Ha Dinh Ho
Examiner (ID: 9897)
Most Active Art Unit | 3681 |
Art Unit(s) | 3658, 3655, 3681, 3618 |
Total Applications | 2226 |
Issued Applications | 1927 |
Pending Applications | 80 |
Abandoned Applications | 198 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 2757220
[patent_doc_number] => 05021868
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-06-04
[patent_title] => 'IC carrier'
[patent_app_type] => 1
[patent_app_number] => 7/501134
[patent_app_country] => US
[patent_app_date] => 1990-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 18
[patent_no_of_words] => 2562
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 180
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/021/05021868.pdf
[firstpage_image] =>[orig_patent_app_number] => 501134
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/501134 | IC carrier | Mar 28, 1990 | Issued |
Array
(
[id] => 2729418
[patent_doc_number] => 05025307
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-06-18
[patent_title] => 'Modular semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/501276
[patent_app_country] => US
[patent_app_date] => 1990-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 32
[patent_no_of_words] => 3686
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/025/05025307.pdf
[firstpage_image] =>[orig_patent_app_number] => 501276
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/501276 | Modular semiconductor device | Mar 28, 1990 | Issued |
Array
(
[id] => 2676328
[patent_doc_number] => 04999699
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-03-12
[patent_title] => 'Solder interconnection structure and process for making'
[patent_app_type] => 1
[patent_app_number] => 7/493126
[patent_app_country] => US
[patent_app_date] => 1990-03-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 4048
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 161
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/999/04999699.pdf
[firstpage_image] =>[orig_patent_app_number] => 493126
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/493126 | Solder interconnection structure and process for making | Mar 13, 1990 | Issued |
Array
(
[id] => 2773762
[patent_doc_number] => 05006919
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-09
[patent_title] => 'Integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 7/487600
[patent_app_country] => US
[patent_app_date] => 1990-03-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2284
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 227
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/006/05006919.pdf
[firstpage_image] =>[orig_patent_app_number] => 487600
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/487600 | Integrated circuit package | Feb 28, 1990 | Issued |
Array
(
[id] => 2752319
[patent_doc_number] => 04987478
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-01-22
[patent_title] => 'Micro individual integrated circuit package'
[patent_app_type] => 1
[patent_app_number] => 7/481252
[patent_app_country] => US
[patent_app_date] => 1990-02-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 1597
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 196
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/987/04987478.pdf
[firstpage_image] =>[orig_patent_app_number] => 481252
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/481252 | Micro individual integrated circuit package | Feb 19, 1990 | Issued |
Array
(
[id] => 2703411
[patent_doc_number] => 04991002
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-02-05
[patent_title] => 'Modular power device assembly'
[patent_app_type] => 1
[patent_app_number] => 7/479924
[patent_app_country] => US
[patent_app_date] => 1990-02-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 10
[patent_no_of_words] => 4714
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 151
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/991/04991002.pdf
[firstpage_image] =>[orig_patent_app_number] => 479924
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/479924 | Modular power device assembly | Feb 13, 1990 | Issued |
Array
(
[id] => 2715752
[patent_doc_number] => 05055914
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-08
[patent_title] => 'Ceramic package type semiconductor device and method of assembling the same'
[patent_app_type] => 1
[patent_app_number] => 7/477404
[patent_app_country] => US
[patent_app_date] => 1990-02-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 15
[patent_no_of_words] => 6305
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 184
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/055/05055914.pdf
[firstpage_image] =>[orig_patent_app_number] => 477404
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/477404 | Ceramic package type semiconductor device and method of assembling the same | Feb 8, 1990 | Issued |
Array
(
[id] => 2675065
[patent_doc_number] => 05070388
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-12-03
[patent_title] => 'Trench-resident interconnect structure'
[patent_app_type] => 1
[patent_app_number] => 7/467590
[patent_app_country] => US
[patent_app_date] => 1990-01-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 2681
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 91
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/070/05070388.pdf
[firstpage_image] =>[orig_patent_app_number] => 467590
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/467590 | Trench-resident interconnect structure | Jan 18, 1990 | Issued |
Array
(
[id] => 2868017
[patent_doc_number] => 05083194
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-01-21
[patent_title] => 'Air jet impingement on miniature pin-fin heat sinks for cooling electronic components'
[patent_app_type] => 1
[patent_app_number] => 7/465042
[patent_app_country] => US
[patent_app_date] => 1990-01-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 4
[patent_no_of_words] => 1777
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/083/05083194.pdf
[firstpage_image] =>[orig_patent_app_number] => 465042
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/465042 | Air jet impingement on miniature pin-fin heat sinks for cooling electronic components | Jan 15, 1990 | Issued |
Array
(
[id] => 2680125
[patent_doc_number] => 05027189
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-06-25
[patent_title] => 'Integrated circuit solder die-attach design and method'
[patent_app_type] => 1
[patent_app_number] => 7/463186
[patent_app_country] => US
[patent_app_date] => 1990-01-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 2989
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 149
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/027/05027189.pdf
[firstpage_image] =>[orig_patent_app_number] => 463186
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/463186 | Integrated circuit solder die-attach design and method | Jan 9, 1990 | Issued |
Array
(
[id] => 2755532
[patent_doc_number] => 05038198
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-08-06
[patent_title] => 'Modular semiconductor power device'
[patent_app_type] => 1
[patent_app_number] => 7/462544
[patent_app_country] => US
[patent_app_date] => 1990-01-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 13
[patent_no_of_words] => 2334
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/038/05038198.pdf
[firstpage_image] =>[orig_patent_app_number] => 462544
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/462544 | Modular semiconductor power device | Jan 8, 1990 | Issued |
Array
(
[id] => 2810349
[patent_doc_number] => 05124783
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-06-23
[patent_title] => 'Semiconductor device having insulating substrate adhered to conductive substrate'
[patent_app_type] => 1
[patent_app_number] => 7/460630
[patent_app_country] => US
[patent_app_date] => 1990-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 1469
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/124/05124783.pdf
[firstpage_image] =>[orig_patent_app_number] => 460630
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/460630 | Semiconductor device having insulating substrate adhered to conductive substrate | Jan 2, 1990 | Issued |
Array
(
[id] => 2717661
[patent_doc_number] => 05018005
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-05-21
[patent_title] => 'Thin, molded, surface mount electronic device'
[patent_app_type] => 1
[patent_app_number] => 7/457648
[patent_app_country] => US
[patent_app_date] => 1989-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 4150
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 172
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/018/05018005.pdf
[firstpage_image] =>[orig_patent_app_number] => 457648
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/457648 | Thin, molded, surface mount electronic device | Dec 26, 1989 | Issued |
Array
(
[id] => 2750624
[patent_doc_number] => 05028988
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-07-02
[patent_title] => 'Method and apparatus for low temperature integrated circuit chip testing and operation'
[patent_app_type] => 1
[patent_app_number] => 7/457641
[patent_app_country] => US
[patent_app_date] => 1989-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2385
[patent_no_of_claims] => 31
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 66
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/028/05028988.pdf
[firstpage_image] =>[orig_patent_app_number] => 457641
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/457641 | Method and apparatus for low temperature integrated circuit chip testing and operation | Dec 26, 1989 | Issued |
Array
(
[id] => 2675154
[patent_doc_number] => 05070393
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-12-03
[patent_title] => 'Aluminum nitride substrate for formation of thin-film conductor layer and semiconductor device using the substrate'
[patent_app_type] => 1
[patent_app_number] => 7/454903
[patent_app_country] => US
[patent_app_date] => 1989-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 4020
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/070/05070393.pdf
[firstpage_image] =>[orig_patent_app_number] => 454903
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/454903 | Aluminum nitride substrate for formation of thin-film conductor layer and semiconductor device using the substrate | Dec 21, 1989 | Issued |
07/455230 | CERAMIC PACKAGE FOR MEMORY SEMICONDUCTOR | Dec 21, 1989 | Abandoned |
Array
(
[id] => 2771320
[patent_doc_number] => 04994903
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-02-19
[patent_title] => 'Circuit substrate and circuit using the substrate'
[patent_app_type] => 1
[patent_app_number] => 7/452183
[patent_app_country] => US
[patent_app_date] => 1989-12-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 2216
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 298
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/994/04994903.pdf
[firstpage_image] =>[orig_patent_app_number] => 452183
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/452183 | Circuit substrate and circuit using the substrate | Dec 17, 1989 | Issued |
Array
(
[id] => 2649934
[patent_doc_number] => 04939569
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-07-03
[patent_title] => 'Ultraviolet transmitting glasses for EPROM windows'
[patent_app_type] => 1
[patent_app_number] => 7/448309
[patent_app_country] => US
[patent_app_date] => 1989-12-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 2449
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 181
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/939/04939569.pdf
[firstpage_image] =>[orig_patent_app_number] => 448309
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/448309 | Ultraviolet transmitting glasses for EPROM windows | Dec 10, 1989 | Issued |
Array
(
[id] => 2677713
[patent_doc_number] => 05034802
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-07-23
[patent_title] => 'Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates'
[patent_app_type] => 1
[patent_app_number] => 7/448495
[patent_app_country] => US
[patent_app_date] => 1989-12-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 2802
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/034/05034802.pdf
[firstpage_image] =>[orig_patent_app_number] => 448495
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/448495 | Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates | Dec 10, 1989 | Issued |
07/448360 | SEMICONDUCTOR DEVICE | Dec 10, 1989 | Abandoned |