Search

George A. Bugg

Supervisory Patent Examiner (ID: 966, Phone: (571)272-2998 , Office: P/2682 )

Most Active Art Unit
2612
Art Unit(s)
2612, 2636, 2911, 2613, 2682
Total Applications
465
Issued Applications
269
Pending Applications
96
Abandoned Applications
106

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19619495 [patent_doc_number] => 20240405175 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-05 [patent_title] => DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/530443 [patent_app_country] => US [patent_app_date] => 2023-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5387 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18530443 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/530443
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF Dec 5, 2023 Pending
Array ( [id] => 19269623 [patent_doc_number] => 20240213327 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => SUPERLATTICE BUFFER STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME [patent_app_type] => utility [patent_app_number] => 18/485740 [patent_app_country] => US [patent_app_date] => 2023-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4378 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18485740 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/485740
SUPERLATTICE BUFFER STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME Oct 11, 2023 Pending
Array ( [id] => 19116400 [patent_doc_number] => 20240128150 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-18 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING [patent_app_type] => utility [patent_app_number] => 18/473999 [patent_app_country] => US [patent_app_date] => 2023-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11872 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18473999 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/473999
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING Sep 24, 2023 Pending
Array ( [id] => 18927142 [patent_doc_number] => 20240030146 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-25 [patent_title] => MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/220891 [patent_app_country] => US [patent_app_date] => 2023-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4771 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18220891 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/220891
MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF Jul 11, 2023 Pending
Array ( [id] => 19662095 [patent_doc_number] => 20240429160 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-26 [patent_title] => MICROELECTRONIC MECHANICAL FUSE AND ANTI-FUSE APPARATUS AND METHOD [patent_app_type] => utility [patent_app_number] => 18/213612 [patent_app_country] => US [patent_app_date] => 2023-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4460 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18213612 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/213612
MICROELECTRONIC MECHANICAL FUSE AND ANTI-FUSE APPARATUS AND METHOD Jun 22, 2023 Pending
Array ( [id] => 18653178 [patent_doc_number] => 20230299018 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => PACKAGE SUBSTRATE AND COMMUNICATION DEVICE [patent_app_type] => utility [patent_app_number] => 18/324329 [patent_app_country] => US [patent_app_date] => 2023-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12802 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18324329 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/324329
PACKAGE SUBSTRATE AND COMMUNICATION DEVICE May 25, 2023 Pending
Array ( [id] => 19589747 [patent_doc_number] => 20240387304 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-21 [patent_title] => Integrated Circuit Packages and Methods [patent_app_type] => utility [patent_app_number] => 18/318985 [patent_app_country] => US [patent_app_date] => 2023-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10726 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18318985 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/318985
Integrated Circuit Packages and Methods May 16, 2023 Pending
Array ( [id] => 18600202 [patent_doc_number] => 20230275003 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-31 [patent_title] => HEAT DISSIPATION ASSEMBLY, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/144580 [patent_app_country] => US [patent_app_date] => 2023-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10535 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18144580 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/144580
HEAT DISSIPATION ASSEMBLY, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE May 7, 2023 Pending
Array ( [id] => 19206195 [patent_doc_number] => 20240178094 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/144236 [patent_app_country] => US [patent_app_date] => 2023-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5338 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18144236 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/144236
SEMICONDUCTOR PACKAGE May 6, 2023 Pending
Array ( [id] => 18571235 [patent_doc_number] => 20230261572 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => POWER DELIVERY FOR MULTI-CHIP-PACKAGE USING IN-PACKAGE VOLTAGE REGULATOR [patent_app_type] => utility [patent_app_number] => 18/305442 [patent_app_country] => US [patent_app_date] => 2023-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7601 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18305442 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/305442
POWER DELIVERY FOR MULTI-CHIP-PACKAGE USING IN-PACKAGE VOLTAGE REGULATOR Apr 23, 2023 Pending
Array ( [id] => 18848846 [patent_doc_number] => 20230411250 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 18/305539 [patent_app_country] => US [patent_app_date] => 2023-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14216 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18305539 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/305539
POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD Apr 23, 2023 Pending
Array ( [id] => 18927073 [patent_doc_number] => 20240030077 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-25 [patent_title] => PACKAGE AND METHOD OF FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/121158 [patent_app_country] => US [patent_app_date] => 2023-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3085 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18121158 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/121158
PACKAGE AND METHOD OF FABRICATING THE SAME Mar 13, 2023 Pending
Array ( [id] => 18653149 [patent_doc_number] => 20230298989 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-21 [patent_title] => CHIP-INTERCONNECT ARRANGEMENT, METHOD FOR FORMING A CHIP-INTERCONNECT ARRANGEMENT, DOCUMENT STRUCTURE AND METHOD FOR FORMING A DOCUMENT STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/182476 [patent_app_country] => US [patent_app_date] => 2023-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6693 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18182476 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/182476
CHIP-INTERCONNECT ARRANGEMENT, METHOD FOR FORMING A CHIP-INTERCONNECT ARRANGEMENT, DOCUMENT STRUCTURE AND METHOD FOR FORMING A DOCUMENT STRUCTURE Mar 12, 2023 Pending
Array ( [id] => 19407246 [patent_doc_number] => 20240290757 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-29 [patent_title] => SANDWICH PACKAGE FOR MICROELECTRONICS [patent_app_type] => utility [patent_app_number] => 18/174837 [patent_app_country] => US [patent_app_date] => 2023-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6479 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18174837 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/174837
SANDWICH PACKAGE FOR MICROELECTRONICS Feb 26, 2023 Pending
Array ( [id] => 18540832 [patent_doc_number] => 20230245943 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => SEMICONDUCTOR MODULE [patent_app_type] => utility [patent_app_number] => 18/158814 [patent_app_country] => US [patent_app_date] => 2023-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5277 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -4 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18158814 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/158814
SEMICONDUCTOR MODULE Jan 23, 2023 Pending
Array ( [id] => 19321492 [patent_doc_number] => 20240243039 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-18 [patent_title] => PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/098560 [patent_app_country] => US [patent_app_date] => 2023-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8710 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18098560 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/098560
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME Jan 17, 2023 Pending
Array ( [id] => 19285747 [patent_doc_number] => 20240222224 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-04 [patent_title] => SUBSTRATES OF SEMICONDUCTOR DEVICES FOR HEAT DISSIPATION [patent_app_type] => utility [patent_app_number] => 18/148404 [patent_app_country] => US [patent_app_date] => 2022-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5922 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18148404 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/148404
SUBSTRATES OF SEMICONDUCTOR DEVICES FOR HEAT DISSIPATION Dec 28, 2022 Pending
Array ( [id] => 18456299 [patent_doc_number] => 20230197581 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-22 [patent_title] => POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/084429 [patent_app_country] => US [patent_app_date] => 2022-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5688 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18084429 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/084429
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME Dec 18, 2022 Pending
Array ( [id] => 18661305 [patent_doc_number] => 20230307318 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-28 [patent_title] => SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF [patent_app_type] => utility [patent_app_number] => 18/066861 [patent_app_country] => US [patent_app_date] => 2022-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9670 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18066861 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/066861
SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF Dec 14, 2022 Pending
Array ( [id] => 18991261 [patent_doc_number] => 20240063230 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => DISPLAY PANEL AND ELECTRONIC TERMINAL [patent_app_type] => utility [patent_app_number] => 18/051051 [patent_app_country] => US [patent_app_date] => 2022-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7020 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18051051 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/051051
DISPLAY PANEL AND ELECTRONIC TERMINAL Oct 30, 2022 Pending
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