Search

Frank J. Vineis

Examiner (ID: 2880, Phone: (571)270-1547 , Office: P/1786 )

Most Active Art Unit
1786
Art Unit(s)
1781, 1786
Total Applications
265
Issued Applications
95
Pending Applications
23
Abandoned Applications
150

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3896253 [patent_doc_number] => 05897339 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-27 [patent_title] => 'Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/915668 [patent_app_country] => US [patent_app_date] => 1997-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 3946 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 229 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/897/05897339.pdf [firstpage_image] =>[orig_patent_app_number] => 915668 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/915668
Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same Aug 20, 1997 Issued
Array ( [id] => 3945024 [patent_doc_number] => 05953589 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-14 [patent_title] => 'Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same' [patent_app_type] => 1 [patent_app_number] => 8/915077 [patent_app_country] => US [patent_app_date] => 1997-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 27 [patent_no_of_words] => 7292 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/953/05953589.pdf [firstpage_image] =>[orig_patent_app_number] => 915077 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/915077
Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same Aug 19, 1997 Issued
Array ( [id] => 4056762 [patent_doc_number] => 05863813 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-01-26 [patent_title] => 'Method of processing semiconductive material wafers and method of forming flip chips and semiconductor chips' [patent_app_type] => 1 [patent_app_number] => 8/917004 [patent_app_country] => US [patent_app_date] => 1997-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 2581 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/863/05863813.pdf [firstpage_image] =>[orig_patent_app_number] => 917004 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/917004
Method of processing semiconductive material wafers and method of forming flip chips and semiconductor chips Aug 19, 1997 Issued
Array ( [id] => 4003846 [patent_doc_number] => 05960258 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-28 [patent_title] => 'Underfill coating for LOC package' [patent_app_type] => 1 [patent_app_number] => 8/915422 [patent_app_country] => US [patent_app_date] => 1997-08-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 21 [patent_no_of_words] => 6094 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 326 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/960/05960258.pdf [firstpage_image] =>[orig_patent_app_number] => 915422 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/915422
Underfill coating for LOC package Aug 19, 1997 Issued
Array ( [id] => 3896267 [patent_doc_number] => 05897340 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-27 [patent_title] => 'Hybrid frame with lead-lock tape' [patent_app_type] => 1 [patent_app_number] => 8/914718 [patent_app_country] => US [patent_app_date] => 1997-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 3285 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/897/05897340.pdf [firstpage_image] =>[orig_patent_app_number] => 914718 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/914718
Hybrid frame with lead-lock tape Aug 18, 1997 Issued
Array ( [id] => 3935328 [patent_doc_number] => 05972780 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-10-26 [patent_title] => 'Thin film forming apparatus and method' [patent_app_type] => 1 [patent_app_number] => 8/911845 [patent_app_country] => US [patent_app_date] => 1997-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 29 [patent_no_of_words] => 9736 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/972/05972780.pdf [firstpage_image] =>[orig_patent_app_number] => 911845 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/911845
Thin film forming apparatus and method Aug 14, 1997 Issued
Array ( [id] => 3936732 [patent_doc_number] => 05915166 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-22 [patent_title] => 'Tape under frame for conventional-type IC package assembly' [patent_app_type] => 1 [patent_app_number] => 8/910611 [patent_app_country] => US [patent_app_date] => 1997-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3304 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 158 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/915/05915166.pdf [firstpage_image] =>[orig_patent_app_number] => 910611 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/910611
Tape under frame for conventional-type IC package assembly Aug 12, 1997 Issued
08/910348 SEMICONDUCTOR DEVICE Aug 12, 1997 Abandoned
Array ( [id] => 3996786 [patent_doc_number] => 05911112 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-06-08 [patent_title] => 'Method for forming electrical connections between a semiconductor die and a semiconductor package' [patent_app_type] => 1 [patent_app_number] => 8/904530 [patent_app_country] => US [patent_app_date] => 1997-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 19 [patent_no_of_words] => 6512 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/911/05911112.pdf [firstpage_image] =>[orig_patent_app_number] => 904530 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/904530
Method for forming electrical connections between a semiconductor die and a semiconductor package Jul 31, 1997 Issued
Array ( [id] => 4237742 [patent_doc_number] => 06080604 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-06-27 [patent_title] => 'Semiconductor device having tab-leads and a fabrication method thereof' [patent_app_type] => 1 [patent_app_number] => 8/901280 [patent_app_country] => US [patent_app_date] => 1997-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 17 [patent_no_of_words] => 2366 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 245 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/080/06080604.pdf [firstpage_image] =>[orig_patent_app_number] => 901280 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/901280
Semiconductor device having tab-leads and a fabrication method thereof Jul 28, 1997 Issued
Array ( [id] => 4138938 [patent_doc_number] => 06060339 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-05-09 [patent_title] => 'Method and apparatus providing redundancy for fabricating highly reliable memory modules' [patent_app_type] => 1 [patent_app_number] => 8/902470 [patent_app_country] => US [patent_app_date] => 1997-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 4539 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/060/06060339.pdf [firstpage_image] =>[orig_patent_app_number] => 902470 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/902470
Method and apparatus providing redundancy for fabricating highly reliable memory modules Jul 28, 1997 Issued
Array ( [id] => 3964497 [patent_doc_number] => 05885848 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-23 [patent_title] => 'Ball grid array with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom' [patent_app_type] => 1 [patent_app_number] => 8/901489 [patent_app_country] => US [patent_app_date] => 1997-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1897 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/885/05885848.pdf [firstpage_image] =>[orig_patent_app_number] => 901489 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/901489
Ball grid array with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom Jul 27, 1997 Issued
Array ( [id] => 3999281 [patent_doc_number] => 05950072 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-07 [patent_title] => 'Low-profile removable ball-grid-array integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 8/900674 [patent_app_country] => US [patent_app_date] => 1997-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 2523 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/950/05950072.pdf [firstpage_image] =>[orig_patent_app_number] => 900674 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/900674
Low-profile removable ball-grid-array integrated circuit package Jul 24, 1997 Issued
Array ( [id] => 4003769 [patent_doc_number] => 05960253 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-09-28 [patent_title] => 'Method of manufacturing semiconductor memory device capable of readily repairing defective portion resulting from mask defect' [patent_app_type] => 1 [patent_app_number] => 8/899814 [patent_app_country] => US [patent_app_date] => 1997-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 2700 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/960/05960253.pdf [firstpage_image] =>[orig_patent_app_number] => 899814 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/899814
Method of manufacturing semiconductor memory device capable of readily repairing defective portion resulting from mask defect Jul 23, 1997 Issued
Array ( [id] => 4016107 [patent_doc_number] => 05923959 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-13 [patent_title] => 'Ball grid array (BGA) encapsulation mold' [patent_app_type] => 1 [patent_app_number] => 8/898812 [patent_app_country] => US [patent_app_date] => 1997-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 3566 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 198 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/923/05923959.pdf [firstpage_image] =>[orig_patent_app_number] => 898812 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/898812
Ball grid array (BGA) encapsulation mold Jul 22, 1997 Issued
Array ( [id] => 3956896 [patent_doc_number] => 05930601 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-27 [patent_title] => 'Heat assembly and method of transferring heat' [patent_app_type] => 1 [patent_app_number] => 8/898240 [patent_app_country] => US [patent_app_date] => 1997-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 3130 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/930/05930601.pdf [firstpage_image] =>[orig_patent_app_number] => 898240 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/898240
Heat assembly and method of transferring heat Jul 21, 1997 Issued
Array ( [id] => 4016008 [patent_doc_number] => 05923952 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-13 [patent_title] => 'Fusion-bond electrical feed-through' [patent_app_type] => 1 [patent_app_number] => 8/897124 [patent_app_country] => US [patent_app_date] => 1997-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 2 [patent_no_of_words] => 3488 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/923/05923952.pdf [firstpage_image] =>[orig_patent_app_number] => 897124 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/897124
Fusion-bond electrical feed-through Jul 17, 1997 Issued
Array ( [id] => 4129681 [patent_doc_number] => 06033930 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2000-03-07 [patent_title] => 'Lead frame carrying method and lead frame carrying apparatus' [patent_app_type] => 1 [patent_app_number] => 8/896336 [patent_app_country] => US [patent_app_date] => 1997-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 3853 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/033/06033930.pdf [firstpage_image] =>[orig_patent_app_number] => 896336 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/896336
Lead frame carrying method and lead frame carrying apparatus Jul 16, 1997 Issued
Array ( [id] => 3956773 [patent_doc_number] => 05930593 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-27 [patent_title] => 'Method for formating device on wafer without peeling' [patent_app_type] => 1 [patent_app_number] => 8/895430 [patent_app_country] => US [patent_app_date] => 1997-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 26 [patent_no_of_words] => 2609 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/930/05930593.pdf [firstpage_image] =>[orig_patent_app_number] => 895430 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/895430
Method for formating device on wafer without peeling Jul 15, 1997 Issued
Array ( [id] => 3956671 [patent_doc_number] => 05930586 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-07-27 [patent_title] => 'Method and apparatus for in-line measuring backside wafer-level contamination of a semiconductor wafer' [patent_app_type] => 1 [patent_app_number] => 8/887696 [patent_app_country] => US [patent_app_date] => 1997-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 4030 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/930/05930586.pdf [firstpage_image] =>[orig_patent_app_number] => 887696 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/887696
Method and apparatus for in-line measuring backside wafer-level contamination of a semiconductor wafer Jul 2, 1997 Issued
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