
Frank J. Vineis
Examiner (ID: 2880, Phone: (571)270-1547 , Office: P/1786 )
| Most Active Art Unit | 1786 |
| Art Unit(s) | 1781, 1786 |
| Total Applications | 265 |
| Issued Applications | 95 |
| Pending Applications | 23 |
| Abandoned Applications | 150 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4056930
[patent_doc_number] => 05895228
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-20
[patent_title] => 'Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives'
[patent_app_type] => 1
[patent_app_number] => 8/821218
[patent_app_country] => US
[patent_app_date] => 1997-03-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3642
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 84
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/895/05895228.pdf
[firstpage_image] =>[orig_patent_app_number] => 821218
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/821218 | Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives | Mar 19, 1997 | Issued |
Array
(
[id] => 3975966
[patent_doc_number] => 05937277
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-10
[patent_title] => 'Semiconductor device with reliable electrodes of projecting shape and method of forming same'
[patent_app_type] => 1
[patent_app_number] => 8/814106
[patent_app_country] => US
[patent_app_date] => 1997-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 49
[patent_no_of_words] => 11657
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/937/05937277.pdf
[firstpage_image] =>[orig_patent_app_number] => 814106
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/814106 | Semiconductor device with reliable electrodes of projecting shape and method of forming same | Mar 9, 1997 | Issued |
Array
(
[id] => 4037706
[patent_doc_number] => 05908304
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-01
[patent_title] => 'Mass memory and method for the manufacture of mass memories'
[patent_app_type] => 1
[patent_app_number] => 8/805850
[patent_app_country] => US
[patent_app_date] => 1997-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 2181
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/908/05908304.pdf
[firstpage_image] =>[orig_patent_app_number] => 805850
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/805850 | Mass memory and method for the manufacture of mass memories | Mar 2, 1997 | Issued |
Array
(
[id] => 3966797
[patent_doc_number] => 05956574
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-21
[patent_title] => 'Lead frame flash removing method and apparatus'
[patent_app_type] => 1
[patent_app_number] => 8/808420
[patent_app_country] => US
[patent_app_date] => 1997-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 12
[patent_no_of_words] => 5133
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 100
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/956/05956574.pdf
[firstpage_image] =>[orig_patent_app_number] => 808420
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/808420 | Lead frame flash removing method and apparatus | Feb 27, 1997 | Issued |
Array
(
[id] => 3999239
[patent_doc_number] => 05950069
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-07
[patent_title] => 'Quencher clamping operation using an electromagnet'
[patent_app_type] => 1
[patent_app_number] => 8/810956
[patent_app_country] => US
[patent_app_date] => 1997-02-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 916
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/950/05950069.pdf
[firstpage_image] =>[orig_patent_app_number] => 810956
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/810956 | Quencher clamping operation using an electromagnet | Feb 26, 1997 | Issued |
Array
(
[id] => 4058602
[patent_doc_number] => 05913110
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-06-15
[patent_title] => 'Method for producing a plastic material composite component, a plastic material composite component and a mold for injection molding same'
[patent_app_type] => 1
[patent_app_number] => 8/806812
[patent_app_country] => US
[patent_app_date] => 1997-02-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 15
[patent_no_of_words] => 5982
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/913/05913110.pdf
[firstpage_image] =>[orig_patent_app_number] => 806812
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/806812 | Method for producing a plastic material composite component, a plastic material composite component and a mold for injection molding same | Feb 25, 1997 | Issued |
Array
(
[id] => 3943081
[patent_doc_number] => 05976901
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-11-02
[patent_title] => 'Process for manufacturing semiconductor devices with active structures'
[patent_app_type] => 1
[patent_app_number] => 8/804422
[patent_app_country] => US
[patent_app_date] => 1997-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1797
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/976/05976901.pdf
[firstpage_image] =>[orig_patent_app_number] => 804422
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/804422 | Process for manufacturing semiconductor devices with active structures | Feb 20, 1997 | Issued |
Array
(
[id] => 3990693
[patent_doc_number] => 05891754
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-06
[patent_title] => 'Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant'
[patent_app_type] => 1
[patent_app_number] => 8/798260
[patent_app_country] => US
[patent_app_date] => 1997-02-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 3203
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/891/05891754.pdf
[firstpage_image] =>[orig_patent_app_number] => 798260
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/798260 | Method of inspecting integrated circuit solder joints with x-ray detectable encapsulant | Feb 10, 1997 | Issued |
Array
(
[id] => 4016064
[patent_doc_number] => 05923956
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-07-13
[patent_title] => 'Method of securing a semiconductor chip on a base plate and structure thereof'
[patent_app_type] => 1
[patent_app_number] => 8/790469
[patent_app_country] => US
[patent_app_date] => 1997-01-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 16
[patent_no_of_words] => 3919
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 114
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/923/05923956.pdf
[firstpage_image] =>[orig_patent_app_number] => 790469
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/790469 | Method of securing a semiconductor chip on a base plate and structure thereof | Jan 28, 1997 | Issued |
Array
(
[id] => 3968493
[patent_doc_number] => 05904496
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Wafer fabrication of inside-wrapped contacts for electronic devices'
[patent_app_type] => 1
[patent_app_number] => 8/788764
[patent_app_country] => US
[patent_app_date] => 1997-01-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 40
[patent_no_of_words] => 13264
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 103
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/904/05904496.pdf
[firstpage_image] =>[orig_patent_app_number] => 788764
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/788764 | Wafer fabrication of inside-wrapped contacts for electronic devices | Jan 23, 1997 | Issued |
Array
(
[id] => 4153766
[patent_doc_number] => 06103547
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-08-15
[patent_title] => 'High speed IC package configuration'
[patent_app_type] => 1
[patent_app_number] => 8/784362
[patent_app_country] => US
[patent_app_date] => 1997-01-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 7795
[patent_no_of_claims] => 35
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 172
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/103/06103547.pdf
[firstpage_image] =>[orig_patent_app_number] => 784362
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/784362 | High speed IC package configuration | Jan 16, 1997 | Issued |
Array
(
[id] => 3941940
[patent_doc_number] => 05946555
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-31
[patent_title] => 'Wafer level decal for minimal packaging of chips'
[patent_app_type] => 1
[patent_app_number] => 8/743608
[patent_app_country] => US
[patent_app_date] => 1996-11-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 1789
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 136
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/946/05946555.pdf
[firstpage_image] =>[orig_patent_app_number] => 743608
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/743608 | Wafer level decal for minimal packaging of chips | Nov 3, 1996 | Issued |
Array
(
[id] => 4219130
[patent_doc_number] => 06040235
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-03-21
[patent_title] => 'Methods and apparatus for producing integrated circuit devices'
[patent_app_type] => 1
[patent_app_number] => 8/682556
[patent_app_country] => US
[patent_app_date] => 1996-08-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 19
[patent_no_of_words] => 4139
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 46
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/040/06040235.pdf
[firstpage_image] =>[orig_patent_app_number] => 682556
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/682556 | Methods and apparatus for producing integrated circuit devices | Aug 18, 1996 | Issued |
Array
(
[id] => 4106348
[patent_doc_number] => 06022761
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-02-08
[patent_title] => 'Method for coupling substrates and structure'
[patent_app_type] => 1
[patent_app_number] => 8/654466
[patent_app_country] => US
[patent_app_date] => 1996-05-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 2422
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/022/06022761.pdf
[firstpage_image] =>[orig_patent_app_number] => 654466
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/654466 | Method for coupling substrates and structure | May 27, 1996 | Issued |
Array
(
[id] => 3969283
[patent_doc_number] => 05904546
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-05-18
[patent_title] => 'Method and apparatus for dicing semiconductor wafers'
[patent_app_type] => 1
[patent_app_number] => 8/605245
[patent_app_country] => US
[patent_app_date] => 1996-02-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 16
[patent_no_of_words] => 3651
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 127
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/904/05904546.pdf
[firstpage_image] =>[orig_patent_app_number] => 605245
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/605245 | Method and apparatus for dicing semiconductor wafers | Feb 11, 1996 | Issued |
Array
(
[id] => 4172722
[patent_doc_number] => 06083811
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-07-04
[patent_title] => 'Method for producing thin dice from fragile materials'
[patent_app_type] => 1
[patent_app_number] => 8/597762
[patent_app_country] => US
[patent_app_date] => 1996-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 2334
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/083/06083811.pdf
[firstpage_image] =>[orig_patent_app_number] => 597762
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/597762 | Method for producing thin dice from fragile materials | Feb 6, 1996 | Issued |
Array
(
[id] => 3952587
[patent_doc_number] => 05940683
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-08-17
[patent_title] => 'LED display packaging with substrate removal and method of fabrication'
[patent_app_type] => 1
[patent_app_number] => 8/588470
[patent_app_country] => US
[patent_app_date] => 1996-01-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 4798
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/940/05940683.pdf
[firstpage_image] =>[orig_patent_app_number] => 588470
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/588470 | LED display packaging with substrate removal and method of fabrication | Jan 17, 1996 | Issued |