Application number | Title of the application | Filing Date | Status |
---|
07/798998 | ELECTRICALLY INSULATED HEAT PIPE TYPE COOLING APPARATUS FOR SEMICONDUCTOR | Dec 1, 1991 | Abandoned |
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[patent_issue_date] => 1993-11-16
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Array
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[patent_issue_date] => 1993-12-14
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07/783613 | HIGH PERFORMANCE SUBSTRATE, ELECTRONIC PACKAGE AND INTEGRATED CIRCUIT COOLING PROCESS | Oct 24, 1991 | Abandoned |
07/780172 | INTEGRATED CIRCUIT PACKAGE FOR FLEXIBLE COMPUTER SYSTEM ALTERNATIVE ARCHITECTURES | Oct 20, 1991 | Abandoned |
Array
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[id] => 2938666
[patent_doc_number] => 05229622
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[patent_kind] => NA
[patent_issue_date] => 1993-07-20
[patent_title] => 'Integrated semiconductor optoelectronic switch'
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[patent_app_number] => 7/814058
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07/775084 | LIQUID COOLING SYSTEM FOR LSI PACKAGES | Oct 10, 1991 | Abandoned |
Array
(
[id] => 2911850
[patent_doc_number] => 05216281
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-06-01
[patent_title] => 'Self sealed aligned contact incorporating a dopant source'
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07/748216 | INTERCONNECTION STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR | Aug 21, 1991 | Abandoned |
Array
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[patent_kind] => NA
[patent_issue_date] => 1993-08-24
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Array
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-26
[patent_title] => 'Metal heatsink attach system'
[patent_app_type] => 1
[patent_app_number] => 7/744862
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 744862
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/744862 | Metal heatsink attach system | Aug 13, 1991 | Issued |
Array
(
[id] => 2982950
[patent_doc_number] => 05252857
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-12
[patent_title] => 'Stacked DCA memory chips'
[patent_app_type] => 1
[patent_app_number] => 7/740344
[patent_app_country] => US
[patent_app_date] => 1991-08-05
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 07/740344 | Stacked DCA memory chips | Aug 4, 1991 | Issued |
Array
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[patent_kind] => NA
[patent_issue_date] => 1992-06-30
[patent_title] => 'Supply pin rearrangement for an I.C.'
[patent_app_type] => 1
[patent_app_number] => 7/739625
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[rel_patent_id] =>[rel_patent_doc_number] =>) 07/739625 | Supply pin rearrangement for an I.C. | Aug 1, 1991 | Issued |
Array
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[patent_kind] => NA
[patent_issue_date] => 1993-10-05
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Array
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-06-01
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[patent_app_type] => 1
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[pdf_file] => patents/05/216/05216279.pdf
[firstpage_image] =>[orig_patent_app_number] => 736230
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/736230 | Power semiconductor device suitable for automation of production | Jul 25, 1991 | Issued |
Array
(
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[patent_issue_date] => 1997-05-20
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Array
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[patent_issue_date] => 1993-12-28
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Array
(
[id] => 2926361
[patent_doc_number] => 05200641
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-04-06
[patent_title] => 'Semiconductor device structure including bending-resistant radiating layer'
[patent_app_type] => 1
[patent_app_number] => 7/724788
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[patent_app_date] => 1991-07-02
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[rel_patent_id] =>[rel_patent_doc_number] =>) 07/724788 | Semiconductor device structure including bending-resistant radiating layer | Jul 1, 1991 | Issued |
07/719900 | SINGLE EVENT UPSET HARDENED MEMORY CELL | Jun 23, 1991 | Abandoned |