Application number | Title of the application | Filing Date | Status |
---|
Array
(
[id] => 2855392
[patent_doc_number] => 05107330
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-04-21
[patent_title] => 'Self-adjusting heat sink design for VLSI packages'
[patent_app_type] => 1
[patent_app_number] => 7/599948
[patent_app_country] => US
[patent_app_date] => 1990-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2374
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 245
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/107/05107330.pdf
[firstpage_image] =>[orig_patent_app_number] => 599948
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/599948 | Self-adjusting heat sink design for VLSI packages | Oct 18, 1990 | Issued |
Array
(
[id] => 2859439
[patent_doc_number] => 05134463
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-07-28
[patent_title] => 'Stress relief layer providing high thermal conduction for a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/595408
[patent_app_country] => US
[patent_app_date] => 1990-10-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 4001
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 178
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/134/05134463.pdf
[firstpage_image] =>[orig_patent_app_number] => 595408
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/595408 | Stress relief layer providing high thermal conduction for a semiconductor device | Oct 10, 1990 | Issued |
Array
(
[id] => 2867903
[patent_doc_number] => 05166774
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-11-24
[patent_title] => 'Selectively releasing conductive runner and substrate assembly having non-planar areas'
[patent_app_type] => 1
[patent_app_number] => 7/593410
[patent_app_country] => US
[patent_app_date] => 1990-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 14
[patent_no_of_words] => 2437
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/166/05166774.pdf
[firstpage_image] =>[orig_patent_app_number] => 593410
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/593410 | Selectively releasing conductive runner and substrate assembly having non-planar areas | Oct 4, 1990 | Issued |
Array
(
[id] => 2794111
[patent_doc_number] => 05130781
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-07-14
[patent_title] => 'Dam for lead encapsulation'
[patent_app_type] => 1
[patent_app_number] => 7/593374
[patent_app_country] => US
[patent_app_date] => 1990-10-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 3579
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/130/05130781.pdf
[firstpage_image] =>[orig_patent_app_number] => 593374
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/593374 | Dam for lead encapsulation | Sep 30, 1990 | Issued |
Array
(
[id] => 3092871
[patent_doc_number] => 05278445
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-01-11
[patent_title] => 'Semiconductor device card having a plurality of self-locking pawls'
[patent_app_type] => 1
[patent_app_number] => 7/588158
[patent_app_country] => US
[patent_app_date] => 1990-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 8
[patent_no_of_words] => 1785
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 188
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/278/05278445.pdf
[firstpage_image] =>[orig_patent_app_number] => 588158
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/588158 | Semiconductor device card having a plurality of self-locking pawls | Sep 25, 1990 | Issued |
Array
(
[id] => 2851468
[patent_doc_number] => 05138437
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-08-11
[patent_title] => 'Semiconductor integrated circuit device in which integrated circuit units having different functions are stacked in three dimensional manner'
[patent_app_type] => 1
[patent_app_number] => 7/587501
[patent_app_country] => US
[patent_app_date] => 1990-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 2401
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/138/05138437.pdf
[firstpage_image] =>[orig_patent_app_number] => 587501
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/587501 | Semiconductor integrated circuit device in which integrated circuit units having different functions are stacked in three dimensional manner | Sep 23, 1990 | Issued |
Array
(
[id] => 2946455
[patent_doc_number] => 05223739
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-06-29
[patent_title] => 'Plastic molded semiconductor device having waterproof cap'
[patent_app_type] => 1
[patent_app_number] => 7/581700
[patent_app_country] => US
[patent_app_date] => 1990-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 17
[patent_no_of_words] => 5149
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/223/05223739.pdf
[firstpage_image] =>[orig_patent_app_number] => 581700
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/581700 | Plastic molded semiconductor device having waterproof cap | Sep 12, 1990 | Issued |
Array
(
[id] => 2840030
[patent_doc_number] => 05133452
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-07-28
[patent_title] => 'IC package storage container'
[patent_app_type] => 1
[patent_app_number] => 7/580842
[patent_app_country] => US
[patent_app_date] => 1990-09-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 2076
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 202
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/133/05133452.pdf
[firstpage_image] =>[orig_patent_app_number] => 580842
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/580842 | IC package storage container | Sep 10, 1990 | Issued |
07/579143 | PAD OXIDE PROTECT SEALED INTERFACE ISOLATION PROCESS | Sep 6, 1990 | Abandoned |
Array
(
[id] => 2942355
[patent_doc_number] => 05260601
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-11-09
[patent_title] => 'Edge-mounted, surface-mount package for semiconductor integrated circuit devices'
[patent_app_type] => 1
[patent_app_number] => 7/578058
[patent_app_country] => US
[patent_app_date] => 1990-09-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 1930
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/260/05260601.pdf
[firstpage_image] =>[orig_patent_app_number] => 578058
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/578058 | Edge-mounted, surface-mount package for semiconductor integrated circuit devices | Sep 4, 1990 | Issued |
Array
(
[id] => 2722596
[patent_doc_number] => 05053856
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-01
[patent_title] => 'Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices'
[patent_app_type] => 1
[patent_app_number] => 7/577432
[patent_app_country] => US
[patent_app_date] => 1990-09-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 3676
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 117
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/053/05053856.pdf
[firstpage_image] =>[orig_patent_app_number] => 577432
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/577432 | Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices | Sep 3, 1990 | Issued |
Array
(
[id] => 2767470
[patent_doc_number] => 05060052
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-22
[patent_title] => 'TAB bonded semiconductor device having off-chip power and ground distribution'
[patent_app_type] => 1
[patent_app_number] => 7/577234
[patent_app_country] => US
[patent_app_date] => 1990-09-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 9
[patent_no_of_words] => 3048
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/060/05060052.pdf
[firstpage_image] =>[orig_patent_app_number] => 577234
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/577234 | TAB bonded semiconductor device having off-chip power and ground distribution | Sep 3, 1990 | Issued |
07/575744 | DEVICE PACKAGING USING HEAT SPREADERS AND ASSISTED DEPOSITION OF WIRE BONDS | Aug 30, 1990 | Abandoned |
Array
(
[id] => 2767429
[patent_doc_number] => 05060050
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-22
[patent_title] => 'Semiconductor integrated circuit device'
[patent_app_type] => 1
[patent_app_number] => 7/577093
[patent_app_country] => US
[patent_app_date] => 1990-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2833
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 111
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/060/05060050.pdf
[firstpage_image] =>[orig_patent_app_number] => 577093
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/577093 | Semiconductor integrated circuit device | Aug 30, 1990 | Issued |
Array
(
[id] => 2851319
[patent_doc_number] => 05138429
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-08-11
[patent_title] => 'Precisely aligned lead frame using registration traces and pads'
[patent_app_type] => 1
[patent_app_number] => 7/575099
[patent_app_country] => US
[patent_app_date] => 1990-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 3
[patent_no_of_words] => 2957
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 129
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/138/05138429.pdf
[firstpage_image] =>[orig_patent_app_number] => 575099
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/575099 | Precisely aligned lead frame using registration traces and pads | Aug 29, 1990 | Issued |
07/571264 | ELECTRONIC DEVICE AND MANUFACTURING METHOD FOR THE SAME | Aug 22, 1990 | Abandoned |
Array
(
[id] => 2781376
[patent_doc_number] => 05075761
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-12-24
[patent_title] => 'Local interconnect for integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 7/567270
[patent_app_country] => US
[patent_app_date] => 1990-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 1563
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/075/05075761.pdf
[firstpage_image] =>[orig_patent_app_number] => 567270
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/567270 | Local interconnect for integrated circuits | Aug 13, 1990 | Issued |
Array
(
[id] => 2715658
[patent_doc_number] => 05061988
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-29
[patent_title] => 'Integrated circuit chip interconnect'
[patent_app_type] => 1
[patent_app_number] => 7/559668
[patent_app_country] => US
[patent_app_date] => 1990-07-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 15
[patent_no_of_words] => 2915
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 179
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/061/05061988.pdf
[firstpage_image] =>[orig_patent_app_number] => 559668
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/559668 | Integrated circuit chip interconnect | Jul 29, 1990 | Issued |
Array
(
[id] => 2859569
[patent_doc_number] => 05089876
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-02-18
[patent_title] => 'Semiconductor IC device containing a conductive plate'
[patent_app_type] => 1
[patent_app_number] => 7/554652
[patent_app_country] => US
[patent_app_date] => 1990-07-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 1361
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 193
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/089/05089876.pdf
[firstpage_image] =>[orig_patent_app_number] => 554652
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/554652 | Semiconductor IC device containing a conductive plate | Jul 18, 1990 | Issued |
Array
(
[id] => 2855335
[patent_doc_number] => 05107327
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-04-21
[patent_title] => 'Photosemiconductor device and epoxy resin composition for use in molding photosemiconductor'
[patent_app_type] => 1
[patent_app_number] => 7/553284
[patent_app_country] => US
[patent_app_date] => 1990-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 13
[patent_no_of_words] => 6842
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 219
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/107/05107327.pdf
[firstpage_image] =>[orig_patent_app_number] => 553284
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/553284 | Photosemiconductor device and epoxy resin composition for use in molding photosemiconductor | Jul 16, 1990 | Issued |