Application number | Title of the application | Filing Date | Status |
---|
Array
(
[id] => 2935879
[patent_doc_number] => 05260264
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-11-09
[patent_title] => 'Josephson memory circuit'
[patent_app_type] => 1
[patent_app_number] => 7/663456
[patent_app_country] => US
[patent_app_date] => 1991-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 10244
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 409
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/260/05260264.pdf
[firstpage_image] =>[orig_patent_app_number] => 663456
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/663456 | Josephson memory circuit | Mar 3, 1991 | Issued |
Array
(
[id] => 2954771
[patent_doc_number] => 05221859
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-06-22
[patent_title] => 'Lead frame for semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/660944
[patent_app_country] => US
[patent_app_date] => 1991-02-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 12
[patent_no_of_words] => 6557
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 52
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/221/05221859.pdf
[firstpage_image] =>[orig_patent_app_number] => 660944
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/660944 | Lead frame for semiconductor device | Feb 25, 1991 | Issued |
Array
(
[id] => 2926732
[patent_doc_number] => 05192995
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-03-09
[patent_title] => 'Electric device utilizing antioxidation film between base pad for semiconductor chip and organic encapsulating material'
[patent_app_type] => 1
[patent_app_number] => 7/655032
[patent_app_country] => US
[patent_app_date] => 1991-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 2016
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 76
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/192/05192995.pdf
[firstpage_image] =>[orig_patent_app_number] => 655032
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/655032 | Electric device utilizing antioxidation film between base pad for semiconductor chip and organic encapsulating material | Feb 13, 1991 | Issued |
Array
(
[id] => 2814267
[patent_doc_number] => 05157480
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-10-20
[patent_title] => 'Semiconductor device having dual electrical contact sites'
[patent_app_type] => 1
[patent_app_number] => 7/651166
[patent_app_country] => US
[patent_app_date] => 1991-02-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 3738
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/157/05157480.pdf
[firstpage_image] =>[orig_patent_app_number] => 651166
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/651166 | Semiconductor device having dual electrical contact sites | Feb 5, 1991 | Issued |
07/653362 | SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING DEFORMATION ABSORBING MEMBER | Feb 5, 1991 | Abandoned |
Array
(
[id] => 2794606
[patent_doc_number] => 05155579
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-10-13
[patent_title] => 'Molded heat sink for integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 7/650626
[patent_app_country] => US
[patent_app_date] => 1991-02-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 4109
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/155/05155579.pdf
[firstpage_image] =>[orig_patent_app_number] => 650626
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/650626 | Molded heat sink for integrated circuit package | Feb 4, 1991 | Issued |
Array
(
[id] => 3538114
[patent_doc_number] => 05557142
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1996-09-17
[patent_title] => 'Shielded semiconductor device package'
[patent_app_type] => 1
[patent_app_number] => 7/650326
[patent_app_country] => US
[patent_app_date] => 1991-02-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 1758
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 74
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/557/05557142.pdf
[firstpage_image] =>[orig_patent_app_number] => 650326
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/650326 | Shielded semiconductor device package | Feb 3, 1991 | Issued |
07/647508 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Jan 28, 1991 | Abandoned |
Array
(
[id] => 2783522
[patent_doc_number] => 05151771
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-09-29
[patent_title] => 'High lead count circuit board for connecting electronic components to an external circuit'
[patent_app_type] => 1
[patent_app_number] => 7/646355
[patent_app_country] => US
[patent_app_date] => 1991-01-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 16
[patent_no_of_words] => 3546
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 139
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/151/05151771.pdf
[firstpage_image] =>[orig_patent_app_number] => 646355
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/646355 | High lead count circuit board for connecting electronic components to an external circuit | Jan 27, 1991 | Issued |
Array
(
[id] => 2782790
[patent_doc_number] => 05132777
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-07-21
[patent_title] => 'Cooled high-power semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/645510
[patent_app_country] => US
[patent_app_date] => 1991-01-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 1867
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 190
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/132/05132777.pdf
[firstpage_image] =>[orig_patent_app_number] => 645510
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/645510 | Cooled high-power semiconductor device | Jan 23, 1991 | Issued |
Array
(
[id] => 2979508
[patent_doc_number] => 05208467
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-05-04
[patent_title] => 'Semiconductor device having a film-covered packaged component'
[patent_app_type] => 1
[patent_app_number] => 7/640560
[patent_app_country] => US
[patent_app_date] => 1991-01-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 2822
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/208/05208467.pdf
[firstpage_image] =>[orig_patent_app_number] => 640560
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/640560 | Semiconductor device having a film-covered packaged component | Jan 13, 1991 | Issued |
07/633162 | SUPPLY PIN REARRANGEMENT FOR AN I.C. | Dec 25, 1990 | Abandoned |
Array
(
[id] => 2793862
[patent_doc_number] => 05130768
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-07-14
[patent_title] => 'Compact, high-density packaging apparatus for high performance semiconductor devices'
[patent_app_type] => 1
[patent_app_number] => 7/624034
[patent_app_country] => US
[patent_app_date] => 1990-12-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4917
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 231
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/130/05130768.pdf
[firstpage_image] =>[orig_patent_app_number] => 624034
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/624034 | Compact, high-density packaging apparatus for high performance semiconductor devices | Dec 6, 1990 | Issued |
Array
(
[id] => 2989680
[patent_doc_number] => 05250845
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-05
[patent_title] => 'Totally enclosed hermetic electronic module'
[patent_app_type] => 1
[patent_app_number] => 7/621182
[patent_app_country] => US
[patent_app_date] => 1990-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 2757
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 185
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/250/05250845.pdf
[firstpage_image] =>[orig_patent_app_number] => 621182
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/621182 | Totally enclosed hermetic electronic module | Nov 29, 1990 | Issued |
Array
(
[id] => 2828564
[patent_doc_number] => 05173765
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-12-22
[patent_title] => 'Conductive adhesive and article made therewith'
[patent_app_type] => 1
[patent_app_number] => 7/619842
[patent_app_country] => US
[patent_app_date] => 1990-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 4312
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 50
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/173/05173765.pdf
[firstpage_image] =>[orig_patent_app_number] => 619842
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/619842 | Conductive adhesive and article made therewith | Nov 28, 1990 | Issued |
07/618896 | PLASTIC MOLD TYPE SEMICONDUCTOR DEVICE | Nov 27, 1990 | Abandoned |
Array
(
[id] => 3118120
[patent_doc_number] => 05396104
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-03-07
[patent_title] => 'Resin coated bonding wire, method of manufacturing the same, and semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/613700
[patent_app_country] => US
[patent_app_date] => 1990-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 6781
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 125
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/396/05396104.pdf
[firstpage_image] =>[orig_patent_app_number] => 613700
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/613700 | Resin coated bonding wire, method of manufacturing the same, and semiconductor device | Nov 18, 1990 | Issued |
Array
(
[id] => 2903019
[patent_doc_number] => 05184207
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-02-02
[patent_title] => 'Semiconductor die packages having lead support frame'
[patent_app_type] => 1
[patent_app_number] => 7/609088
[patent_app_country] => US
[patent_app_date] => 1990-10-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 36
[patent_no_of_words] => 3129
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 26
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/184/05184207.pdf
[firstpage_image] =>[orig_patent_app_number] => 609088
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/609088 | Semiconductor die packages having lead support frame | Oct 30, 1990 | Issued |
Array
(
[id] => 2885987
[patent_doc_number] => 05119174
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-06-02
[patent_title] => 'Light emitting diode display with PCB base'
[patent_app_type] => 1
[patent_app_number] => 7/604072
[patent_app_country] => US
[patent_app_date] => 1990-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 760
[patent_no_of_claims] => 1
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 184
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/119/05119174.pdf
[firstpage_image] =>[orig_patent_app_number] => 604072
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/604072 | Light emitting diode display with PCB base | Oct 25, 1990 | Issued |
Array
(
[id] => 2812091
[patent_doc_number] => 05146314
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-09-08
[patent_title] => 'Apparatus for semiconductor circuit chip cooling using a diamond layer'
[patent_app_type] => 1
[patent_app_number] => 7/602022
[patent_app_country] => US
[patent_app_date] => 1990-10-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 16
[patent_no_of_words] => 3910
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/146/05146314.pdf
[firstpage_image] =>[orig_patent_app_number] => 602022
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/602022 | Apparatus for semiconductor circuit chip cooling using a diamond layer | Oct 22, 1990 | Issued |