Search

Gabriel T. Agared

Examiner (ID: 12184, Phone: (571)270-1981 , Office: P/2837 )

Most Active Art Unit
2837
Art Unit(s)
2846, 2837
Total Applications
818
Issued Applications
629
Pending Applications
109
Abandoned Applications
102

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 8398950 [patent_doc_number] => 08269340 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-09-18 [patent_title] => 'Curvilinear heat spreader/lid with improved heat dissipation' [patent_app_type] => utility [patent_app_number] => 11/857812 [patent_app_country] => US [patent_app_date] => 2007-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2266 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11857812 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/857812
Curvilinear heat spreader/lid with improved heat dissipation Sep 18, 2007 Issued
Array ( [id] => 31934 [patent_doc_number] => 07790270 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-09-07 [patent_title] => 'Wiring board and semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/898971 [patent_app_country] => US [patent_app_date] => 2007-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 21 [patent_no_of_words] => 8510 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/790/07790270.pdf [firstpage_image] =>[orig_patent_app_number] => 11898971 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/898971
Wiring board and semiconductor device Sep 17, 2007 Issued
Array ( [id] => 8203023 [patent_doc_number] => 08188603 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-29 [patent_title] => 'Post passivation interconnection schemes on top of IC chip' [patent_app_type] => utility [patent_app_number] => 11/856076 [patent_app_country] => US [patent_app_date] => 2007-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 7328 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/188/08188603.pdf [firstpage_image] =>[orig_patent_app_number] => 11856076 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/856076
Post passivation interconnection schemes on top of IC chip Sep 16, 2007 Issued
Array ( [id] => 8572278 [patent_doc_number] => 08338928 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-12-25 [patent_title] => 'Three-dimensional package structure' [patent_app_type] => utility [patent_app_number] => 11/847351 [patent_app_country] => US [patent_app_date] => 2007-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 4378 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11847351 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/847351
Three-dimensional package structure Aug 29, 2007 Issued
Array ( [id] => 93118 [patent_doc_number] => 07737548 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-06-15 [patent_title] => 'Semiconductor die package including heat sinks' [patent_app_type] => utility [patent_app_number] => 11/847001 [patent_app_country] => US [patent_app_date] => 2007-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 13 [patent_no_of_words] => 3729 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/737/07737548.pdf [firstpage_image] =>[orig_patent_app_number] => 11847001 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/847001
Semiconductor die package including heat sinks Aug 28, 2007 Issued
Array ( [id] => 4749300 [patent_doc_number] => 20080157371 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'Metal Line of Semiconductor Device and Method of Manufacturing the Same' [patent_app_type] => utility [patent_app_number] => 11/842851 [patent_app_country] => US [patent_app_date] => 2007-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3595 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20080157371.pdf [firstpage_image] =>[orig_patent_app_number] => 11842851 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/842851
Metal line of semiconductor device and method of manufacturing the same Aug 20, 2007 Issued
Array ( [id] => 5413609 [patent_doc_number] => 20090039496 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-02-12 [patent_title] => 'METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/837211 [patent_app_country] => US [patent_app_date] => 2007-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 7110 [patent_no_of_claims] => 57 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0039/20090039496.pdf [firstpage_image] =>[orig_patent_app_number] => 11837211 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/837211
Method for fabricating a semiconductor and semiconductor package Aug 9, 2007 Issued
Array ( [id] => 4518118 [patent_doc_number] => 07932605 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-04-26 [patent_title] => 'Semiconductor device and manufacturing method therefor' [patent_app_type] => utility [patent_app_number] => 11/889071 [patent_app_country] => US [patent_app_date] => 2007-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 63 [patent_no_of_words] => 29692 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/932/07932605.pdf [firstpage_image] =>[orig_patent_app_number] => 11889071 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/889071
Semiconductor device and manufacturing method therefor Aug 7, 2007 Issued
Array ( [id] => 132834 [patent_doc_number] => 07701062 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-04-20 [patent_title] => 'Semiconductor device and method for producing the same' [patent_app_type] => utility [patent_app_number] => 11/834081 [patent_app_country] => US [patent_app_date] => 2007-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 8174 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/701/07701062.pdf [firstpage_image] =>[orig_patent_app_number] => 11834081 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/834081
Semiconductor device and method for producing the same Aug 5, 2007 Issued
Array ( [id] => 4654958 [patent_doc_number] => 20080023818 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-31 [patent_title] => 'Contact device for use in a power semiconductor module or in a disc-type thyristor' [patent_app_type] => utility [patent_app_number] => 11/881966 [patent_app_country] => US [patent_app_date] => 2007-07-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2223 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20080023818.pdf [firstpage_image] =>[orig_patent_app_number] => 11881966 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/881966
Contact device for use in a power semiconductor module or in a disc-type thyristor Jul 29, 2007 Issued
Array ( [id] => 4457715 [patent_doc_number] => 07893545 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-22 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/779731 [patent_app_country] => US [patent_app_date] => 2007-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 20 [patent_no_of_words] => 4623 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/893/07893545.pdf [firstpage_image] =>[orig_patent_app_number] => 11779731 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/779731
Semiconductor device Jul 17, 2007 Issued
Array ( [id] => 5288135 [patent_doc_number] => 20090020865 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-22 [patent_title] => 'Method for Packaging Semiconductor Dies Having Through-Silicon Vias' [patent_app_type] => utility [patent_app_number] => 11/778511 [patent_app_country] => US [patent_app_date] => 2007-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2216 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0020/20090020865.pdf [firstpage_image] =>[orig_patent_app_number] => 11778511 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/778511
Method for packaging semiconductor dies having through-silicon vias Jul 15, 2007 Issued
Array ( [id] => 5223019 [patent_doc_number] => 20070252285 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-01 [patent_title] => 'Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/824527 [patent_app_country] => US [patent_app_date] => 2007-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 8427 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0252/20070252285.pdf [firstpage_image] =>[orig_patent_app_number] => 11824527 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/824527
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device Jun 28, 2007 Abandoned
Array ( [id] => 5346202 [patent_doc_number] => 20090001563 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-01 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE IN PACKAGE SYSTEM WITH ADHESIVELESS PACKAGE ATTACH' [patent_app_type] => utility [patent_app_number] => 11/769691 [patent_app_country] => US [patent_app_date] => 2007-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 7663 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20090001563.pdf [firstpage_image] =>[orig_patent_app_number] => 11769691 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/769691
Integrated circuit package in package system with adhesiveless package attach Jun 26, 2007 Issued
Array ( [id] => 6563326 [patent_doc_number] => 20100059879 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-03-11 [patent_title] => 'Power Amplifier Assembly' [patent_app_type] => utility [patent_app_number] => 12/305693 [patent_app_country] => US [patent_app_date] => 2007-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6766 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0059/20100059879.pdf [firstpage_image] =>[orig_patent_app_number] => 12305693 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/305693
Power amplifier assembly Jun 14, 2007 Issued
Array ( [id] => 5208244 [patent_doc_number] => 20070246828 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-25 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/811981 [patent_app_country] => US [patent_app_date] => 2007-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3812 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0246/20070246828.pdf [firstpage_image] =>[orig_patent_app_number] => 11811981 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/811981
Semiconductor device and method of manufacturing the same Jun 12, 2007 Issued
Array ( [id] => 8329162 [patent_doc_number] => 08237259 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-08-07 [patent_title] => 'Embedded chip package' [patent_app_type] => utility [patent_app_number] => 11/762411 [patent_app_country] => US [patent_app_date] => 2007-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 19 [patent_no_of_words] => 5355 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11762411 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/762411
Embedded chip package Jun 12, 2007 Issued
Array ( [id] => 112858 [patent_doc_number] => 07719125 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-05-18 [patent_title] => 'Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips' [patent_app_type] => utility [patent_app_number] => 11/805661 [patent_app_country] => US [patent_app_date] => 2007-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 5425 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/719/07719125.pdf [firstpage_image] =>[orig_patent_app_number] => 11805661 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/805661
Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips May 22, 2007 Issued
Array ( [id] => 170520 [patent_doc_number] => 07662673 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-02-16 [patent_title] => 'Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument' [patent_app_type] => utility [patent_app_number] => 11/752777 [patent_app_country] => US [patent_app_date] => 2007-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 4540 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/662/07662673.pdf [firstpage_image] =>[orig_patent_app_number] => 11752777 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/752777
Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument May 22, 2007 Issued
Array ( [id] => 5044134 [patent_doc_number] => 20070262805 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-15 [patent_title] => 'Start-up circuit and start-up method' [patent_app_type] => utility [patent_app_number] => 11/801167 [patent_app_country] => US [patent_app_date] => 2007-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4433 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0262/20070262805.pdf [firstpage_image] =>[orig_patent_app_number] => 11801167 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/801167
Start-up circuit and start-up method May 8, 2007 Issued
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