Ha Dinh Ho

Array ( [id] => 4067927 [patent_doc_number] => 05895966 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-04-20 [patent_title] => 'Integrated circuit and supply decoupling capacitor therefor' [patent_app_type] => 1 [patent_app_number] => 8/975736 [patent_app_country] => US [patent_app_date] => 1997-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 2517 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/895/05895966.pdf [firstpage_image] =>[orig_patent_app_number] => 975736 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3831136 [patent_doc_number] => 05783862 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-07-21 [patent_title] => 'Electrically conductive thermal interface' [patent_app_type] => 1 [patent_app_number] => 8/938282 [patent_app_country] => US [patent_app_date] => 1997-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1671 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/783/05783862.pdf [firstpage_image] =>[orig_patent_app_number] => 938282 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3788770 [patent_doc_number] => 05821613 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-13 [patent_title] => 'Semiconductor device in which semiconductor chip has bottom surface with reduced level of organic compounds relatively to other sufaces thereof' [patent_app_type] => 1 [patent_app_number] => 8/919170 [patent_app_country] => US [patent_app_date] => 1997-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 11 [patent_no_of_words] => 3729 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/821/05821613.pdf [firstpage_image] =>[orig_patent_app_number] => 919170 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3767015 [patent_doc_number] => 05844313 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-01 [patent_title] => 'Heat sink' [patent_app_type] => 1 [patent_app_number] => 8/880242 [patent_app_country] => US [patent_app_date] => 1997-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 2806 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/844/05844313.pdf [firstpage_image] =>[orig_patent_app_number] => 880242 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3896378 [patent_doc_number] => 05834839 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-10 [patent_title] => 'Preserving clearance between encapsulant and PCB for cavity-down single-tier package assembly' [patent_app_type] => 1 [patent_app_number] => 8/861884 [patent_app_country] => US [patent_app_date] => 1997-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 5 [patent_no_of_words] => 2679 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/834/05834839.pdf [firstpage_image] =>[orig_patent_app_number] => 861884 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3865975 [patent_doc_number] => 05796159 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-18 [patent_title] => 'Thermally efficient integrated circuit package' [patent_app_type] => 1 [patent_app_number] => 8/854724 [patent_app_country] => US [patent_app_date] => 1997-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2847 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/796/05796159.pdf [firstpage_image] =>[orig_patent_app_number] => 854724 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3766847 [patent_doc_number] => 05844302 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-01 [patent_title] => 'Integrated semiconductor circuit with capacitors of precisely defined capacitance and process for producing the circuit' [patent_app_type] => 1 [patent_app_number] => 8/847867 [patent_app_country] => US [patent_app_date] => 1997-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2762 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/844/05844302.pdf [firstpage_image] =>[orig_patent_app_number] => 847867 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3874864 [patent_doc_number] => 05838071 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-17 [patent_title] => 'Wire bonding method, wire bonding apparatus and semiconductor device produced by the same' [patent_app_type] => 1 [patent_app_number] => 8/835802 [patent_app_country] => US [patent_app_date] => 1997-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 80 [patent_no_of_words] => 5036 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/838/05838071.pdf [firstpage_image] =>[orig_patent_app_number] => 835802 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3865988 [patent_doc_number] => 05796160 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-18 [patent_title] => 'Resin-sealed semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/829122 [patent_app_country] => US [patent_app_date] => 1997-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 3765 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/796/05796160.pdf [firstpage_image] =>[orig_patent_app_number] => 829122 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3782304 [patent_doc_number] => 05818103 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-06 [patent_title] => 'Semiconductor device mounted on a grooved head frame' [patent_app_type] => 1 [patent_app_number] => 8/828336 [patent_app_country] => US [patent_app_date] => 1997-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 1029 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/818/05818103.pdf [firstpage_image] =>[orig_patent_app_number] => 828336 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3874836 [patent_doc_number] => 05838069 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-17 [patent_title] => 'Ceramic substrate having pads to be attached to terminal members with Pb-Sn solder and method of producing the same' [patent_app_type] => 1 [patent_app_number] => 8/827314 [patent_app_country] => US [patent_app_date] => 1997-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 7907 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/838/05838069.pdf [firstpage_image] =>[orig_patent_app_number] => 827314 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3964681 [patent_doc_number] => 05900670 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-05-04 [patent_title] => 'Stackable heatsink structures for semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 8/820949 [patent_app_country] => US [patent_app_date] => 1997-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 4356 [patent_no_of_claims] => 54 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/900/05900670.pdf [firstpage_image] =>[orig_patent_app_number] => 820949 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3896342 [patent_doc_number] => 05834836 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-10 [patent_title] => 'Multi-layer bottom lead package' [patent_app_type] => 1 [patent_app_number] => 8/812612 [patent_app_country] => US [patent_app_date] => 1997-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 10 [patent_no_of_words] => 3241 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/834/05834836.pdf [firstpage_image] =>[orig_patent_app_number] => 812612 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3882889 [patent_doc_number] => 05804874 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-08 [patent_title] => 'Stacked chip package device employing a plurality of lead on chip type semiconductor chips' [patent_app_type] => 1 [patent_app_number] => 8/811150 [patent_app_country] => US [patent_app_date] => 1997-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 2298 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 259 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/804/05804874.pdf [firstpage_image] =>[orig_patent_app_number] => 811150 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3776187 [patent_doc_number] => 05773882 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-06-30 [patent_title] => 'Seminconductor package' [patent_app_type] => 1 [patent_app_number] => 8/802947 [patent_app_country] => US [patent_app_date] => 1997-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 4575 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 185 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/773/05773882.pdf [firstpage_image] =>[orig_patent_app_number] => 802947 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3882862 [patent_doc_number] => 05804872 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-08 [patent_title] => 'Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof' [patent_app_type] => 1 [patent_app_number] => 8/795791 [patent_app_country] => US [patent_app_date] => 1997-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 31 [patent_no_of_words] => 5068 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/804/05804872.pdf [firstpage_image] =>[orig_patent_app_number] => 795791 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3767001 [patent_doc_number] => 05844312 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-01 [patent_title] => 'Solderable transistor clip and heat sink' [patent_app_type] => 1 [patent_app_number] => 8/786408 [patent_app_country] => US [patent_app_date] => 1997-01-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 1369 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/844/05844312.pdf [firstpage_image] =>[orig_patent_app_number] => 786408 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3788688 [patent_doc_number] => 05821607 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-13 [patent_title] => 'Frame for manufacturing encapsulated semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 8/780228 [patent_app_country] => US [patent_app_date] => 1997-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1125 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 175 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/821/05821607.pdf [firstpage_image] =>[orig_patent_app_number] => 780228 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3837042 [patent_doc_number] => 05814870 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-29 [patent_title] => 'Semiconductor component' [patent_app_type] => 1 [patent_app_number] => 8/779366 [patent_app_country] => US [patent_app_date] => 1997-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 4061 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/814/05814870.pdf [firstpage_image] =>[orig_patent_app_number] => 779366 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3837196 [patent_doc_number] => 05814881 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-09-29 [patent_title] => 'Stacked integrated chip package and method of making same' [patent_app_type] => 1 [patent_app_number] => 8/770872 [patent_app_country] => US [patent_app_date] => 1996-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2563 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/814/05814881.pdf [firstpage_image] =>[orig_patent_app_number] => 770872 [rel_patent_id] =>[rel_patent_doc_number] =>)