Search

Ha Dinh Ho

Examiner (ID: 9897)

Most Active Art Unit
3681
Art Unit(s)
3658, 3655, 3681, 3618
Total Applications
2226
Issued Applications
1927
Pending Applications
80
Abandoned Applications
198

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3077324 [patent_doc_number] => 05365109 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-11-15 [patent_title] => 'MIS semiconductor device with polysilicon gate electrode' [patent_app_type] => 1 [patent_app_number] => 7/928878 [patent_app_country] => US [patent_app_date] => 1992-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1841 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/365/05365109.pdf [firstpage_image] =>[orig_patent_app_number] => 928878 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/928878
MIS semiconductor device with polysilicon gate electrode Aug 10, 1992 Issued
07/920482 METHOD AND DEVICE FOR INTERCONNECTING INTEGRATED CIRCUITS IN THREE DIMENSIONS Aug 5, 1992 Abandoned
Array ( [id] => 2967751 [patent_doc_number] => 05264729 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-11-23 [patent_title] => 'Semiconductor package having programmable interconnect' [patent_app_type] => 1 [patent_app_number] => 7/921806 [patent_app_country] => US [patent_app_date] => 1992-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3084 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 262 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/264/05264729.pdf [firstpage_image] =>[orig_patent_app_number] => 921806 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/921806
Semiconductor package having programmable interconnect Jul 28, 1992 Issued
07/920168 PLASTIC MOLD TYPE SEMICONDUCTOR DEVICE Jul 26, 1992 Abandoned
Array ( [id] => 2981161 [patent_doc_number] => 05256901 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-10-26 [patent_title] => 'Ceramic package for memory semiconductor' [patent_app_type] => 1 [patent_app_number] => 7/915404 [patent_app_country] => US [patent_app_date] => 1992-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 2119 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/256/05256901.pdf [firstpage_image] =>[orig_patent_app_number] => 915404 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/915404
Ceramic package for memory semiconductor Jul 19, 1992 Issued
Array ( [id] => 3090559 [patent_doc_number] => 05285105 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-02-08 [patent_title] => 'Semiconductor die packages having lead support frame' [patent_app_type] => 1 [patent_app_number] => 7/912030 [patent_app_country] => US [patent_app_date] => 1992-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 36 [patent_no_of_words] => 3129 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/285/05285105.pdf [firstpage_image] =>[orig_patent_app_number] => 912030 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/912030
Semiconductor die packages having lead support frame Jul 8, 1992 Issued
Array ( [id] => 2896750 [patent_doc_number] => 05270572 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-12-14 [patent_title] => 'Liquid impingement cooling module for semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 7/903458 [patent_app_country] => US [patent_app_date] => 1992-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 17 [patent_no_of_words] => 7562 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/270/05270572.pdf [firstpage_image] =>[orig_patent_app_number] => 903458 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/903458
Liquid impingement cooling module for semiconductor devices Jun 23, 1992 Issued
Array ( [id] => 3055036 [patent_doc_number] => 05283467 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-02-01 [patent_title] => 'Heat sink mounting system for semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 7/894678 [patent_app_country] => US [patent_app_date] => 1992-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2461 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 173 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/283/05283467.pdf [firstpage_image] =>[orig_patent_app_number] => 894678 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/894678
Heat sink mounting system for semiconductor devices Jun 4, 1992 Issued
Array ( [id] => 3049700 [patent_doc_number] => 05287001 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-02-15 [patent_title] => 'Cooling structures and package modules for semiconductors' [patent_app_type] => 1 [patent_app_number] => 7/874246 [patent_app_country] => US [patent_app_date] => 1992-04-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 5559 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 249 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/287/05287001.pdf [firstpage_image] =>[orig_patent_app_number] => 874246 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/874246
Cooling structures and package modules for semiconductors Apr 23, 1992 Issued
Array ( [id] => 2981016 [patent_doc_number] => 05256895 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-10-26 [patent_title] => 'Pad oxide protect sealed interface isolation' [patent_app_type] => 1 [patent_app_number] => 7/863519 [patent_app_country] => US [patent_app_date] => 1992-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 1822 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/256/05256895.pdf [firstpage_image] =>[orig_patent_app_number] => 863519 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/863519
Pad oxide protect sealed interface isolation Mar 30, 1992 Issued
Array ( [id] => 3080013 [patent_doc_number] => 05296739 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-03-22 [patent_title] => 'Circuit arrangement with a cooling member' [patent_app_type] => 1 [patent_app_number] => 7/861186 [patent_app_country] => US [patent_app_date] => 1992-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4436 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/296/05296739.pdf [firstpage_image] =>[orig_patent_app_number] => 861186 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/861186
Circuit arrangement with a cooling member Mar 30, 1992 Issued
Array ( [id] => 3100181 [patent_doc_number] => 05291178 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-03-01 [patent_title] => 'Film-type resistor assembly with full encapsulation except at the bottom surface' [patent_app_type] => 1 [patent_app_number] => 7/852580 [patent_app_country] => US [patent_app_date] => 1992-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 7 [patent_no_of_words] => 2923 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/291/05291178.pdf [firstpage_image] =>[orig_patent_app_number] => 852580 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/852580
Film-type resistor assembly with full encapsulation except at the bottom surface Mar 16, 1992 Issued
Array ( [id] => 2883514 [patent_doc_number] => RE034269 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-06-01 [patent_title] => 'Semiconductor integrated circuit packages' [patent_app_type] => 2 [patent_app_number] => 7/837573 [patent_app_country] => US [patent_app_date] => 1992-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1225 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/034/RE034269.pdf [firstpage_image] =>[orig_patent_app_number] => 837573 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/837573
Semiconductor integrated circuit packages Feb 17, 1992 Issued
Array ( [id] => 3068744 [patent_doc_number] => 05311059 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-05-10 [patent_title] => 'Backplane grounding for flip-chip integrated circuit' [patent_app_type] => 1 [patent_app_number] => 7/825367 [patent_app_country] => US [patent_app_date] => 1992-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1798 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/311/05311059.pdf [firstpage_image] =>[orig_patent_app_number] => 825367 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/825367
Backplane grounding for flip-chip integrated circuit Jan 23, 1992 Issued
07/817972 DEVICE PACKAGING USING HEAT SPREADERS AND ASSISTED DEPOSITION OF WIRE BONDS Jan 5, 1992 Abandoned
Array ( [id] => 2898903 [patent_doc_number] => 05272375 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-12-21 [patent_title] => 'Electronic assembly with optimum heat dissipation' [patent_app_type] => 1 [patent_app_number] => 7/814024 [patent_app_country] => US [patent_app_date] => 1991-12-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 4720 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 303 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/272/05272375.pdf [firstpage_image] =>[orig_patent_app_number] => 814024 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/814024
Electronic assembly with optimum heat dissipation Dec 25, 1991 Issued
Array ( [id] => 3098065 [patent_doc_number] => 05291063 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-03-01 [patent_title] => 'High-power RF device with heat spreader bushing' [patent_app_type] => 1 [patent_app_number] => 7/812694 [patent_app_country] => US [patent_app_date] => 1991-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 2474 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/291/05291063.pdf [firstpage_image] =>[orig_patent_app_number] => 812694 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/812694
High-power RF device with heat spreader bushing Dec 22, 1991 Issued
07/807687 NARROW CHANNEL FINNED HEAT SINKING FOR COOLING HIGH POWER ELECTRONIC COMPONENTS Dec 15, 1991 Abandoned
Array ( [id] => 3070151 [patent_doc_number] => 05294831 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-03-15 [patent_title] => 'Circuit pack layout with improved dissipation of heat produced by high power electronic components' [patent_app_type] => 1 [patent_app_number] => 7/807688 [patent_app_country] => US [patent_app_date] => 1991-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 17 [patent_no_of_words] => 7017 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 214 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/294/05294831.pdf [firstpage_image] =>[orig_patent_app_number] => 807688 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/807688
Circuit pack layout with improved dissipation of heat produced by high power electronic components Dec 15, 1991 Issued
Array ( [id] => 3101371 [patent_doc_number] => 05319244 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-06-07 [patent_title] => 'Triazine thin film adhesives' [patent_app_type] => 1 [patent_app_number] => 7/806410 [patent_app_country] => US [patent_app_date] => 1991-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 5729 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/319/05319244.pdf [firstpage_image] =>[orig_patent_app_number] => 806410 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/806410
Triazine thin film adhesives Dec 12, 1991 Issued
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