Application number | Title of the application | Filing Date | Status |
---|
Array
(
[id] => 3077324
[patent_doc_number] => 05365109
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-11-15
[patent_title] => 'MIS semiconductor device with polysilicon gate electrode'
[patent_app_type] => 1
[patent_app_number] => 7/928878
[patent_app_country] => US
[patent_app_date] => 1992-08-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 1841
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[pdf_file] => patents/05/365/05365109.pdf
[firstpage_image] =>[orig_patent_app_number] => 928878
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/928878 | MIS semiconductor device with polysilicon gate electrode | Aug 10, 1992 | Issued |
07/920482 | METHOD AND DEVICE FOR INTERCONNECTING INTEGRATED CIRCUITS IN THREE DIMENSIONS | Aug 5, 1992 | Abandoned |
Array
(
[id] => 2967751
[patent_doc_number] => 05264729
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-11-23
[patent_title] => 'Semiconductor package having programmable interconnect'
[patent_app_type] => 1
[patent_app_number] => 7/921806
[patent_app_country] => US
[patent_app_date] => 1992-07-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 3084
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[patent_words_short_claim] => 262
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/264/05264729.pdf
[firstpage_image] =>[orig_patent_app_number] => 921806
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/921806 | Semiconductor package having programmable interconnect | Jul 28, 1992 | Issued |
07/920168 | PLASTIC MOLD TYPE SEMICONDUCTOR DEVICE | Jul 26, 1992 | Abandoned |
Array
(
[id] => 2981161
[patent_doc_number] => 05256901
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-26
[patent_title] => 'Ceramic package for memory semiconductor'
[patent_app_type] => 1
[patent_app_number] => 7/915404
[patent_app_country] => US
[patent_app_date] => 1992-07-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 2119
[patent_no_of_claims] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/256/05256901.pdf
[firstpage_image] =>[orig_patent_app_number] => 915404
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/915404 | Ceramic package for memory semiconductor | Jul 19, 1992 | Issued |
Array
(
[id] => 3090559
[patent_doc_number] => 05285105
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-02-08
[patent_title] => 'Semiconductor die packages having lead support frame'
[patent_app_type] => 1
[patent_app_number] => 7/912030
[patent_app_country] => US
[patent_app_date] => 1992-07-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 36
[patent_no_of_words] => 3129
[patent_no_of_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/285/05285105.pdf
[firstpage_image] =>[orig_patent_app_number] => 912030
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/912030 | Semiconductor die packages having lead support frame | Jul 8, 1992 | Issued |
Array
(
[id] => 2896750
[patent_doc_number] => 05270572
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-12-14
[patent_title] => 'Liquid impingement cooling module for semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 7/903458
[patent_app_country] => US
[patent_app_date] => 1992-06-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 17
[patent_no_of_words] => 7562
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 200
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/270/05270572.pdf
[firstpage_image] =>[orig_patent_app_number] => 903458
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/903458 | Liquid impingement cooling module for semiconductor devices | Jun 23, 1992 | Issued |
Array
(
[id] => 3055036
[patent_doc_number] => 05283467
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-02-01
[patent_title] => 'Heat sink mounting system for semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 7/894678
[patent_app_country] => US
[patent_app_date] => 1992-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2461
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/283/05283467.pdf
[firstpage_image] =>[orig_patent_app_number] => 894678
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/894678 | Heat sink mounting system for semiconductor devices | Jun 4, 1992 | Issued |
Array
(
[id] => 3049700
[patent_doc_number] => 05287001
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-02-15
[patent_title] => 'Cooling structures and package modules for semiconductors'
[patent_app_type] => 1
[patent_app_number] => 7/874246
[patent_app_country] => US
[patent_app_date] => 1992-04-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 5559
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 249
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/287/05287001.pdf
[firstpage_image] =>[orig_patent_app_number] => 874246
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/874246 | Cooling structures and package modules for semiconductors | Apr 23, 1992 | Issued |
Array
(
[id] => 2981016
[patent_doc_number] => 05256895
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-26
[patent_title] => 'Pad oxide protect sealed interface isolation'
[patent_app_type] => 1
[patent_app_number] => 7/863519
[patent_app_country] => US
[patent_app_date] => 1992-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 12
[patent_no_of_words] => 1822
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/256/05256895.pdf
[firstpage_image] =>[orig_patent_app_number] => 863519
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/863519 | Pad oxide protect sealed interface isolation | Mar 30, 1992 | Issued |
Array
(
[id] => 3080013
[patent_doc_number] => 05296739
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-03-22
[patent_title] => 'Circuit arrangement with a cooling member'
[patent_app_type] => 1
[patent_app_number] => 7/861186
[patent_app_country] => US
[patent_app_date] => 1992-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4436
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 187
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/296/05296739.pdf
[firstpage_image] =>[orig_patent_app_number] => 861186
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/861186 | Circuit arrangement with a cooling member | Mar 30, 1992 | Issued |
Array
(
[id] => 3100181
[patent_doc_number] => 05291178
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-03-01
[patent_title] => 'Film-type resistor assembly with full encapsulation except at the bottom surface'
[patent_app_type] => 1
[patent_app_number] => 7/852580
[patent_app_country] => US
[patent_app_date] => 1992-03-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 7
[patent_no_of_words] => 2923
[patent_no_of_claims] => 32
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/291/05291178.pdf
[firstpage_image] =>[orig_patent_app_number] => 852580
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/852580 | Film-type resistor assembly with full encapsulation except at the bottom surface | Mar 16, 1992 | Issued |
Array
(
[id] => 2883514
[patent_doc_number] => RE034269
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-06-01
[patent_title] => 'Semiconductor integrated circuit packages'
[patent_app_type] => 2
[patent_app_number] => 7/837573
[patent_app_country] => US
[patent_app_date] => 1992-02-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 1225
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/RE/034/RE034269.pdf
[firstpage_image] =>[orig_patent_app_number] => 837573
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/837573 | Semiconductor integrated circuit packages | Feb 17, 1992 | Issued |
Array
(
[id] => 3068744
[patent_doc_number] => 05311059
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-05-10
[patent_title] => 'Backplane grounding for flip-chip integrated circuit'
[patent_app_type] => 1
[patent_app_number] => 7/825367
[patent_app_country] => US
[patent_app_date] => 1992-01-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 1798
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/311/05311059.pdf
[firstpage_image] =>[orig_patent_app_number] => 825367
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/825367 | Backplane grounding for flip-chip integrated circuit | Jan 23, 1992 | Issued |
07/817972 | DEVICE PACKAGING USING HEAT SPREADERS AND ASSISTED DEPOSITION OF WIRE BONDS | Jan 5, 1992 | Abandoned |
Array
(
[id] => 2898903
[patent_doc_number] => 05272375
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-12-21
[patent_title] => 'Electronic assembly with optimum heat dissipation'
[patent_app_type] => 1
[patent_app_number] => 7/814024
[patent_app_country] => US
[patent_app_date] => 1991-12-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/272/05272375.pdf
[firstpage_image] =>[orig_patent_app_number] => 814024
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/814024 | Electronic assembly with optimum heat dissipation | Dec 25, 1991 | Issued |
Array
(
[id] => 3098065
[patent_doc_number] => 05291063
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-03-01
[patent_title] => 'High-power RF device with heat spreader bushing'
[patent_app_type] => 1
[patent_app_number] => 7/812694
[patent_app_country] => US
[patent_app_date] => 1991-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 2474
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/291/05291063.pdf
[firstpage_image] =>[orig_patent_app_number] => 812694
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/812694 | High-power RF device with heat spreader bushing | Dec 22, 1991 | Issued |
07/807687 | NARROW CHANNEL FINNED HEAT SINKING FOR COOLING HIGH POWER ELECTRONIC COMPONENTS | Dec 15, 1991 | Abandoned |
Array
(
[id] => 3070151
[patent_doc_number] => 05294831
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-03-15
[patent_title] => 'Circuit pack layout with improved dissipation of heat produced by high power electronic components'
[patent_app_type] => 1
[patent_app_number] => 7/807688
[patent_app_country] => US
[patent_app_date] => 1991-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[patent_no_of_words] => 7017
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[patent_no_of_ind_claims] => 2
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/294/05294831.pdf
[firstpage_image] =>[orig_patent_app_number] => 807688
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/807688 | Circuit pack layout with improved dissipation of heat produced by high power electronic components | Dec 15, 1991 | Issued |
Array
(
[id] => 3101371
[patent_doc_number] => 05319244
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-06-07
[patent_title] => 'Triazine thin film adhesives'
[patent_app_type] => 1
[patent_app_number] => 7/806410
[patent_app_country] => US
[patent_app_date] => 1991-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 5729
[patent_no_of_claims] => 16
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/319/05319244.pdf
[firstpage_image] =>[orig_patent_app_number] => 806410
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/806410 | Triazine thin film adhesives | Dec 12, 1991 | Issued |