Gregory D. Thompson

Array ( [id] => 319704 [patent_doc_number] => 07522420 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-04-21 [patent_title] => 'Clip module and heat-dissipation device having the same' [patent_app_type] => utility [patent_app_number] => 11/950714 [patent_app_country] => US [patent_app_date] => 2007-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 3269 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 216 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/522/07522420.pdf [firstpage_image] =>[orig_patent_app_number] => 11950714 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 286511 [patent_doc_number] => 07551441 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-06-23 [patent_title] => 'Heat dissipation assembly for computing devices' [patent_app_type] => utility [patent_app_number] => 11/947182 [patent_app_country] => US [patent_app_date] => 2007-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2807 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/551/07551441.pdf [firstpage_image] =>[orig_patent_app_number] => 11947182 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6384140 [patent_doc_number] => 20100302728 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-12-02 [patent_title] => 'CHASSIS FOR INVERTER' [patent_app_type] => utility [patent_app_number] => 12/745002 [patent_app_country] => US [patent_app_date] => 2007-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5651 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0302/20100302728.pdf [firstpage_image] =>[orig_patent_app_number] => 12745002 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 233753 [patent_doc_number] => 07599186 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-10-06 [patent_title] => 'Heat conduction bus, particularly for a microprocessor-based computation unit' [patent_app_type] => utility [patent_app_number] => 11/944500 [patent_app_country] => US [patent_app_date] => 2007-11-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1602 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/599/07599186.pdf [firstpage_image] =>[orig_patent_app_number] => 11944500 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4831696 [patent_doc_number] => 20080130242 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-05 [patent_title] => 'USING THE WAVE SOLDERING PROCESS TO ATTACH MOTHERBOARD CHIPSET HEAT SINKS' [patent_app_type] => utility [patent_app_number] => 11/944201 [patent_app_country] => US [patent_app_date] => 2007-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2891 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0130/20080130242.pdf [firstpage_image] =>[orig_patent_app_number] => 11944201 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4831684 [patent_doc_number] => 20080130230 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-05 [patent_title] => 'Flat heat column and heat dissipating apparatus thereof' [patent_app_type] => utility [patent_app_number] => 11/984504 [patent_app_country] => US [patent_app_date] => 2007-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 2679 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0130/20080130230.pdf [firstpage_image] =>[orig_patent_app_number] => 11984504 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 237003 [patent_doc_number] => 07595986 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-09-29 [patent_title] => 'Controlling airflow in a computer chassis' [patent_app_type] => utility [patent_app_number] => 11/936104 [patent_app_country] => US [patent_app_date] => 2007-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2530 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/595/07595986.pdf [firstpage_image] =>[orig_patent_app_number] => 11936104 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4703127 [patent_doc_number] => 20080062650 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-13 [patent_title] => 'Thermal Management System and Method for Electronic Assemblies' [patent_app_type] => utility [patent_app_number] => 11/935496 [patent_app_country] => US [patent_app_date] => 2007-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1343 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0062/20080062650.pdf [firstpage_image] =>[orig_patent_app_number] => 11935496 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5263490 [patent_doc_number] => 20090116175 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-05-07 [patent_title] => 'ELECTRICAL ENCLOSURE AND SUPPORT ASSEMBLY THEREFOR' [patent_app_type] => utility [patent_app_number] => 11/934312 [patent_app_country] => US [patent_app_date] => 2007-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5089 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0116/20090116175.pdf [firstpage_image] =>[orig_patent_app_number] => 11934312 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 304570 [patent_doc_number] => 07535714 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2009-05-19 [patent_title] => 'Apparatus and method providing metallic thermal interface between metal capped module and heat sink' [patent_app_type] => utility [patent_app_number] => 11/931003 [patent_app_country] => US [patent_app_date] => 2007-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1272 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/535/07535714.pdf [firstpage_image] =>[orig_patent_app_number] => 11931003 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 300812 [patent_doc_number] => 07539018 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-05-26 [patent_title] => 'Heat sink retaining clip for an electrical connector assembly' [patent_app_type] => utility [patent_app_number] => 11/931600 [patent_app_country] => US [patent_app_date] => 2007-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 10 [patent_no_of_words] => 4738 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/539/07539018.pdf [firstpage_image] =>[orig_patent_app_number] => 11931600 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 124132 [patent_doc_number] => 07710724 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-05-04 [patent_title] => 'Electronic apparatus' [patent_app_type] => utility [patent_app_number] => 11/874010 [patent_app_country] => US [patent_app_date] => 2007-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 10 [patent_no_of_words] => 4508 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/710/07710724.pdf [firstpage_image] =>[orig_patent_app_number] => 11874010 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5506951 [patent_doc_number] => 20090080158 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-03-26 [patent_title] => 'Comb-shaped power bus bar assembly structure having integrated capacitors' [patent_app_type] => utility [patent_app_number] => 11/975011 [patent_app_country] => US [patent_app_date] => 2007-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 8291 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0080/20090080158.pdf [firstpage_image] =>[orig_patent_app_number] => 11975011 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 24562 [patent_doc_number] => 07800905 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2010-09-21 [patent_title] => 'Flat vapor chamber apparatus and method for transferring heat between integrated circuits' [patent_app_type] => utility [patent_app_number] => 11/873217 [patent_app_country] => US [patent_app_date] => 2007-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3156 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/800/07800905.pdf [firstpage_image] =>[orig_patent_app_number] => 11873217 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 253625 [patent_doc_number] => 07580265 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-08-25 [patent_title] => 'Heat sink, circuit board, and electronic apparatus' [patent_app_type] => utility [patent_app_number] => 11/907615 [patent_app_country] => US [patent_app_date] => 2007-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 5283 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/580/07580265.pdf [firstpage_image] =>[orig_patent_app_number] => 11907615 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7600892 [patent_doc_number] => 07385817 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-06-10 [patent_title] => 'Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled' [patent_app_type] => utility [patent_app_number] => 11/871334 [patent_app_country] => US [patent_app_date] => 2007-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5339 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 494 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/385/07385817.pdf [firstpage_image] =>[orig_patent_app_number] => 11871334 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 830997 [patent_doc_number] => 07400504 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-07-15 [patent_title] => 'Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled' [patent_app_type] => utility [patent_app_number] => 11/870667 [patent_app_country] => US [patent_app_date] => 2007-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 17 [patent_no_of_words] => 6272 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/400/07400504.pdf [firstpage_image] =>[orig_patent_app_number] => 11870667 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 338924 [patent_doc_number] => 07505269 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2009-03-17 [patent_title] => 'Thermal energy storage transfer system' [patent_app_type] => utility [patent_app_number] => 11/870702 [patent_app_country] => US [patent_app_date] => 2007-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 3222 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/505/07505269.pdf [firstpage_image] =>[orig_patent_app_number] => 11870702 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 353573 [patent_doc_number] => 07492599 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2009-02-17 [patent_title] => 'Heat sink for LED lamp' [patent_app_type] => utility [patent_app_number] => 11/870116 [patent_app_country] => US [patent_app_date] => 2007-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1536 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/492/07492599.pdf [firstpage_image] =>[orig_patent_app_number] => 11870116 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 374227 [patent_doc_number] => 07474533 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-06 [patent_title] => 'Cooling device capable of reducing thickness of electronic apparatus' [patent_app_type] => utility [patent_app_number] => 11/905895 [patent_app_country] => US [patent_app_date] => 2007-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 8 [patent_no_of_words] => 4273 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/474/07474533.pdf [firstpage_image] =>[orig_patent_app_number] => 11905895 [rel_patent_id] =>[rel_patent_doc_number] =>)