
Fritz Alphonse
Examiner (ID: 6631)
| Most Active Art Unit | 2112 |
| Art Unit(s) | 2675, 2133, 2112, 2775 |
| Total Applications | 1754 |
| Issued Applications | 1609 |
| Pending Applications | 27 |
| Abandoned Applications | 125 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6843236
[patent_doc_number] => 20030148583
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-08-07
[patent_title] => 'Non-volatile semiconductor memory and method of making same, and semiconductor device and method of making device'
[patent_app_type] => new
[patent_app_number] => 10/374433
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0148/20030148583.pdf
[firstpage_image] =>[orig_patent_app_number] => 10374433
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/374433 | Non-volatile semiconductor memory and method of making same, and semiconductor device and method of making device | Feb 26, 2003 | Abandoned |
Array
(
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[patent_doc_number] => 06645786
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[patent_kind] => B2
[patent_issue_date] => 2003-11-11
[patent_title] => 'Integrated circuit device having a built-in thermoelectric cooling mechanism'
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[patent_app_date] => 2003-02-24
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/374115 | Integrated circuit device having a built-in thermoelectric cooling mechanism | Feb 23, 2003 | Issued |
Array
(
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[patent_doc_number] => 06720234
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[patent_issue_date] => 2004-04-13
[patent_title] => 'Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processing'
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[patent_app_number] => 10/366423
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Array
(
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[patent_issue_date] => 2004-08-12
[patent_title] => 'Method for planarizing bumped die'
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[patent_app_number] => 10/359818
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Array
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[patent_title] => 'Use of fluorine implantation to form a charge balanced nitrided gate dielectric layer'
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[patent_app_number] => 10/351158
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Array
(
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[patent_title] => 'Semiconductor fuses, methods of using the same, methods of making the same, and semiconductor devices containing the same'
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[patent_app_number] => 10/331033
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Array
(
[id] => 1205654
[patent_doc_number] => 06716735
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[patent_issue_date] => 2004-04-06
[patent_title] => 'Method for forming metal lines of semiconductor device'
[patent_app_type] => B2
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/327858 | Method for forming metal lines of semiconductor device | Dec 25, 2002 | Issued |
Array
(
[id] => 1053220
[patent_doc_number] => 06858549
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[patent_kind] => B2
[patent_issue_date] => 2005-02-22
[patent_title] => 'Method for forming wiring structure'
[patent_app_type] => utility
[patent_app_number] => 10/328178
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Array
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[id] => 7675092
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[patent_title] => 'Methods for improving sheet resistance of silicide layer after removal of etch stop layer'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/329598 | Methods for improving sheet resistance of silicide layer after removal of etch stop layer | Dec 25, 2002 | Issued |
Array
(
[id] => 7471461
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[patent_title] => 'SiN ROM AND METHOD OF FABRICATING THE SAME'
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Array
(
[id] => 1177354
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[patent_title] => 'Method for the formation of active area utilizing reverse trench isolation'
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Array
(
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Array
(
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Array
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Array
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Array
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Array
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Array
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