108 [patent_app_country] => US [patent_app_date] => 2007-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 2901 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0227/20080227276.pdf [firstpage_image] =>[orig_patent_app_number] => 11686108 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/686108
Silicon substrate with reduced surface roughness Mar 13, 2007 Issued
Array ( [id] => 5066605 [patent_doc_number] => 20070187706 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-16 [patent_title] => 'LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/673818 [patent_app_country] => US [patent_app_date] => 2007-02-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 34 [patent_figures_cnt] => 34 [patent_no_of_words] => 11210 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0187/20070187706.pdf [firstpage_image] =>[orig_patent_app_number] => 11673818 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/673818
Light-emitting device and method for manufacturing the same Feb 11, 2007 Issued
Array ( [id] => 4845990 [patent_doc_number] => 20080182398 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-31 [patent_title] => 'Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate' [patent_app_type] => utility [patent_app_number] => 11/668689 [patent_app_country] => US [patent_app_date] => 2007-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5859 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0182/20080182398.pdf [firstpage_image] =>[orig_patent_app_number] => 11668689 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/668689
Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate Jan 29, 2007 Abandoned
Array ( [id] => 5177563 [patent_doc_number] => 20070178623 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-02 [patent_title] => 'Method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/699568 [patent_app_country] => US [patent_app_date] => 2007-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2708 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0178/20070178623.pdf [firstpage_image] =>[orig_patent_app_number] => 11699568 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/699568
Method of manufacturing semiconductor device Jan 29, 2007 Abandoned
Array ( [id] => 168216 [patent_doc_number] => 07666753 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-02-23 [patent_title] => 'Metal capping process for BEOL interconnect with air gaps' [patent_app_type] => utility [patent_app_number] => 11/622188 [patent_app_country] => US [patent_app_date] => 2007-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3958 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 343 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/666/07666753.pdf [firstpage_image] =>[orig_patent_app_number] => 11622188 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/622188
Metal capping process for BEOL interconnect with air gaps Jan 10, 2007 Issued
Array ( [id] => 4752596 [patent_doc_number] => 20080160671 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'Ball-mounting method for coplanarity improvement in large package' [patent_app_type] => utility [patent_app_number] => 11/648926 [patent_app_country] => US [patent_app_date] => 2007-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3038 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0160/20080160671.pdf [firstpage_image] =>[orig_patent_app_number] => 11648926 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/648926
Ball-mounting method for coplanarity improvement in large package Jan 2, 2007 Issued
Array ( [id] => 4968560 [patent_doc_number] => 20070108562 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-17 [patent_title] => 'Semiconductor chip having bond pads' [patent_app_type] => utility [patent_app_number] => 11/616852 [patent_app_country] => US [patent_app_date] => 2006-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5699 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20070108562.pdf [firstpage_image] =>[orig_patent_app_number] => 11616852 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/616852
Semiconductor chip having bond pads Dec 26, 2006 Issued
Array ( [id] => 4985960 [patent_doc_number] => 20070152298 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-05 [patent_title] => 'INDUCTOR STRUCTURE OF A SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 11/615678 [patent_app_country] => US [patent_app_date] => 2006-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1795 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0152/20070152298.pdf [firstpage_image] =>[orig_patent_app_number] => 11615678 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/615678
INDUCTOR STRUCTURE OF A SEMICONDUCTOR DEVICE Dec 21, 2006 Abandoned
Array ( [id] => 4876728 [patent_doc_number] => 20080150111 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-26 [patent_title] => 'Memory device' [patent_app_type] => utility [patent_app_number] => 11/644044 [patent_app_country] => US [patent_app_date] => 2006-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 7745 [patent_no_of_claims] => 42 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20080150111.pdf [firstpage_image] =>[orig_patent_app_number] => 11644044 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/644044
Memory device Dec 21, 2006 Issued
Array ( [id] => 5022974 [patent_doc_number] => 20070148940 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-06-28 [patent_title] => 'Method for manufacturing a semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/642758 [patent_app_country] => US [patent_app_date] => 2006-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1644 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0148/20070148940.pdf [firstpage_image] =>[orig_patent_app_number] => 11642758 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/642758
Method for manufacturing a semiconductor device Dec 20, 2006 Abandoned
Array ( [id] => 4866965 [patent_doc_number] => 20080146024 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-19 [patent_title] => 'METHOD FOR FORMING A METAL STRUCTURE' [patent_app_type] => utility [patent_app_number] => 11/611888 [patent_app_country] => US [patent_app_date] => 2006-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 4416 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0146/20080146024.pdf [firstpage_image] =>[orig_patent_app_number] => 11611888 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/611888
Method for forming a metal structure Dec 16, 2006 Issued
Array ( [id] => 4829452 [patent_doc_number] => 20080128890 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-05 [patent_title] => 'CHIP PACKAGE AND FABRICATING PROCESS THEREOF' [patent_app_type] => utility [patent_app_number] => 11/565299 [patent_app_country] => US [patent_app_date] => 2006-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5441 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0128/20080128890.pdf [firstpage_image] =>[orig_patent_app_number] => 11565299 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/565299
CHIP PACKAGE AND FABRICATING PROCESS THEREOF Nov 29, 2006 Abandoned
Array ( [id] => 5069612 [patent_doc_number] => 20070190714 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-16 [patent_title] => 'Trench transistor and method for fabricating a trench transistor with high-energy-implanted drain' [patent_app_type] => utility [patent_app_number] => 11/606628 [patent_app_country] => US [patent_app_date] => 2006-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4092 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0190/20070190714.pdf [firstpage_image] =>[orig_patent_app_number] => 11606628 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/606628
Trench transistor and method for fabricating a trench transistor with high-energy-implanted drain Nov 29, 2006 Issued
Array ( [id] => 4826995 [patent_doc_number] => 20080127488 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-05 [patent_title] => 'Method for producing a reinforced durable electronic device, such as a plastic card, and the device obtained therefrom' [patent_app_type] => utility [patent_app_number] => 11/606233 [patent_app_country] => US [patent_app_date] => 2006-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3238 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20080127488.pdf [firstpage_image] =>[orig_patent_app_number] => 11606233 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/606233
Method for producing a reinforced durable electronic device, such as a plastic card, and the device obtained therefrom Nov 29, 2006 Issued
Array ( [id] => 5346192 [patent_doc_number] => 20090001553 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-01 [patent_title] => 'Mems Package and Method for the Production Thereof' [patent_app_type] => utility [patent_app_number] => 12/092439 [patent_app_country] => US [patent_app_date] => 2006-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 7442 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20090001553.pdf [firstpage_image] =>[orig_patent_app_number] => 12092439 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/092439
MEMS package and method for the production thereof Nov 5, 2006 Issued
Array ( [id] => 4901839 [patent_doc_number] => 20080111251 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-05-15 [patent_title] => 'METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT COMPRISING AN INTEGRATED CIRCUIT AND A WINDING ASSEMBLY' [patent_app_type] => utility [patent_app_number] => 11/556339 [patent_app_country] => US [patent_app_date] => 2006-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1561 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0111/20080111251.pdf [firstpage_image] =>[orig_patent_app_number] => 11556339 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/556339
METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT COMPRISING AN INTEGRATED CIRCUIT AND A WINDING ASSEMBLY Nov 2, 2006 Abandoned
Array ( [id] => 8117205 [patent_doc_number] => 08159826 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-04-17 [patent_title] => 'Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments' [patent_app_type] => utility [patent_app_number] => 12/092179 [patent_app_country] => US [patent_app_date] => 2006-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 3468 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/159/08159826.pdf [firstpage_image] =>[orig_patent_app_number] => 12092179 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/092179
Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments Nov 2, 2006 Issued
Array ( [id] => 5157534 [patent_doc_number] => 20070170578 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-26 [patent_title] => 'Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein' [patent_app_type] => utility [patent_app_number] => 11/584518 [patent_app_country] => US [patent_app_date] => 2006-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 7133 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0170/20070170578.pdf [firstpage_image] =>[orig_patent_app_number] => 11584518 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/584518
Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein Oct 22, 2006 Issued
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