
Frank J. Vineis
Examiner (ID: 2880, Phone: (571)270-1547 , Office: P/1786 )
| Most Active Art Unit | 1786 |
| Art Unit(s) | 1781, 1786 |
| Total Applications | 265 |
| Issued Applications | 95 |
| Pending Applications | 23 |
| Abandoned Applications | 150 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4394348
[patent_doc_number] => 06297075
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-10-02
[patent_title] => 'Method and apparatus for separating semiconductor elements, and mounting method of semiconductor elements'
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Array
(
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[patent_issue_date] => 2001-05-29
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Array
(
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[patent_issue_date] => 2001-10-23
[patent_title] => 'Condensed memory matrix'
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[patent_app_date] => 2000-02-16
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Array
(
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[patent_kind] => NA
[patent_issue_date] => 2001-12-04
[patent_title] => 'Copper electroless deposition on a titanium-containing surface'
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Array
(
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Array
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[patent_title] => 'Method of manufacturing a cooling structure of a multichip module'
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Array
(
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[patent_title] => 'Forming and filling a recess in interconnect for encapsulation to minimize electromigration'
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Array
(
[id] => 4297437
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[patent_issue_date] => 2001-05-22
[patent_title] => 'CMOSFET and method for fabricating the same'
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Array
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[id] => 1536142
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[patent_title] => 'Method for improving the quality of metal conductor tracks on semiconductor structures'
[patent_app_type] => B1
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Array
(
[id] => 4380918
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[patent_issue_date] => 2001-09-25
[patent_title] => 'Method of forming a constricted-mouth dimple structure on a leadframe die pad'
[patent_app_type] => 1
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Array
(
[id] => 4341463
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[patent_title] => 'Method/structure for creating aluminum wirebound pad on copper BEOL'
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Array
(
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Array
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/471563 | Structure and process for making substrate packages for high frequency application | Dec 22, 1999 | Issued |