Search

Frank J. Asta

Examiner (ID: 4289)

Most Active Art Unit
2312
Art Unit(s)
2318, 2756, 2752, 2312
Total Applications
250
Issued Applications
208
Pending Applications
4
Abandoned Applications
38

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7625094 [patent_doc_number] => 06724076 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-04-20 [patent_title] => 'Package for a semiconductor chip' [patent_app_type] => B1 [patent_app_number] => 10/111294 [patent_app_country] => US [patent_app_date] => 2003-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1964 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/724/06724076.pdf [firstpage_image] =>[orig_patent_app_number] => 10111294 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/111294
Package for a semiconductor chip Jun 25, 2003 Issued
Array ( [id] => 1132655 [patent_doc_number] => 06787928 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-09-07 [patent_title] => 'Integrated circuit device having pads structure formed thereon and method for forming the same' [patent_app_type] => B1 [patent_app_number] => 10/425973 [patent_app_country] => US [patent_app_date] => 2003-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 2264 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/787/06787928.pdf [firstpage_image] =>[orig_patent_app_number] => 10425973 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/425973
Integrated circuit device having pads structure formed thereon and method for forming the same Apr 29, 2003 Issued
Array ( [id] => 6872786 [patent_doc_number] => 20030193083 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-10-16 [patent_title] => 'Substrate for light emitting diodes' [patent_app_type] => new [patent_app_number] => 10/411134 [patent_app_country] => US [patent_app_date] => 2003-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 1740 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0193/20030193083.pdf [firstpage_image] =>[orig_patent_app_number] => 10411134 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/411134
Substrate for light emitting diodes Apr 10, 2003 Issued
Array ( [id] => 1120943 [patent_doc_number] => 06798069 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-09-28 [patent_title] => 'Integrated circuit having adaptable core and input/output regions with multi-layer pad trace conductors' [patent_app_type] => B1 [patent_app_number] => 10/402054 [patent_app_country] => US [patent_app_date] => 2003-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 4121 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/798/06798069.pdf [firstpage_image] =>[orig_patent_app_number] => 10402054 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/402054
Integrated circuit having adaptable core and input/output regions with multi-layer pad trace conductors Mar 27, 2003 Issued
Array ( [id] => 7421357 [patent_doc_number] => 20040000728 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-01 [patent_title] => 'Resin-sealed semiconductor device, and die bonding material and sealing material for use therein' [patent_app_type] => new [patent_app_number] => 10/381034 [patent_app_country] => US [patent_app_date] => 2003-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 13477 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20040000728.pdf [firstpage_image] =>[orig_patent_app_number] => 10381034 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/381034
Resin-sealed semiconductor device, and die bonding material and sealing material for use therein Mar 20, 2003 Issued
Array ( [id] => 6863732 [patent_doc_number] => 20030189258 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-10-09 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/392934 [patent_app_country] => US [patent_app_date] => 2003-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4185 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0189/20030189258.pdf [firstpage_image] =>[orig_patent_app_number] => 10392934 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/392934
Multi-chip package semiconductor device having plural level interconnections Mar 20, 2003 Issued
Array ( [id] => 1170019 [patent_doc_number] => 06756687 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-06-29 [patent_title] => 'Interfacial strengthening for electroless nickel immersion gold substrates' [patent_app_type] => B1 [patent_app_number] => 10/382784 [patent_app_country] => US [patent_app_date] => 2003-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 3252 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/756/06756687.pdf [firstpage_image] =>[orig_patent_app_number] => 10382784 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/382784
Interfacial strengthening for electroless nickel immersion gold substrates Mar 4, 2003 Issued
Array ( [id] => 6704407 [patent_doc_number] => 20030151141 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-14 [patent_title] => 'External connection terminal and semiconductor device' [patent_app_type] => new [patent_app_number] => 10/374965 [patent_app_country] => US [patent_app_date] => 2003-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 40 [patent_figures_cnt] => 40 [patent_no_of_words] => 13125 [patent_no_of_claims] => 43 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20030151141.pdf [firstpage_image] =>[orig_patent_app_number] => 10374965 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/374965
External connection terminal and semiconductor device Feb 27, 2003 Issued
Array ( [id] => 6785822 [patent_doc_number] => 20030137061 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-24 [patent_title] => 'Encapsulation of organic polymer electronic devices' [patent_app_type] => new [patent_app_number] => 10/373817 [patent_app_country] => US [patent_app_date] => 2003-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4306 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0137/20030137061.pdf [firstpage_image] =>[orig_patent_app_number] => 10373817 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/373817
Encapsulation of organic polymer electronic devices Feb 25, 2003 Abandoned
Array ( [id] => 1149764 [patent_doc_number] => 06774403 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-08-10 [patent_title] => 'Multi-colored LED lighted sign' [patent_app_type] => B1 [patent_app_number] => 10/361183 [patent_app_country] => US [patent_app_date] => 2003-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 961 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 243 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/774/06774403.pdf [firstpage_image] =>[orig_patent_app_number] => 10361183 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/361183
Multi-colored LED lighted sign Feb 9, 2003 Issued
Array ( [id] => 1125183 [patent_doc_number] => 06794691 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-09-21 [patent_title] => 'Use of irregularly shaped conductive filler features to improve planarization of the conductive layer while reducing parasitic capacitance introduced by the filler features' [patent_app_type] => B2 [patent_app_number] => 10/348093 [patent_app_country] => US [patent_app_date] => 2003-01-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2649 [patent_no_of_claims] => 53 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/794/06794691.pdf [firstpage_image] =>[orig_patent_app_number] => 10348093 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/348093
Use of irregularly shaped conductive filler features to improve planarization of the conductive layer while reducing parasitic capacitance introduced by the filler features Jan 20, 2003 Issued
Array ( [id] => 1132232 [patent_doc_number] => 06787815 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-09-07 [patent_title] => 'High-isolation semiconductor device' [patent_app_type] => B2 [patent_app_number] => 10/341698 [patent_app_country] => US [patent_app_date] => 2003-01-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 18 [patent_no_of_words] => 3716 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/787/06787815.pdf [firstpage_image] =>[orig_patent_app_number] => 10341698 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/341698
High-isolation semiconductor device Jan 13, 2003 Issued
Array ( [id] => 1116928 [patent_doc_number] => 06800910 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-10-05 [patent_title] => 'FinFET device incorporating strained silicon in the channel region' [patent_app_type] => B2 [patent_app_number] => 10/335474 [patent_app_country] => US [patent_app_date] => 2002-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 17 [patent_no_of_words] => 3699 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/800/06800910.pdf [firstpage_image] =>[orig_patent_app_number] => 10335474 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/335474
FinFET device incorporating strained silicon in the channel region Dec 30, 2002 Issued
Array ( [id] => 7295958 [patent_doc_number] => 20040124507 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-07-01 [patent_title] => 'Contact structure and production method thereof' [patent_app_type] => new [patent_app_number] => 10/331564 [patent_app_country] => US [patent_app_date] => 2002-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3953 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0124/20040124507.pdf [firstpage_image] =>[orig_patent_app_number] => 10331564 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/331564
Contact structure and production method thereof Dec 29, 2002 Abandoned
Array ( [id] => 1116873 [patent_doc_number] => 06800884 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-10-05 [patent_title] => 'Inter-tile buffer system for a field programmable gate array' [patent_app_type] => B1 [patent_app_number] => 10/334393 [patent_app_country] => US [patent_app_date] => 2002-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 14 [patent_no_of_words] => 5620 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 263 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/800/06800884.pdf [firstpage_image] =>[orig_patent_app_number] => 10334393 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/334393
Inter-tile buffer system for a field programmable gate array Dec 29, 2002 Issued
Array ( [id] => 6655842 [patent_doc_number] => 20030132467 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-17 [patent_title] => 'Image sensor having photodiode on substrate' [patent_app_type] => new [patent_app_number] => 10/330273 [patent_app_country] => US [patent_app_date] => 2002-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3417 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0132/20030132467.pdf [firstpage_image] =>[orig_patent_app_number] => 10330273 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/330273
Image sensor having photodiode on substrate Dec 29, 2002 Issued
Array ( [id] => 1318853 [patent_doc_number] => 06608333 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-08-19 [patent_title] => 'Organic light emitting diode device' [patent_app_type] => B1 [patent_app_number] => 10/248113 [patent_app_country] => US [patent_app_date] => 2002-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2671 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/608/06608333.pdf [firstpage_image] =>[orig_patent_app_number] => 10248113 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/248113
Organic light emitting diode device Dec 18, 2002 Issued
Array ( [id] => 1218104 [patent_doc_number] => 06707143 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-16 [patent_title] => 'Stacked semiconductor chips attached to a wiring board' [patent_app_type] => B2 [patent_app_number] => 10/320379 [patent_app_country] => US [patent_app_date] => 2002-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 4953 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/707/06707143.pdf [firstpage_image] =>[orig_patent_app_number] => 10320379 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/320379
Stacked semiconductor chips attached to a wiring board Dec 16, 2002 Issued
Array ( [id] => 6858964 [patent_doc_number] => 20030089972 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-15 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/320405 [patent_app_country] => US [patent_app_date] => 2002-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5052 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0089/20030089972.pdf [firstpage_image] =>[orig_patent_app_number] => 10320405 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/320405
Semiconductor device Dec 16, 2002 Issued
Array ( [id] => 1144891 [patent_doc_number] => 06777796 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-08-17 [patent_title] => 'Stacked semiconductor chips on a wiring board' [patent_app_type] => B2 [patent_app_number] => 10/320362 [patent_app_country] => US [patent_app_date] => 2002-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 4964 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/777/06777796.pdf [firstpage_image] =>[orig_patent_app_number] => 10320362 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/320362
Stacked semiconductor chips on a wiring board Dec 16, 2002 Issued
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