
Feben Haile
Examiner (ID: 9505, Phone: (571)272-3072 , Office: P/2474 )
| Most Active Art Unit | 2474 |
| Art Unit(s) | 2416, 2616, 2663, OPA, 2474 |
| Total Applications | 534 |
| Issued Applications | 353 |
| Pending Applications | 33 |
| Abandoned Applications | 151 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4691207
[patent_doc_number] => 20080083977
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-10
[patent_title] => 'Edge connect wafer level stacking'
[patent_app_type] => utility
[patent_app_number] => 11/787209
[patent_app_country] => US
[patent_app_date] => 2007-04-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
[patent_figures_cnt] => 28
[patent_no_of_words] => 10945
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0083/20080083977.pdf
[firstpage_image] =>[orig_patent_app_number] => 11787209
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/787209 | Edge connect wafer level stacking | Apr 12, 2007 | Issued |
Array
(
[id] => 34511
[patent_doc_number] => 07786476
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-08-31
[patent_title] => 'Semiconductor device system and method for modifying a semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/734068
[patent_app_country] => US
[patent_app_date] => 2007-04-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 5423
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 65
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/786/07786476.pdf
[firstpage_image] =>[orig_patent_app_number] => 11734068
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/734068 | Semiconductor device system and method for modifying a semiconductor device | Apr 10, 2007 | Issued |
Array
(
[id] => 4822136
[patent_doc_number] => 20080227276
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-09-18
[patent_title] => 'Silicon Substrate With Reduced Surface Roughness'
[patent_app_type] => utility
[patent_app_number] => 11/686108
[patent_app_country] => US
[patent_app_date] => 2007-03-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 2901
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0227/20080227276.pdf
[firstpage_image] =>[orig_patent_app_number] => 11686108
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/686108 | Silicon substrate with reduced surface roughness | Mar 13, 2007 | Issued |
Array
(
[id] => 5066605
[patent_doc_number] => 20070187706
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-16
[patent_title] => 'LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/673818
[patent_app_country] => US
[patent_app_date] => 2007-02-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 34
[patent_figures_cnt] => 34
[patent_no_of_words] => 11210
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0187/20070187706.pdf
[firstpage_image] =>[orig_patent_app_number] => 11673818
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/673818 | Light-emitting device and method for manufacturing the same | Feb 11, 2007 | Issued |
Array
(
[id] => 4845990
[patent_doc_number] => 20080182398
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-31
[patent_title] => 'Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate'
[patent_app_type] => utility
[patent_app_number] => 11/668689
[patent_app_country] => US
[patent_app_date] => 2007-01-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 5859
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0182/20080182398.pdf
[firstpage_image] =>[orig_patent_app_number] => 11668689
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/668689 | Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate | Jan 29, 2007 | Abandoned |
Array
(
[id] => 5177563
[patent_doc_number] => 20070178623
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-02
[patent_title] => 'Method of manufacturing semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/699568
[patent_app_country] => US
[patent_app_date] => 2007-01-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 2708
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0178/20070178623.pdf
[firstpage_image] =>[orig_patent_app_number] => 11699568
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/699568 | Method of manufacturing semiconductor device | Jan 29, 2007 | Abandoned |
Array
(
[id] => 168216
[patent_doc_number] => 07666753
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-02-23
[patent_title] => 'Metal capping process for BEOL interconnect with air gaps'
[patent_app_type] => utility
[patent_app_number] => 11/622188
[patent_app_country] => US
[patent_app_date] => 2007-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3958
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 343
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/666/07666753.pdf
[firstpage_image] =>[orig_patent_app_number] => 11622188
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/622188 | Metal capping process for BEOL interconnect with air gaps | Jan 10, 2007 | Issued |
Array
(
[id] => 4752596
[patent_doc_number] => 20080160671
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-03
[patent_title] => 'Ball-mounting method for coplanarity improvement in large package'
[patent_app_type] => utility
[patent_app_number] => 11/648926
[patent_app_country] => US
[patent_app_date] => 2007-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3038
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0160/20080160671.pdf
[firstpage_image] =>[orig_patent_app_number] => 11648926
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/648926 | Ball-mounting method for coplanarity improvement in large package | Jan 2, 2007 | Issued |
Array
(
[id] => 4968560
[patent_doc_number] => 20070108562
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-17
[patent_title] => 'Semiconductor chip having bond pads'
[patent_app_type] => utility
[patent_app_number] => 11/616852
[patent_app_country] => US
[patent_app_date] => 2006-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 5699
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0108/20070108562.pdf
[firstpage_image] =>[orig_patent_app_number] => 11616852
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/616852 | Semiconductor chip having bond pads | Dec 26, 2006 | Issued |
Array
(
[id] => 4985960
[patent_doc_number] => 20070152298
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-05
[patent_title] => 'INDUCTOR STRUCTURE OF A SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/615678
[patent_app_country] => US
[patent_app_date] => 2006-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 1795
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0152/20070152298.pdf
[firstpage_image] =>[orig_patent_app_number] => 11615678
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/615678 | INDUCTOR STRUCTURE OF A SEMICONDUCTOR DEVICE | Dec 21, 2006 | Abandoned |
Array
(
[id] => 4876728
[patent_doc_number] => 20080150111
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-26
[patent_title] => 'Memory device'
[patent_app_type] => utility
[patent_app_number] => 11/644044
[patent_app_country] => US
[patent_app_date] => 2006-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 7745
[patent_no_of_claims] => 42
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0150/20080150111.pdf
[firstpage_image] =>[orig_patent_app_number] => 11644044
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/644044 | Memory device | Dec 21, 2006 | Issued |
Array
(
[id] => 5022974
[patent_doc_number] => 20070148940
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-28
[patent_title] => 'Method for manufacturing a semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/642758
[patent_app_country] => US
[patent_app_date] => 2006-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1644
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0148/20070148940.pdf
[firstpage_image] =>[orig_patent_app_number] => 11642758
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/642758 | Method for manufacturing a semiconductor device | Dec 20, 2006 | Abandoned |
Array
(
[id] => 4866965
[patent_doc_number] => 20080146024
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-19
[patent_title] => 'METHOD FOR FORMING A METAL STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 11/611888
[patent_app_country] => US
[patent_app_date] => 2006-12-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 4416
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0146/20080146024.pdf
[firstpage_image] =>[orig_patent_app_number] => 11611888
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/611888 | Method for forming a metal structure | Dec 16, 2006 | Issued |
Array
(
[id] => 4829452
[patent_doc_number] => 20080128890
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-05
[patent_title] => 'CHIP PACKAGE AND FABRICATING PROCESS THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/565299
[patent_app_country] => US
[patent_app_date] => 2006-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 5441
[patent_no_of_claims] => 33
[patent_no_of_ind_claims] => 4
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0128/20080128890.pdf
[firstpage_image] =>[orig_patent_app_number] => 11565299
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/565299 | CHIP PACKAGE AND FABRICATING PROCESS THEREOF | Nov 29, 2006 | Abandoned |
Array
(
[id] => 5069612
[patent_doc_number] => 20070190714
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-16
[patent_title] => 'Trench transistor and method for fabricating a trench transistor with high-energy-implanted drain'
[patent_app_type] => utility
[patent_app_number] => 11/606628
[patent_app_country] => US
[patent_app_date] => 2006-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 4092
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0190/20070190714.pdf
[firstpage_image] =>[orig_patent_app_number] => 11606628
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/606628 | Trench transistor and method for fabricating a trench transistor with high-energy-implanted drain | Nov 29, 2006 | Issued |
Array
(
[id] => 4826995
[patent_doc_number] => 20080127488
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-05
[patent_title] => 'Method for producing a reinforced durable electronic device, such as a plastic card, and the device obtained therefrom'
[patent_app_type] => utility
[patent_app_number] => 11/606233
[patent_app_country] => US
[patent_app_date] => 2006-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3238
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0127/20080127488.pdf
[firstpage_image] =>[orig_patent_app_number] => 11606233
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/606233 | Method for producing a reinforced durable electronic device, such as a plastic card, and the device obtained therefrom | Nov 29, 2006 | Issued |
Array
(
[id] => 5346192
[patent_doc_number] => 20090001553
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-01
[patent_title] => 'Mems Package and Method for the Production Thereof'
[patent_app_type] => utility
[patent_app_number] => 12/092439
[patent_app_country] => US
[patent_app_date] => 2006-11-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 7442
[patent_no_of_claims] => 36
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20090001553.pdf
[firstpage_image] =>[orig_patent_app_number] => 12092439
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/092439 | MEMS package and method for the production thereof | Nov 5, 2006 | Issued |
Array
(
[id] => 4901839
[patent_doc_number] => 20080111251
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-05-15
[patent_title] => 'METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT COMPRISING AN INTEGRATED CIRCUIT AND A WINDING ASSEMBLY'
[patent_app_type] => utility
[patent_app_number] => 11/556339
[patent_app_country] => US
[patent_app_date] => 2006-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => publications/A1/0111/20080111251.pdf
[firstpage_image] =>[orig_patent_app_number] => 11556339
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/556339 | METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT COMPRISING AN INTEGRATED CIRCUIT AND A WINDING ASSEMBLY | Nov 2, 2006 | Abandoned |
Array
(
[id] => 8117205
[patent_doc_number] => 08159826
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-04-17
[patent_title] => 'Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments'
[patent_app_type] => utility
[patent_app_number] => 12/092179
[patent_app_country] => US
[patent_app_date] => 2006-11-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3468
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/159/08159826.pdf
[firstpage_image] =>[orig_patent_app_number] => 12092179
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/092179 | Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments | Nov 2, 2006 | Issued |
Array
(
[id] => 5157534
[patent_doc_number] => 20070170578
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein'
[patent_app_type] => utility
[patent_app_number] => 11/584518
[patent_app_country] => US
[patent_app_date] => 2006-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0170/20070170578.pdf
[firstpage_image] =>[orig_patent_app_number] => 11584518
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/584518 | Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein | Oct 22, 2006 | Issued |