
Frank J. Vineis
Examiner (ID: 2880, Phone: (571)270-1547 , Office: P/1786 )
| Most Active Art Unit | 1786 |
| Art Unit(s) | 1781, 1786 |
| Total Applications | 265 |
| Issued Applications | 95 |
| Pending Applications | 23 |
| Abandoned Applications | 150 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4039249
[patent_doc_number] => 05926731
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-20
[patent_title] => 'Method for controlling solder bump shape and stand-off height'
[patent_app_type] => 1
[patent_app_number] => 8/887064
[patent_app_country] => US
[patent_app_date] => 1997-07-02
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[pdf_file] => patents/05/926/05926731.pdf
[firstpage_image] =>[orig_patent_app_number] => 887064
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/887064 | Method for controlling solder bump shape and stand-off height | Jul 1, 1997 | Issued |
Array
(
[id] => 3990720
[patent_doc_number] => 05891756
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-06
[patent_title] => 'Process for converting a wire bond pad to a flip chip solder bump pad and pad formed thereby'
[patent_app_type] => 1
[patent_app_number] => 8/883694
[patent_app_country] => US
[patent_app_date] => 1997-06-27
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/883694 | Process for converting a wire bond pad to a flip chip solder bump pad and pad formed thereby | Jun 26, 1997 | Issued |
Array
(
[id] => 3942004
[patent_doc_number] => 05989991
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-23
[patent_title] => 'Methods for fabricating a bonding pad having improved adhesion to an underlying structure'
[patent_app_type] => 1
[patent_app_number] => 8/879562
[patent_app_country] => US
[patent_app_date] => 1997-06-20
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[patent_drawing_sheets_cnt] => 8
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[pdf_file] => patents/05/989/05989991.pdf
[firstpage_image] =>[orig_patent_app_number] => 879562
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/879562 | Methods for fabricating a bonding pad having improved adhesion to an underlying structure | Jun 19, 1997 | Issued |
Array
(
[id] => 3952640
[patent_doc_number] => 05940687
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-17
[patent_title] => 'Wire mesh insert for thermal adhesives'
[patent_app_type] => 1
[patent_app_number] => 8/870800
[patent_app_country] => US
[patent_app_date] => 1997-06-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[firstpage_image] =>[orig_patent_app_number] => 870800
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/870800 | Wire mesh insert for thermal adhesives | Jun 5, 1997 | Issued |
Array
(
[id] => 4016633
[patent_doc_number] => 05923996
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-13
[patent_title] => 'Method to protect alignment mark in CMP process'
[patent_app_type] => 1
[patent_app_number] => 8/867312
[patent_app_country] => US
[patent_app_date] => 1997-06-02
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[pdf_file] => patents/05/923/05923996.pdf
[firstpage_image] =>[orig_patent_app_number] => 867312
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/867312 | Method to protect alignment mark in CMP process | Jun 1, 1997 | Issued |
Array
(
[id] => 3941927
[patent_doc_number] => 05946554
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-31
[patent_title] => 'Method of producing resin-sealed electronic device'
[patent_app_type] => 1
[patent_app_number] => 8/863398
[patent_app_country] => US
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[pdf_file] => patents/05/946/05946554.pdf
[firstpage_image] =>[orig_patent_app_number] => 863398
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/863398 | Method of producing resin-sealed electronic device | May 26, 1997 | Issued |
Array
(
[id] => 4233480
[patent_doc_number] => 06074893
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-06-13
[patent_title] => 'Process for forming fine thick-film conductor patterns'
[patent_app_type] => 1
[patent_app_number] => 8/863279
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/863279 | Process for forming fine thick-film conductor patterns | May 26, 1997 | Issued |
Array
(
[id] => 4070419
[patent_doc_number] => 06069027
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-05-30
[patent_title] => 'Fixture for lid-attachment for encapsulated packages'
[patent_app_type] => 1
[patent_app_number] => 8/859751
[patent_app_country] => US
[patent_app_date] => 1997-05-21
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[patent_drawing_sheets_cnt] => 16
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[pdf_file] => patents/06/069/06069027.pdf
[firstpage_image] =>[orig_patent_app_number] => 859751
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/859751 | Fixture for lid-attachment for encapsulated packages | May 20, 1997 | Issued |
Array
(
[id] => 4084325
[patent_doc_number] => 06025213
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-15
[patent_title] => 'Semiconductor light-emitting device package and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 8/856529
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/856529 | Semiconductor light-emitting device package and method of manufacturing the same | May 13, 1997 | Issued |
Array
(
[id] => 4181503
[patent_doc_number] => 06020252
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-01
[patent_title] => 'Method of producing a thin layer of semiconductor material'
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[patent_app_number] => 8/856275
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Array
(
[id] => 3980290
[patent_doc_number] => 05910011
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[patent_title] => 'Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system'
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Array
(
[id] => 4063025
[patent_doc_number] => 05866475
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[patent_issue_date] => 1999-02-02
[patent_title] => 'Method of forming solder bumps'
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Array
(
[id] => 4015931
[patent_doc_number] => 05923947
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[patent_issue_date] => 1999-07-13
[patent_title] => 'Method for achieving low capacitance diffusion pattern filling'
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Array
(
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Array
(
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Array
(
[id] => 4009171
[patent_doc_number] => 05920770
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[patent_title] => 'Resin seal semiconductor package and manufacturing method of the same'
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Array
(
[id] => 4006461
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Array
(
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Array
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Array
(
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[firstpage_image] =>[orig_patent_app_number] => 825006
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/825006 | Diode-laser module with a bonded component and method for bonding same | Mar 25, 1997 | Issued |